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公开(公告)号：US20140261571A1
公开(公告)日：2014-09-18
申请号：US14156848
申请日：2014-01-16
申请人： SOKUDO CO., LTD.
IPC分类号： B08B3/08
CPC分类号： H01L21/67051 , H01L21/67028
摘要： Provided is a substrate cleaning and drying method, including a cleaning step of cleaning a developed substrate by supplying a cleaning liquid to the substrate; a puddle-forming step of forming a puddle of the cleaning liquid on the substrate; a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing removal of the cleaning liquid on the substrate.
摘要翻译： 提供了一种基板清洗和干燥方法，包括通过向基板供给清洗液来清洗显影基板的清洗步骤; 在所述基板上形成所述清洗液的水坑的水坑形成工序; 减薄基板上的清洗液的膜厚的薄膜变薄步骤; 以及干燥步骤，通过旋转衬底并在外部气流和衬底之间产生向外的气流和向外的气流来干燥衬底，所述向外的气流覆盖衬底上方的一部分以及向内的气流，从而去除衬底上的清洁液体。
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公开(公告)号：US20140199638A1
公开(公告)日：2014-07-17
申请号：US14142048
申请日：2013-12-27
申请人： SOKUDO CO., LTD.
IPC分类号： G03F7/40
CPC分类号： G03F7/40 , G03F7/3021 , G03F7/325 , H01L21/6715
摘要： After a developing step, a substrate is spun at high speeds without supplying a cleaning liquid to a surface of the substrate. This causes a large centrifugal force to act on a developer on a resist film. Consequently, the developer can be removed rapidly from the surface of the substrate. As a result, development can be stopped at an expected timing. Moreover, a circuit pattern having an expected dimension can be obtained. At this time, a dissolved product is also removable with the developer from the substrate. This can avoid failure in development caused by the dissolved product. Consequently, suitably maintained quality of negative development can be achieved with a reduced usage amount of the cleaning liquid.
摘要翻译： 在显影步骤之后，基板以高速旋转，而不向基板的表面提供清洁液体。 这导致大的离心力作用在抗蚀剂膜上的显影剂上。 因此，可以从基板的表面迅速去除显影剂。 因此，可以在预期的时机停止开发。 此外，可以获得具有预期尺寸的电路图案。 此时，溶解的产物也可与显影剂从基底中去除。 这可以避免溶解产物引起的开发失败。 因此，通过减少清洗液的使用量，可以实现适当保持的显影质量。
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23.发明授权公开(公告)号：US08781308B2
公开(公告)日：2014-07-15
申请号：US13239517
申请日：2011-09-22
申请人： Masahiko Harumoto
发明人： Masahiko Harumoto
CPC分类号： F27B17/0025
摘要： The back surface of a substrate having a front surface coated with a resist film is irradiated with flashes of light emitted from flash lamps. Heat conduction from the back surface of the substrate abruptly raised in temperature by the irradiation with flashes of light toward the front surface thereof occurs to heat the resist film formed on the front surface of the substrate, so that a post-applied bake process is performed. After the completion of the post-applied bake process, a cooling plate cools down the substrate. Regardless of the type of resist film formed on the front surface of the substrate, the substrate has a constant absorptance of flashes of light to allow the resist film to be heated to a constant treatment temperature, because the back surface of the substrate is irradiated with flashes of light.
摘要翻译： 用闪光灯发出的闪光灯照射具有涂覆有抗蚀剂膜的正面的基板的背面。 通过用闪光灯照射到其前表面，从衬底的背面突然升高的热传导发生在衬底前表面上形成的抗蚀膜，从而进行后施加烘烤处理 。 在完成后施加烘烤过程之后，冷却板冷却衬底。 不管形成在基板的前表面上的抗蚀剂膜的种类如何，基板具有恒定的闪光吸收率，从而允许将抗蚀剂膜加热到恒定的处理温度，因为基板的背面被照射 闪烁的光芒
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公开(公告)号：US08635968B2
公开(公告)日：2014-01-28
申请号：US13019711
申请日：2011-02-02
申请人： Koji Kaneyama
发明人： Koji Kaneyama
CPC分类号： G03F7/70975 , G03B27/58 , G03F7/70741 , H01L21/67046 , H01L21/67051 , H01L21/67745 , H01L21/68707 , Y10S134/902
摘要： A substrate subjected to back surface cleaning by a back surface cleaning processing unit is held by a hand of an interface transport mechanism and transported to a cooling unit. The substrate whose temperature has been adjusted by the cooling unit is held by a hand of the interface transport mechanism and transported to an exposure device. The substrate subjected to exposure processing by the exposure device is held by a hand of the interface transport mechanism and transported from the exposure device to a substrate platform.
摘要翻译： 通过背面清洁处理单元进行后表面清洁的基板由界面输送机构的手保持并被输送到冷却单元。 温度由冷却单元调节的基板由界面输送机构的手保持并被输送到曝光装置。 通过曝光装置进行曝光处理的基板由界面输送机构的手保持并从曝光装置传送到基板平台。
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公开(公告)号：US08585830B2
公开(公告)日：2013-11-19
申请号：US12698870
申请日：2010-02-02
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
CPC分类号： G03F7/70991 , G03F7/70341
摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.
摘要翻译： 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：通过所述第一处理在基板上形成由感光材料制成的感光膜 所述曝光装置进行曝光处理之前的单元。 该方法还包括在由所述第一处理单元形成所述感光膜之后并且在所述曝光装置进行曝光处理之前，通过所述第二处理单元对所述基板进行洗涤处理，并将所述基板在所述清洗处理之后传送到所述曝光装置。 所述方法还包括从所述曝光装置运送所述基板并将所述第三处理单元的显影处理应用于由所述曝光装置进行曝光处理之后运送的所述基板。
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公开(公告)号：US08545118B2
公开(公告)日：2013-10-01
申请号：US12324794
申请日：2008-11-26
申请人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
发明人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC分类号： G03D5/00
CPC分类号： B05C13/00 , H01L21/67196 , H01L21/67201 , H01L21/67225
摘要： The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
摘要翻译： 本发明提供涂覆单元，热处理单元和用于将基底输送到这些处理单元中的每一个的第一主输送机构。 基板通过接收器从第一主输送机构传送到第二主输送机构。 当基板不能放置在接收器上时，将该基板放置在缓冲器上。 因此，第一主输送机构可以继续输送其它基板。 处理单元中的其它基材在处理单元之间没有延迟地输送，以接收包括涂覆处理和热处理的一系列处理。 这防止了在基板上形成膜的处理质量的降低。
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公开(公告)号：US20120055916A1
公开(公告)日：2012-03-08
申请号：US13036915
申请日：2011-02-28
申请人： Leon Volfovski , Harald Herchen , Jay D. Pinson
发明人： Leon Volfovski , Harald Herchen , Jay D. Pinson
CPC分类号： H05B3/68
摘要： A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.
摘要翻译： 快速温度变化（RTC）系统包括包括散热器的烘烤板组件; 联接到散热器的加热器基板; 以及耦合到所述加热器基板的加热器层。 RTC系统还包括邻近烘烤板组件定位的被动冷却结构。 被动冷却结构可移动以与加热器层物理接触。 被动冷却结构包括冷却板和耦合到冷却板的散热垫。 RTC系统还包括邻近被动冷却结构定位的主动冷却结构。 被动冷却结构可移动以与主动冷却结构物理接触。
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公开(公告)号：US08122851B2
公开(公告)日：2012-02-28
申请号：US12267267
申请日：2008-11-07
申请人： Tetsuya Hamada
发明人： Tetsuya Hamada
IPC分类号： B05C5/02
CPC分类号： H01L21/67248 , H01L21/67051 , H01L21/67178 , H01L21/67184
摘要： A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves.
摘要翻译： 基板处理装置被构造为串联提供多个处理块，每个块包括处理单元和传送基板的传送机器人。 在相邻的处理块的连接部分中提供衬底。 具有传感器线圈的传感器板被提供跨越衬底的支撑销。 一旦具有温度测量元件的温度测量基板，通过将线圈连接到石英谐振器形成的每个元件被放置在支撑引脚上，发射器 - 接收器将对应于石英谐振器的特征频率的传输波传输到温度 - 通过传感器线圈测量元件。 在传输停止之后，发射机 - 接收机通过传感器线圈接收来自温度测量元件的电磁波，温度计算机基于电磁波的频率来计算衬底温度。
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29.发明授权公开(公告)号：US08015985B2
公开(公告)日：2011-09-13
申请号：US12349356
申请日：2009-01-06
申请人： Tetsuya Hamada , Koji Nishiyama
发明人： Tetsuya Hamada , Koji Nishiyama
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/67178 , H01L21/67225
摘要： A fluid supply pipe is inserted through a motor supporting member, a spin motor, a rotating shaft, and a plate supporting member. A first flange is integrally formed in the vicinity of a curved portion of a straight portion, extending in the vertical direction, of the fluid supply pipe. The first flange is fixed to a motor supporting member. Thus, the fluid supply pipe is fixed to the spin motor through the motor supporting member. The fluid supply pipe has a configuration in which a gas supply pipe made of resin and a plurality of cleaning liquid supply pipes made of resin are accommodated inside a guide pipe made of stainless. Inside the guide pipe, the one gas supply pipe is surrounded by the plurality of cleaning liquid supply pipes.
摘要翻译： 流体供给管插入电动机支撑部件，旋转电动机，旋转轴和板支撑部件。 第一凸缘一体地形成在流体供给管的沿垂直方向延伸的直线部分的弯曲部分附近。 第一凸缘固定到电动机支撑构件。 因此，流体供给管通过马达支撑构件固定到旋转马达。 流体供给管具有将由树脂制成的供气管和由树脂制成的多个清洗液供给管容纳在由不锈钢构成的导管内的结构。 在导管的内部，一个供气管被多个清洗液供给管包围。
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公开(公告)号：US20100151690A1
公开(公告)日：2010-06-17
申请号：US12334156
申请日：2008-12-12
CPC分类号： H01L21/6719 , G03F7/162 , H01L21/67051 , H01L21/68771 , Y10T29/41
摘要： An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.
摘要翻译： 在半导体衬底处理操作期间用于分配流体的设备包括具有第一侧和第二侧的外壳。 外壳包括第一处理站和第二处理站。 第二处理站位于第一处理站附近。 此外，基板处理装置包括：第一分配臂，被配置为将流体输送到第一处理站，其中第一分配臂位于第一侧和第一处理站之间，第二分配臂被配置为将流体输送到 第二处理站，其中第二分配臂位于第二侧和第二处理站之间。 衬底处理设备还包括构造成将冲洗流体输送到第一处理站的第一冲洗臂和被构造成将冲洗流体输送到第二处理站的第二冲洗臂。
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