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公开(公告)号：US20070170530A1
公开(公告)日：2007-07-26
申请号：US11545113
申请日：2006-10-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US20170225943A1
公开(公告)日：2017-08-10
申请号：US15317646
申请日：2015-05-29
Applicant: Robert Bosch GmbH
Inventor： David Bendes
CPC classification number: B81B7/0016 , B81B2203/0118 , B81B2203/053 , B81B2207/015 , B81C1/00682 , B81C2201/0171
Abstract: A micromechanical structure is described, including: at least one elastically deformable first area, which includes a defined piezoelectrically doped second area, at least in sections; at least one fourth area, into which the electrical charges generated in the second area may be conducted; and at least one third area connected electrically to the second and fourth area, in which an electrical current flowing through is convertible into thermal energy.
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公开(公告)号：US09475690B2
公开(公告)日：2016-10-25
申请号：US14283098
申请日：2014-05-20
Applicant: UChicago Argonne, LLC
Inventor： Anirudha V. Sumant , Federico Buja , Willem Merlijn van Spengen
CPC classification number: B81B3/0024 , B81B3/0075 , B81C1/0038 , B81C2201/013 , B81C2201/017 , B81C2201/0171 , B81C2201/0176 , C23C14/16
Abstract: Nanocrystalline diamond coatings exhibit stress in nano/micro-electro mechanical systems (MEMS). Doped nanocrstalline diamond coatings exhibit increased stress. A carbide forming metal coating reduces the in-plane stress. In addition, without any metal coating, simply growing UNCD or NCD with thickness in the range of 3-4 micron also reduces in-plane stress significantly. Such coatings can be used in MEMS applications.
Abstract translation: 纳米/微机电系统（MEMS）中的纳米晶金刚石涂层显示出应力。 掺杂的纳米金刚石涂层表现出增加的应力。 碳化物形成金属涂层减少了面内应力。 此外，没有任何金属涂层，简单地生长厚度在3-4微米范围内的UNCD或NCD也显着降低了面内应力。 这种涂层可用于MEMS应用。
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公开(公告)号：US09434608B2
公开(公告)日：2016-09-06
申请号：US14524986
申请日：2014-10-27
Applicant: SiTime Corporation
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L23/051 , B81C1/00 , H01L41/113 , B81B7/00
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.
Abstract translation: 与第一衬底的第一和第二部分彼此分开并与第一衬底的其余部分分开的沟槽在第一衬底内形成空腔。 第一衬底的第一部分设置在空腔内并构成微机电结构，而衬底的第二部分至少部分地设置在空腔内并且构成电接触的第一部分。 第二衬底在空腔上固定到第一衬底以限定包含微机电结构的腔室。 第二基板具有构成电触点的第二部分的第一部分，并且设置成与第一基板的第二部分电接触，使得电触头从腔室内延伸到腔室的外部。
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25.发明申请METHODS AND SYSTEMS FOR CHEMICALLY ENCODING HIGH-RESOLUTION SHAPES IN SILICON NANOWIRES 审中-公开用于化学修饰硅纳米线的高分辨率形状的方法和系统公开(公告)号：US20160190245A1
公开(公告)日：2016-06-30
申请号：US14925530
申请日：2015-10-28
Inventor： James F. Cahoon , Joseph D. Christesen , Christopher W. Pinion
IPC: H01L29/06 , H01L21/306 , H01L21/283 , B81B3/00 , G01Q60/38 , H01L29/16 , H01L31/028 , H01L31/0352 , H01L31/09 , H01L21/02 , B81C1/00
CPC classification number: H01L29/0673 , B81B3/0021 , B81B2203/0118 , B81B2203/0361 , B81C1/00111 , B81C1/0015 , B81C2201/013 , B81C2201/0171 , B81C2201/0176 , G01Q60/38 , H01L21/02238 , H01L21/02255 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/02603 , H01L21/0262 , H01L21/283 , H01L21/30604 , H01L29/16 , H01L31/028 , H01L31/035281 , H01L31/03529 , H01L31/09 , Y02E10/50
Abstract: Methods of chemically encoding high-resolution shapes in silicon nanowires during metal nanoparticle catalyzed vapor-liquid-solid growth or vapor-solid-solid growth are provided. In situ phosphorus or boron doping of the silicon nanowires can be controlled during the growth of the silicon nanowires such that high-resolution shapes can be etched along a growth axis on the silicon nanowires. Nanowires with an encoded morphology can have high-resolution shapes with a size resolution of about 1,000 nm to about 10 nm and comprise geometrical shapes, conical profiles, nanogaps and gratings.
Abstract translation: 提供了在金属纳米颗粒催化的气 - 液 - 固 - 固生长或气 - 固 - 固生长期间在硅纳米线中化学编码高分辨率形状的方法。 可以在硅纳米线的生长期间控制硅纳米线的原位磷或硼掺杂，使得可以沿硅纳米线上的生长轴蚀刻高分辨率形状。 具有编码形态的纳米线可以具有约1000nm至约10nm的尺寸分辨率的高分辨率形状，并且包括几何形状，锥形轮廓，纳米光栅和光栅。
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Patent Agency Ranking
公开(公告)号：US20160101974A1
公开(公告)日：2016-04-14
申请号：US14283098
申请日：2014-05-20
Applicant: UChicago Argonne, LLC
Inventor： Anirudha V. Sumant , Federico Buja , Willem Merlijn van Spengen
CPC classification number: B81B3/0024 , B81B3/0075 , B81C1/0038 , B81C2201/013 , B81C2201/017 , B81C2201/0171 , B81C2201/0176 , C23C14/16
Abstract: Nanocrystalline diamond coatings exhibit stress in nano/micro-electro mechanical systems (MEMS). Doped nanocrstalline diamond coatings exhibit increased stress. A carbide forming metal coating reduces the in-plane stress. In addition, without any metal coating, simply growing UNCD or NCD with thickness in the range of 3-4 micron also reduces in-plane stress significantly. Such coatings can be used in MEMS applications.
Abstract translation: 纳米/微机电系统（MEMS）中的纳米晶金刚石涂层显示出应力。 掺杂的纳米金刚石涂层表现出增加的应力。 碳化物形成金属涂层减少了面内应力。 此外，没有任何金属涂层，简单地生长厚度在3-4微米范围内的UNCD或NCD也显着降低了面内应力。 这种涂层可用于MEMS应用。
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公开(公告)号：US20150041928A1
公开(公告)日：2015-02-12
申请号：US14524986
申请日：2014-10-27
Applicant: SiTime Corporation
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.
Abstract translation: 与第一衬底的第一和第二部分彼此分开并与第一衬底的其余部分分开的沟槽在第一衬底内形成空腔。 第一衬底的第一部分设置在空腔内并构成微机电结构，而衬底的第二部分至少部分地设置在空腔内并且构成电接触的第一部分。 第二衬底在空腔上固定到第一衬底以限定包含微机电结构的腔室。 第二基板具有构成电触点的第二部分的第一部分，并且设置成与第一基板的第二部分电接触，使得电触头从腔室内延伸到腔室的外部。
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28.发明授权公开(公告)号：US08871551B2
公开(公告)日：2014-10-28
申请号：US11593404
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。
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公开(公告)号：US20070170528A1
公开(公告)日：2007-07-26
申请号：US11336521
申请日：2006-01-20
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L29/84
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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30.发明申请Wafer encapsulated microelectromechanical structure and method of manufacturing same 审中-公开晶圆封装的微机电结构及其制造方法公开(公告)号：US20070170439A1
公开(公告)日：2007-07-26
申请号：US11600460
申请日：2006-11-16
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L31/0312
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。
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