摘要:
The present invention is an SOI wafer in which at least a silicon active layer is formed over a support substrate via an insulator film or on a support substrate directly, wherein, at least, the silicon active layer consists of a P(phosphorus)-doped silicon single crystal grown by Czochralski method, which is occupied by N region and/or defect-free I region, and contains Al (aluminum) with concentration of 2×1012 atoms/cc or more. There can be provided with ease and at low cost an SOI wafer with high electrical reliability in a device fabrication process, that has an excellent electric property without generation of micro pits by cleaning with hydrofluoric acid etc. even in the case of forming an extremely thin silicon active layer, or that retains high insulation property even in the case of forming an extremely thin inter-layer insulator film.
摘要:
Highly-qualified crystals are grown with good yield under an optimal temperature condition by controlling the axial temperature distribution in the vicinity of the seed crystal locally. In an apparatus for producing crystals to grow crystals wherein a seed crystal 14 is placed in a crucible 11 which is retained in a furnace, raw materials 12 filled in the crucible 11 are heated and liquefied, and a raw material 12 slowly cooled in the crucible 11 from below upward, the apparatus including a temperature controller for controlling temperature to cool or heat the vicinity of the seed crystal 14 locally. The temperature controller controls the temperature by a hollow constructed cap 17 mounted outside the portion of crucible 11 and regulates refrigerant flow running through the hollow portion.
摘要:
A radiation detector made from a compound, or alloy, comprising CdxZn1-xTe (0≦x≦1), an element from column III or column VII of the periodic table in a concentration about 10 to 10,000 atomic parts per billion and an element selected from C the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu in a concentration about 10 to 10,000 atomic parts per billion exhibits full electrical compensation, high-resistivity, full depletion under an applied electrical bias and excellent charge transport.
摘要翻译:由CdxZn1-xTe(0 <= x <= 1)的化合物或合金制成的放射线检测器,元素周期表第III列或第VII列的元素,浓度为10至10,000原子数十亿, 元素选自C组成的浓度为10〜10,000原子数十亿份左右的La,Ce,Pr,Nd,Pm,Sm,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb和Lu组成的组, 电补偿,高电阻率,在施加的电偏压下的完全耗尽和优异的电荷传输。
摘要:
A calcium fluoride single crystal with increased radiation resistance can be prepared by growing under controlled conditions of solidification from a melt of a crystal raw material containing a dopant affording ions of Al and/or Ga and/or In and/or Tl. Such a single crystal after irra-diation with at least 5×108 laser pulses having a pulse energy of at least 10 mJ/cm2 shows at a wavelength of 193 nm an absorption of less than 0.1%/cm.
摘要翻译:通过在含有Al和/或Ga和/或In和/或Tl的离子的掺杂剂的晶体原料的熔体的固化控制条件下生长,可以制备具有增强的耐辐射性的氟化钙单晶。 在具有至少10mJ / cm 2的脉冲能量的至少5×10 8个激光脉冲进行辐照后的这种单晶在193nm的波长处显示出吸收 小于0.1%/ cm。
摘要:
In a method for growing a silicon single crystal, a silicon single crystal is grown by the Czochralski method to have an oxygen concentration of 12×1017 to 18×1017 atoms/cm3 on ASTM-F121 1979. A mixed gas of an inert gas and a gaseous substance containing hydrogen atoms is used as an atmospheric gas for growing the single crystal. A temperature of the silicon single crystal is controlled during the growth of the crystal such that the ratio Gc/Ge of an axial thermal gradient Gc at the central portion of the crystal between its melting point and its temperature of 1350° C. to an axial thermal gradient Ge at the periphery of the crystal between its melting point and its temperature of 1350° C. is 1.1 to 1.4. The axial thermal gradient Gc at the central portion of the crystal is 3.0 to 3.5° C./mm.
摘要:
A polycrystalline film is prepared by (a) providing a substrate having a thin film disposed thereon, said film capable of laser-induced melting, (b) generating a sequence of laser pulses having a fluence that is sufficient to melt the film throughout its thickness in an irradiated region, each pulse forming a line beam having a predetermined length and width, said width sufficient to prevent nucleation of solids in a portion of the thin film that is irradiated by the laser pulse, (c) irradiating a first region of the film with a first laser pulse to form a first molten zone, said first molten zone demonstrating a variation in width along its length to thereby define a maximum width (Wmax) and a minimum width (Wmin), wherein the first molten zone crystallizes upon cooling to form one or more laterally grown crystals, (d) laterally moving the film in the direction of lateral growth a distance that is greater than about one-half Wmax and less than Wmin; and (e) irradiating a second region of the film with a second laser pulse to form a second molten zone having a shape that is substantially the same as the shape of the first molten zone, wherein the second molten zone crystallizes upon cooling to form one or more laterally grown crystals that are elongations of the one or more crystals in the first region.
摘要翻译:通过(a)提供具有设置在其上的薄膜的基板,所述膜能够进行激光诱导熔化,(b)产生具有足以使膜在整个厚度上熔化的能量密度的激光脉冲序列来制备多晶膜 在照射区域中,每个脉冲形成具有预定长度和宽度的线束,所述宽度足以防止由激光脉冲照射的薄膜部分中的固体成核,(c)照射第一区域 薄膜具有第一激光脉冲以形成第一熔融区,所述第一熔融区表现出沿其长度的宽度变化,从而限定最大宽度(W max)和最小宽度(W max SUB>且小于W mi n 和(e)用第二激光脉冲照射所述膜的第二区域以形成具有与所述第一熔融区域的形状基本相同的形状的第二熔融区域,其中所述第二熔融区域在冷却时结晶以形成一个 或更多横向生长的晶体,其是第一区域中的一种或多种晶体的伸长率。
摘要:
A crucible for growing III-nitride (e.g., aluminum nitride) single crystals is provided. The crucible includes an elongated wall structure defining an interior crystal growth cavity. Embodiments include a plurality of grains and a wall thickness of at least about 1.5 times the average grain size. In particular embodiments, the crucible includes first and second layers of grains the first layer including grains forming an inside surface thereof and the second layer being superposed with the first layer. The crucible may be fabricated from tungsten-rhenium (W—Re) alloys; rhenium (Re); tantalum monocarbide (TaC); tantalum nitride (Ta2N); hafnium nitride (HfN); a mixture of tungsten and tantalum (W—Ta); tungsten (W); and combinations thereof.
摘要:
The invention relates to a device for the production of crystal rods having a defined cross-section and a column-shaped polycrystalline structure by means of floating-zone continuous crystallization, comprising at least one crucible filled with crystalline material, provided with a central deviation for transporting the contents of the crucible to a growing crystal rod arranged below the crucible, whereby the central deviation plunges into the melt meniscus, also comprising means for continuously adjustable provision of crystalline material to the crucible, and means for simultaneously feeding the melt energy and adjusting the crystallization front. In order to produce crystal rods having a defined diameter and a column-shaped polycrystalline structure using heating means which are technically less complex, while at the same time guaranteeing high crystallization rates and stable phase definition, the means for simultaneously feeding the melt energy and adjusting the crystallization front on the growing crystal rod (8) is a flat induction coil (5) which has an opening, said induction coil (5) being arranged at a distance from the crucible (4) and/or being vertically moveable in relation to the crystallization front.
摘要:
An amorphous silicon deposition method includes the step of forming a buffer layer on a transparent substrate; depositing amorphous silicon on the buffer layer by a thickness ranging from about 600 to about 2,000 angstroms; repeatedly irradiating the amorphous silicon layer to completely melt using a laser beam that has a complete melting energy density; and moving the laser beam by a transaction distance for the next laser beam irradiation.
摘要:
There is provided a method of fabricating a wafer, comprising depositing semiconductor material into a recess in a setter, moving the setter through a heating/cooling region to subject the semiconductor material to a temperature profile, and removing a wafer from the recess. The size and shape of the wafer are substantially equal to the size of the wafer when it is used. As a result, the wafer can be fabricated in any desired shape and with any of a variety of surface structural features and/or internal structural features. The temperature profile can be closely controlled, enabling production of wafers having structural features not previously obtainable. There are also provided wafers formed by such methods and setters for use in such methods.