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公开(公告)号：US20240329240A1
公开(公告)日：2024-10-03
申请号：US18617568
申请日：2024-03-26
申请人： ROHM CO., LTD.
IPC分类号： G01S15/08 , G01S15/931
CPC分类号： G01S15/08 , G01S15/931
摘要： The present disclosure provides a signal processing device. The signal processing device includes: a transmission signal generation unit, configured to generate a transmission signal for a transmitted wave of sound wave; a reception signal output unit, configured to output a received signal based on a received wave of sound wave; and a reflected wave detection unit. The reflected wave detection unit is configured to detect a first reflected wave of the transmitted wave that may be included in the received wave based on a first timing when an envelope detection signal, which is a signal obtained by envelope detection of an absolute value of the received signal during a reverberation period in which a reverberation of the transmitted wave remains, is lower than a first threshold value.
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公开(公告)号：US20240327198A1
公开(公告)日：2024-10-03
申请号：US18619807
申请日：2024-03-28
申请人： ROHM CO., LTD.
IPC分类号： B81B3/00 , G01P15/125
CPC分类号： B81B3/0027 , G01P15/125 , B81B2201/0235 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81B2203/051
摘要： An acceleration detection device includes: a substrate including cavity; an anchor mechanically connected to the substrate inside the cavity; a spring mechanically connected to the anchor; a mass mechanically connected to the spring; a first movable electrode mechanically connected to and electrically insulated from the mass; a first fixed electrode mechanically connected to and electrically insulated from the substrate; a pair of second movable electrodes facing each other by being mechanically connected to and electrically insulated from the mass; and a second fixed electrode mechanically connected to and electrically insulated from the substrate to be interposed between the pair of second movable electrodes, the second fixed electrode generating an electrostatic force between the pair of second movable electrodes and the second fixed electrode when a voltage is applied to each of the pair of second movable electrodes and the second fixed electrode.
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23.发明授权公开(公告)号：US12106893B2
公开(公告)日：2024-10-01
申请号：US17438868
申请日：2020-03-12
申请人： ROHM CO., LTD.
CPC分类号： H01F41/041 , H01F5/003 , H01F5/06 , H01F41/127 , H04N23/54
摘要： A coil module includes a conductor layer, at least one element, and a sealing resin. The conductor layer is formed along a predetermined plane and includes a wiring portion and a helical-shaped coil portion. The at least one element is mounted on the wiring portion. The sealing resin covers the conductor layer and the at least one element. The sealing resin is integrally formed of a single type of resin material and has a predetermined thickness in a first direction perpendicular to the plane.
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公开(公告)号：US20240322816A1
公开(公告)日：2024-09-26
申请号：US18673151
申请日：2024-05-23
申请人： Rohm Co., Ltd.
IPC分类号： H03K17/18 , H02P29/024
CPC分类号： H03K17/18 , H02P29/0241
摘要： A signal transmission device that transmits a driving signal for a power transistor from a primary circuit system to a secondary circuit system while isolating between the primary and secondary circuit systems includes: a first fault detection circuit configured to detect a fault in the primary circuit system; a second fault detection circuit configured to detect a fault in the secondary circuit system; a first signal transmission path configured to transmit the result of detection by the second fault detection circuit from the secondary circuit system to the primary circuit system while isolating between the primary and secondary circuit systems; and a self-test circuit configured to perform a self-test on each of the first fault detection circuit, the second fault detection circuit, and the first signal transmission path.
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25.发明公开公开(公告)号：US20240322690A1
公开(公告)日：2024-09-26
申请号：US18731904
申请日：2024-06-03
申请人： Rohm Co., Ltd.
发明人： Genki Tsuruyama , Isao Takobe , Keita Itohara
CPC分类号： H02M3/158 , B60R16/03 , H02J7/0063 , H02J2207/20
摘要： In the switching power supply device, a controller has a first state in which it keeps a first switch on and a second switch off, a second state in which it keeps the first switch off and the second switch on, a third state in which it keeps the first and second switches off, and a fourth state in which it keeps a voltage at a connection node between the first and second switches lower than in the third state. The controller has a first mode in which the controller repeats the first to fourth states at a first cycle, and a second mode in which the controller repeats the first to fourth states at a second cycle longer than the first cycle.
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公开(公告)号：US20240321970A1
公开(公告)日：2024-09-26
申请号：US18734613
申请日：2024-06-05
申请人： ROHM CO., LTD.
发明人： Takuji MAEKAWA , Mitsuru MORIMOTO
IPC分类号： H01L29/16 , H01L21/02 , H01L29/04 , H01L29/739 , H01L29/78 , H01L29/872
CPC分类号： H01L29/1608 , H01L21/02378 , H01L21/02433 , H01L21/02516 , H01L21/02529 , H01L21/02595 , H01L29/045 , H01L29/7395 , H01L29/7802 , H01L29/7813 , H01L29/872
摘要： A semiconductor substrate includes a drift layer of a first layer formed of a single crystal SiC semiconductor and a buffer layer and a substrate layer of a second layer that is formed of a SiC semiconductor which includes a polycrystalline structure and is formed on the surface of the first layer, in which the second layer (12) is formed on the surface of the drift layer of the first layer by means of CVD growth, the drift layer of the first layer is formed by means of epitaxial growth, and accordingly, defects occurring at a junction interface of the semiconductor substrate including the single crystal SiC layer and the polycrystal SiC layer are suppressed, and manufacturing costs are also reduced.
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公开(公告)号：US20240321693A1
公开(公告)日：2024-09-26
申请号：US18734627
申请日：2024-06-05
申请人： ROHM CO., LTD.
发明人： Tomohiro YASUNISHI
CPC分类号： H01L23/49 , H01L23/3107 , H01L24/40 , H01L25/072 , H01L2224/40137
摘要： A semiconductor device includes a supporting substrate, a plurality of first semiconductor elements, a plurality of second semiconductor elements, a first terminal, a first conductive member, and a second conductive member. The supporting substrate includes a first conductive part and a second conductive part. The plurality of first semiconductor elements are mounted on the first conductive part and each have a switching function. The plurality of second semiconductor elements are mounted on the second conductive part and each have a switching function. The first terminal protrudes to the first side in the first direction from the first conductive part. The first conductive member electrically connects the plurality of first semiconductor elements and the second conductive part. The second conductive member electrically connects the plurality of second semiconductor elements and the first terminal. The second conductive member is connected to the supporting substrate.
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公开(公告)号：US20240319752A1
公开(公告)日：2024-09-26
申请号：US18610515
申请日：2024-03-20
申请人： ROHM CO., LTD.
发明人： Takashige MIYASHITA
IPC分类号： G05F1/56
CPC分类号： G05F1/561
摘要： The present disclosure provides a linear power circuit. The linear power circuit includes an input unit, a current-voltage converter, a voltage-current converter and an output unit. The input unit is configured to receive an input signal and output a first current signal. The current-voltage converter is configured to convert the first current signal into a first voltage signal. The voltage-current converter is configured to convert the first voltage signal into a second current signal. The output unit is configured to generate an output current signal from the second current signal using a current mirror circuit and output the output current signal to an output terminal. The input unit and the current-voltage converter constitute a current feedback operational amplifier.
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公开(公告)号：USD1043594S1
公开(公告)日：2024-09-24
申请号：US29874879
申请日：2023-04-26
申请人： ROHM CO., LTD.
摘要： FIG. 1 is a perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. Only the shaded areas denoted by the dash- dotted lines and the solid lines are claimed.-
公开(公告)号：US12101917B2
公开(公告)日：2024-09-24
申请号：US17970498
申请日：2022-10-20
CPC分类号： H05K7/20927 , B60L50/51 , H02M7/003 , H02M7/537 , B60L2210/40 , B60L2220/50
摘要： In a vehicle drive unit, a motor and an inverter are disposed adjacent in an axial direction of the motor. A smoothing capacitor and each power module are connected by a busbar. Each power module has a flat shape having a wide width, and has a first cooling surface facing the motor. The first cooling surface of each power module is placed on a placement surface orthogonal to the axial direction. The plate-shaped busbar has a second cooling surface facing the motor. The busbar is connected to the smoothing capacitor and each power module, and is formed with a wide width so as to extend along a direction in which each power module is disposed side by side. The second cooling surface is placed on the placement surface. A cooling portion facing the first and second cooling surfaces is provided closer to the motor than the placement surface.
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