公开(公告)号：US08022514B2

公开(公告)日：2011-09-20

申请号：US12410463

申请日：2009-03-25

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/49579 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81141 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151

摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.

摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。

公开(公告)号：US20120018866A1

公开(公告)日：2012-01-26

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US20100289128A1

公开(公告)日：2010-11-18

申请号：US12467146

申请日：2009-05-15

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Arnel Senosa Trasporto

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Arnel Senosa Trasporto

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L23/49531 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: conductively bonding a first surface of a transposer to an inner end of a lead separate from the transposer; conductively bonding a die to the first surface of the transposer; and encapsulating the inner end with a mold compound having a bottom mold surface that is exposed and is coplanar with a surface of the transposer opposite the first surface.

摘要翻译： 集成电路封装系统的制造方法包括：将转移器的第一表面导电地接合到与转移器分离的引线的内端; 导电地将模具结合到转台的第一表面; 并且用模具化合物封装内端，所述模具化合物具有暴露的底模表面，并且与转置体的与第一表面相对的表面共面。

公开(公告)号：US07977779B2

公开(公告)日：2011-07-12

申请号：US12136768

申请日：2008-06-10

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/50

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83411 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/85001 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mountable integrated circuit package-in-package system includes: providing an interface integrated circuit package system with a terminal having a plated bumped portion of an inner encapsulation; mounting the interface integrated circuit package system over a package carrier with the terminal facing away from the package carrier; connecting the package carrier and a pad extension of the terminal; and forming a package encapsulation over the interface integrated circuit package system with the terminal exposed.

摘要翻译： 一种可安装的集成电路封装包装系统，包括：提供具有内部封装的镀覆凸起部分的端子的接口集成电路封装系统; 将接口集成电路封装系统安装在封装载体上，端子背离封装载体; 连接封装载体和端子的焊盘延伸部; 并在接口集成电路封装系统上形成封装封装，端子暴露。

公开(公告)号：US20110068458A1

公开(公告)日：2011-03-24

申请号：US12565144

申请日：2009-09-23

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49575 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first device having a first exposed side and a first inward side; connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device; connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal; and applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant, the exposed foot on an end of the system connector opposite the first device.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有第一暴露侧和第一内侧的第一器件; 将具有第二暴露侧和面向所述第一内侧的第二内侧的第二装置连接到所述第一装置，所述第二装置具有小于所述第一装置的平面尺寸的平面尺寸; 将系统连接器连接到第一内侧的周边，系统连接器具有部分垂直的暴露的腿和暴露的脚部分水平; 以及施加暴露所述第一暴露侧，所述第二暴露侧，所述暴露腿和所述暴露的脚的密封剂，暴露的腿偏离所述密封剂，所述暴露的脚在所述系统连接器的与所述第一装置相对的端部上。

公开(公告)号：US20100308467A1

公开(公告)日：2010-12-09

申请号：US12858593

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L23/538 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

公开(公告)号：US08729693B2

公开(公告)日：2014-05-20

申请号：US12565144

申请日：2009-09-23

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49575 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first device having a first exposed side and a first inward side; connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device; connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal; and applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant, the exposed foot on an end of the system connector opposite the first device.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有第一暴露侧和第一内侧的第一器件; 将具有第二暴露侧和面向所述第一内侧的第二内侧的第二装置连接到所述第一装置，所述第二装置具有小于所述第一装置的平面尺寸的平面尺寸; 将系统连接器连接到第一内侧的周边，系统连接器具有部分垂直的暴露的腿和暴露的脚部分水平; 以及施加暴露所述第一暴露侧，所述第二暴露侧，所述暴露腿和所述暴露的脚的密封剂，暴露的腿偏离所述密封剂，所述暴露的脚在所述系统连接器的与所述第一装置相对的端部上。

公开(公告)号：US20100311206A1

公开(公告)日：2010-12-09

申请号：US12858615

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L21/50 ,  H01L21/78 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

摘要翻译： 半导体晶片包含多个半导体管芯。 切割半导体晶片以分离半导体管芯。 将半导体管芯转移到载体上。 在载体上的半导体管芯的周围形成管芯延伸区域。 载体被移除。 在管芯延伸区域中的第一和第二偏移行中形成多个通孔通孔（THV）。 导电材料沉积在THV中。 第一RDL形成在半导体管芯上的接触焊盘和THV之间。 第二RDL形成在与THV电接触的半导体管芯的背面上。 形成与第二RDL电接触的凸块下金属化。 在凸块下方形成焊料凸块。 单芯片延伸区域以分离半导体管芯。

公开(公告)号：US07790576B2

公开(公告)日：2010-09-07

申请号：US11947377

申请日：2007-11-29

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L21/30

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

摘要翻译： 半导体晶片包含多个半导体管芯。 切割半导体晶片以分离半导体管芯。 将半导体管芯转移到载体上。 在载体上的半导体管芯的周围形成管芯延伸区域。 载体被移除。 在管芯延伸区域中的第一和第二偏移行中形成多个通孔通孔（THV）。 导电材料沉积在THV中。 第一RDL形成在半导体管芯上的接触焊盘和THV之间。 第二RDL形成在与THV电接触的半导体管芯的背面上。 形成与第二RDL电接触的凸块下金属化。 在凸块下方形成焊料凸块。 单芯片延伸区域以分离半导体管芯。

公开(公告)号：US08592252B2

公开(公告)日：2013-11-26

申请号：US12858593

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L21/50 ,  H01L21/78

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.