-
公开(公告)号：US20140133950A1
公开(公告)日：2014-05-15
申请号：US13675278
申请日：2012-11-13
申请人： John Pollock
发明人： John Pollock
IPC分类号： B66F3/08
CPC分类号： B66F3/08
摘要： An insertion/extraction tool for inserting and extracting components in a housing includes a clamp member that attaches to a component in the housing. A lift member includes a bearing attached to the clamp member. A bridge includes a threaded member attached to the clamp member with a lead screw. The lead screw is threaded through the threaded member in the bridge and terminated at the bearing attached to the clamp member. The lead screw raises and lowers the lift member as it rotates, thereby translating the component relative to the housing.
摘要翻译： 用于在壳体中插入和提取部件的插入/取出工具包括附接到壳体中的部件的夹紧部件。 提升构件包括附接到夹紧构件的轴承。 桥梁包括用导螺杆附接到夹紧构件的螺纹构件。 导螺杆穿过桥中的螺纹构件并终止在附接到夹紧构件的轴承上。 导螺杆在提升构件旋转时升高并降低升降构件，从而相对于壳体平移组件。
-
公开(公告)号：US08519298B2
公开(公告)日：2013-08-27
申请号：US12731798
申请日：2010-03-25
申请人： Jianmin Wang , Craig Metzner , Gregory W. Schuh
发明人： Jianmin Wang , Craig Metzner , Gregory W. Schuh
CPC分类号： B23K26/0676 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02B27/283
摘要： A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.
摘要翻译： 双光束激光切割系统使用激光束偏振来输出两个相同的激光束。 与单激光切割系统相比，双重相同的激光束被适当地间隔开以同时切割水，从而增加激光切割系统的吞吐量。 在一个实施方案中，双光束激光切割系统100利用光束扩展器220，两个半波片224,238，偏振分束器228，反射镜236和两个透镜234,242来提供两个相同的激光束202 ，204来自单个激光源214.相同的激光束202,204被调谐为具有相同的功率，横截面直径和偏振方向。 半波片224中的一个旋转以产生具有相同功率的激光束。 旋转另一个半波片238以产生具有相同偏振方向的激光束。
-
公开(公告)号：US08328561B2
公开(公告)日：2012-12-11
申请号：US12539458
申请日：2009-08-11
申请人： Scott Wayne Priddy
发明人： Scott Wayne Priddy
IPC分类号： H01R41/00
CPC分类号： C23C14/243 , C23C14/0623
摘要： The present invention provides electrical contact assemblies can be used with vacuum deposition sources. In one exemplary application, the electrical contact assemblies of the present invention provide electrical contact to an arcuate or otherwise curved surface of a heating device used with a vacuum deposition source. In one embodiment, a set of power straps are each connected at one end to a power source feed-through wire and at the other end are urged by a pressure pin and a flat spring into electrical communication with one of the electrical contacts on the heating device.
摘要翻译： 本发明提供电触头组件可以与真空沉积源一起使用。 在一个示例性应用中，本发明的电接触组件提供与与真空沉积源一起使用的加热装置的弧形或其它弯曲表面的电接触。 在一个实施例中，一组电源带的一端各自连接到电源直通电线，另一端由压脚和平板弹簧推压，与加热中的一个电触头电连通 设备。
-
公开(公告)号：US20120248336A1
公开(公告)日：2012-10-04
申请号：US13495160
申请日：2012-06-13
CPC分类号： H01L21/6875 , G01N21/645 , G01N21/6489 , G01N2021/6417 , H01L21/68764 , Y10T117/1004 , Y10T117/1008
摘要： An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.
摘要翻译： 用于执行非接触材料表征的装置包括适于保持多个基板的晶片载体和材料表征装置，例如用于进行光致发光光谱的装置。 该装置适于在晶片载体的至少一部分上执行非接触材料表征，包括设置在其上的基板。
-
公开(公告)号：US08192547B2
公开(公告)日：2012-06-05
申请号：US11903727
申请日：2007-09-24
IPC分类号： C23C16/00
CPC分类号： F04B37/08
摘要： The present invention relates to vacuum depositions systems and related deposition methods. Vacuum deposition systems that use one or more cyropanels for localized pumping of a deposition region where a substrate is positioned are provided. The present invention is particularly applicable to pumping and minimizing reevaporation of high vapor pressure deposition materials during molecular beam epitaxy.
摘要翻译： 本发明涉及真空沉积系统和相关沉积方法。 提供使用一个或多个细胞浆进行局部泵送位于衬底的沉积区域的真空沉积系统。 本发明特别适用于在分子束外延期间泵送和最小化高蒸气压沉积材料的再蒸发。
-
公开(公告)号：US08158016B2
公开(公告)日：2012-04-17
申请号：US12037598
申请日：2008-02-26
申请人： Alan V. Hayes , Rustam Yevtukhov , Viktor Kanarov , Boris L. Druz
发明人： Alan V. Hayes , Rustam Yevtukhov , Viktor Kanarov , Boris L. Druz
CPC分类号： H01J37/08 , H01J27/18 , H01J37/3053 , H01J2237/061 , H01J2237/083 , H01J2237/24542 , H01L21/67069
摘要： Methods of operating an electromagnet of an ion source for generating an ion beam with a controllable ion current density distribution. The methods may include generating plasma in a discharge space of the ion source, generating and shaping a magnetic field in the discharge space by applying a current to an electromagnet that is effective to define a plasma density distribution, extracting an ion beam from the plasma, measuring a distribution profile for the ion beam density, and comparing the actual distribution profile with a desired distribution profile for the ion beam density. Based upon the comparison, the current applied to the electromagnet may be adjusted either manually or automatically to modify the magnetic field in the discharge space and, thereby, alter the plasma density distribution.
摘要翻译： 操作离子源的电磁体的方法，用于产生具有可控离子电流密度分布的离子束。 所述方法可以包括在离子源的放电空间中产生等离子体，通过向有效限定等离子体密度分布的电磁体施加电流来产生和放电放电空间中的磁场，从等离子体提取离子束， 测量离子束密度的分布曲线，并将实际分布分布与用于离子束密度的期望分布分布进行比较。 基于比较，可以手动或自动地调节施加到电磁体的电流，以改变放电空间中的磁场，从而改变等离子体密度分布。
-
公开(公告)号：US20120040097A1
公开(公告)日：2012-02-16
申请号：US12855739
申请日：2010-08-13
申请人： Boris Volf , Yuliy Rashkovsky
发明人： Boris Volf , Yuliy Rashkovsky
IPC分类号： C23C16/458 , C23C16/00
CPC分类号： H01L21/68764 , C23C16/4586 , H01L21/68728 , H01L21/68771
摘要： A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with locks for restraining wafers against upward movement away from the support surfaces. Constraining the wafers against upward movement limits the effect of wafer distortion on the spacing between the wafer and the floor surfaces, and thus limits the effects of wafer distortion on heat transfer. The carrier may include a main portion and minor portions having higher thermal conductivity than the main portion, the minor portions being disposed below the pockets.
摘要翻译： 用于晶片处理（例如化学气相沉积）中的晶片载体具有用于保持晶片和支撑表面的口袋，以支撑位于口袋的地板上方的晶片。 载体设有用于限制晶片的锁，以防止远离支撑表面的向上移动。 限制晶片对向上移动限制晶片失真对晶片和地板表面之间的间隔的影响，从而限制晶片失真对热传递的影响。 载体可以包括主要部分和具有比主要部分更高的热导率的次要部分，次要部分设置在口袋下方。
-
公开(公告)号：US20110297076A1
公开(公告)日：2011-12-08
申请号：US13208905
申请日：2011-08-12
CPC分类号： H01L21/6875 , G01N21/645 , G01N21/6489 , G01N2021/6417 , H01L21/68764 , Y10T117/1004 , Y10T117/1008
摘要： An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.
-
公开(公告)号：US20110287635A1
公开(公告)日：2011-11-24
申请号：US13188605
申请日：2011-07-22
IPC分类号： H01L21/302
CPC分类号： C23C16/4581 , C23C16/4584 , H01L21/68764 , H01L21/68771 , H01L21/68792
摘要： A wafer carrier for a rotating disc CVD reactor includes a unitary plate of a ceramic such as silicon carbide defining wafer-holding features such as pockets on its upstream surface and also includes a hub removably mounted to the plate in a central region of the plate. The hub provides a secure connection to the spindle of the reactor without imposing concentrated stresses on the ceramic plate. The hub can be removed during cleaning of the plate.
摘要翻译： 用于旋转圆盘CVD反应器的晶片载体包括诸如碳化硅的陶瓷的整体板，其限定晶片保持特征，例如其上游表面上的凹穴，并且还包括可拆卸地安装到板的中心区域中的毂。 轮毂提供与反应器主轴的牢固连接，而不会在陶瓷板上产生集中应力。 在清洁板时可以拆下轮毂。
-
公开(公告)号：US20110233176A1
公开(公告)日：2011-09-29
申请号：US12731798
申请日：2010-03-25
申请人： Jianmin Wang , Craig Metzner , Gregory W. Schuh
发明人： Jianmin Wang , Craig Metzner , Gregory W. Schuh
CPC分类号： B23K26/0676 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02B27/283
摘要： A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.
摘要翻译： 双光束激光切割系统使用激光束偏振来输出两个相同的激光束。 与单激光切割系统相比，双重相同的激光束被适当地间隔开以同时切割水，从而增加激光切割系统的吞吐量。 在一个实施方案中，双光束激光切割系统100利用光束扩展器220，两个半波片224,238，偏振分束器228，反射镜236和两个透镜234,242来提供两个相同的激光束202 ，204来自单个激光源214.相同的激光束202,204被调谐为具有相同的功率，横截面直径和偏振方向。 半波片224中的一个旋转以产生具有相同功率的激光束。 旋转另一个半波片238以产生具有相同偏振方向的激光束。
-
-
-
-
-
-
-
-
-
搜索结果
417 条记录 (耗时 0.029 秒)
