METHOD FOR SELECTIVELY REMOVING COATINGS FROM METAL SUBSTRATES
    21.
    发明申请
    METHOD FOR SELECTIVELY REMOVING COATINGS FROM METAL SUBSTRATES 有权
    从金属基材中选择性去除涂层的方法

    公开(公告)号:US20090261068A1

    公开(公告)日:2009-10-22

    申请号:US12484704

    申请日:2009-06-15

    IPC分类号: B44C1/22

    摘要: A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to form an aluminum-infused overlay coating having an increased aluminum level in at least an outer surface thereof. The diffusion step is carried out so that the increased aluminum level is sufficient to render the aluminum-infused overlay coating removable by selective stripping. The outer surface of the aluminum-infused overlay coating is then contacted with an aqueous composition to remove the aluminum-infused overlay coating from the substrate. The aqueous composition includes at least one acid having the formula HxAF6, and/or precursors thereof, wherein A is Si, Ge, Ti, Zr, Al, and/or Ga, and x is from 1 to 6.

    摘要翻译: 由于其低铝含量的结果,从组分的底物中选择性地除去不含铝的覆盖涂层的方法对选择性剥离溶液具有高度的抗性。 该方法需要将铝扩散到覆盖涂层中以形成在至少其外表面中具有增加的铝水平的铝浸渍覆盖涂层。 进行扩散步骤,使得增加的铝水平足以使铝浸渍的覆盖涂层通过选择性剥离而除去。 然后将铝浸渍的覆盖涂层的外表面与含水组合物接触以从基底去除铝浸渍的覆盖涂层。 水性组合物包含至少一种具有式H xAF 6的酸和/或其前体,其中A是Si,Ge,Ti,Zr,Al和/或Ga,x是1至6。

    Microetching composition and method of using the same
    23.
    发明申请
    Microetching composition and method of using the same 有权
    微蚀刻组合物及其使用方法

    公开(公告)号:US20070138142A1

    公开(公告)日:2007-06-21

    申请号:US11316010

    申请日:2005-12-21

    IPC分类号: C09K13/00 C23F1/00

    摘要: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

    摘要翻译: 本发明涉及包含铜离子源,酸,腈化合物和卤离子源的微蚀刻组合物。 其它添加剂,包括有机溶剂,钼离子源,胺,多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法,包括以下步骤:使铜或铜合金表面与本发明的组合物接触,然后粘合 聚合物材料到铜或铜合金表面。

    Thin film transistor substrate and method of fabricating the same
    24.
    发明申请
    Thin film transistor substrate and method of fabricating the same 有权
    薄膜晶体管基板及其制造方法

    公开(公告)号:US20060281317A1

    公开(公告)日:2006-12-14

    申请号:US11438319

    申请日:2006-05-23

    申请人: Katsunori Misaki

    发明人: Katsunori Misaki

    摘要: The invention relates to a thin film transistor substrate for use in a liquid crystal display device and a method of fabricating the same, and an object is to provide a thin film transistor substrate which can ensure high reliability even though a low resistance metal is used in a material for a gate electrode and a predetermined wiring and a method of fabricating the same. A TFT substrate has a gate electrode in a multilayer structure configured of an AlN film as a nitrogen containing layer, an Al film as a main wiring layer and an upper wiring layer formed of an MoN film and an Mo film. On the gate electrode whose side surface inclines gently, a gate insulating film of excellent film quality is formed.

    摘要翻译: 本发明涉及一种用于液晶显示装置的薄膜晶体管基板及其制造方法,其目的是提供一种即使使用低电阻金属也能确保高可靠性的薄膜晶体管基板 用于栅电极和预定布线的材料及其制造方法。 TFT基板具有由作为含氮层的AlN膜,作为主布线层的Al膜和由MoN膜和Mo膜形成的上部布线层构成的多层结构的栅电极。 在侧面轻轻倾斜的栅电极上形成膜质优良的栅极绝缘膜。

    Method and apparatus for real-time dynamic chemical analysis
    25.
    发明申请
    Method and apparatus for real-time dynamic chemical analysis 有权
    用于实时动态化学分析的方法和装置

    公开(公告)号:US20050028932A1

    公开(公告)日:2005-02-10

    申请号:US10807537

    申请日:2004-03-23

    摘要: Methods and apparatus for real-time dynamic analysis of a chemical etching process are provided. The apparatus comprises an optical element (36) operative to pass a beam of electromagnetic radiation at least at two points in time through a liquid phase (42) comprising at least one chemical component and including an etchant, wherein the etchant is operative to etch a solid. A detector (60) is operative to perform an ex-situ non-contact scanning detection of the electromagnetic radiation subsequent to passing through the liquid phase in a near infra-red range (700-2500 nm) at the at least at two points in time so as to detect a change in an optical property of at least one of the at least one chemical component and the etchant. The apparatus further comprises a processor (64) operative to activate an algorithm so as to compare the change in the optical property of the at least of the at least one chemical component and the etchant received from the detector so as to provide data concerning a change in concentration of the etchant; and further configured to perform a chemometric manipulation of the data so as to provide a rate of etching of the solid.

    摘要翻译: 提供了化学蚀刻工艺的实时动态分析方法和装置。 所述装置包括光学元件(36),其操作以至少在两个时间点通过包含至少一种化学成分并包括蚀刻剂的液相(42)的电磁辐射束,其中所述蚀刻剂可操作以蚀刻 固体。 检测器(60)可操作用于在至少在两个点处的近红外范围(700-2500nm)中通过液相之后执行电磁辐射的非原位非接触扫描检测 以便检测至少一种化学成分和蚀刻剂中的至少一种的光学特性的变化。 所述装置还包括处理器(64),其用于激活算法,以便比较所述至少一个化学成分中的至少一个化学成分和从检测器接收的蚀刻剂的光学特性的变化,以便提供关于变化的数据 浓度为蚀刻剂; 并且还被配置为执行数据的化学计量操作,以便提供固体的蚀刻速率。

    Method and apparatus for removing organic layers
    26.
    发明申请
    Method and apparatus for removing organic layers 审中-公开
    去除有机层的方法和装置

    公开(公告)号:US20040159335A1

    公开(公告)日:2004-08-19

    申请号:US10456995

    申请日:2003-06-06

    IPC分类号: C23G001/36

    摘要: Embodiments in accordance with the present invention provide methods and apparatuses for heating a substrate with radiation during processing of substrates. Radiation in the radio or microwave portion of the electromagnetic spectrum is applied to a substrate housed within a processing chamber to promote desirable chemical reactions involving the substrate. Processing in accordance with embodiments of the present invention may utilize pressurization of the processing chamber in conjunction with the application of microwave, RF, IR, or UV radiation, or electromagnetic induction, to heat the substrate or a component of the processing chemistry present within the chamber. Alternative embodiments of the present invention may use combinations of these energy types for more effective processing. For example, UV radiation may be introduced into the chamber in conjunction with microwave heating in order to generate reactive species from the processing chemistry.

    摘要翻译: 根据本发明的实施例提供了用于在衬底处理期间用辐射加热衬底的方法和装置。 将电磁光谱的无线电或微波部分中的辐射施加到容纳在处理室内的衬底,以促进涉及衬底的期望的化学反应。 根据本发明的实施例的处理可以结合微波,RF,IR或UV辐射或电磁感应的应用来利用处理室的加压,以加热基板或内部存在的处理化学品的部件 房间。 本发明的替代实施例可以使用这些能量类型的组合来进行更有效的处理。 例如,UV辐射可以与微波加热一起引入室中,以便从处理化学物质产生反应物质。

    Method of controlling NOx gas emission by hydrogen peroxide
    27.
    发明授权
    Method of controlling NOx gas emission by hydrogen peroxide 失效
    用过氧化氢控制NOx排放的方法

    公开(公告)号:US06475373B1

    公开(公告)日:2002-11-05

    申请号:US09542847

    申请日:2000-04-04

    IPC分类号: G01N2726

    CPC分类号: C23G1/086 C23F1/16 C23G1/02

    摘要: Emission of NOx during acid-piclding treatment of metals in an aqueous solution containing at least nitric acid is controlled by the addition of hydrogen peroxide. The addition amount of hydrogen peroxide is minimized to avoid excessive addition by monitoring the potentiostatic electrolytic current of the solution or by combinedly monitoring the potentiostatic electrolytic current and the redox potential of the solution.

    摘要翻译: 通过添加过氧化氢可以控制在至少含有硝酸的水溶液中对金属进行酸蚀处理期间的NOx排放。 通过监测溶液的恒电位电解电流或通过组合监测溶液的恒电位电解电流和氧化还原电位,使过氧化氢的添加量最小化以避免过度添加。

    Metal etching process and composition
    28.
    发明授权
    Metal etching process and composition 失效
    金属蚀刻工艺及组成

    公开(公告)号:US5185057A

    公开(公告)日:1993-02-09

    申请号:US669431

    申请日:1991-03-15

    IPC分类号: C23F1/18 C23F1/16 C23F1/20

    CPC分类号: C23F1/16 C23F1/20

    摘要: The invention provides a process for etching a metal surface by applying, to the metal surface, a solution of ferric chloride at an effective concentration, which solution also contains phosphoric acid. The etching is done in an etching tank and the effective concentration of ferric ions is maintained by diffusing an oxidizing agent which is chlorine gas or a compound which forms HOCl in solution through the tank. A number of other steps which may vary according to the type and grade of metal surface which is to be etched are also performed in terms of the process of the invention, both before and after the application of the etching solution to the metal surface. Metal surfaces etched according to the invention have a coating, for example polytetrafluoroethylene, subsequently applied thereto.

    Redox-potential control for hydrogen peroxide in nitric acid
    29.
    发明授权
    Redox-potential control for hydrogen peroxide in nitric acid 失效
    硝酸中过氧化氢的氧化潜能控制

    公开(公告)号:US5154906A

    公开(公告)日:1992-10-13

    申请号:US639544

    申请日:1991-01-10

    CPC分类号: C23F1/16 B01D53/346 B01D53/56

    摘要: A method of maintaining a given content of a substance A in an aqueous solution where it is continuously consumed and where the redox potential E, at least within the range of concentration used, approximately satisfies the equation:E=G+F(x)wherein x is the content of A, F is a function of x whose derivative dF/dx approaches zero when x assumes a high value, and G on the whole is independent of x but is influenced by other parameters, such as pH, temperature or the like. The addition of A is controlled in such manner that a set value of the redox potential is maintained. The set value is determined by increasing or decreasing the addition of A in a predetermined manner, whereupon the redox potential is measured, and the measured value is used for determining the set value.

    Solutions of perhalogenated compounds
    30.
    发明授权
    Solutions of perhalogenated compounds 失效
    全卤化合物的溶液

    公开(公告)号:US4963283A

    公开(公告)日:1990-10-16

    申请号:US361144

    申请日:1989-06-05

    CPC分类号: G03F7/426 C11D1/004 C23F1/16

    摘要: Perhalogenated compounds, such as perfluorinated surfactants, for inclusion in aqueous systems, are provided in a cosolvent system consisting essentially of one or more acidic phosphorous-containing compounds selected from phosphoric or phosphorous acids, water-soluble di- or polyphosphonic or phosphinic acids and water-soluble salts of any of the aforesaid, for example 1-hydroxyethylidene 1,1-diphosphonic acid, and sufficient water, if required, to form a solution. Such solutions may be included with strongly acidic and/or peroxygen compositions, for example sulphuric acid or Caro's acid and avoid the need for contamination with organic co-solvents.