公开(公告)号：US08809802B2

公开(公告)日：2014-08-19

申请号：US13522627

申请日：2011-01-14

Applicant: Bong Jo Sung ,  Hyung Ho Park ,  Jae Soo Jang

Inventor： Bong Jo Sung ,  Hyung Ho Park ,  Jae Soo Jang

IPC: H01T23/00 ,  H01J1/02

CPC classification number: H01T23/00

Abstract: An ion generator is disclosed. The ion generator has improved portability and ion generation efficiency. As is apparent from the above description, the ion generator according to the present invention is configured so that the discharge unit is constituted by the felts, and the piezoelectric element, not the coil type transformer, is used in the high voltage generation unit which generates high voltage. Consequently, the present invention has the effect of improving portability of the ion generator and the present invention has the effect of improving ion generation efficiency although the portability of the ion generator is improved by configuring the ion generator according to the present invention so that the discharge unit is constituted by the felts, and the piezoelectric element, not the coil type transformer, is used in the high voltage generation unit which generates high voltage.

Abstract translation: 公开了一种离子发生器。 离子发生器具有改进的便携性和离子发生效率。 从上述说明可以看出，根据本发明的离子发生器被构造为使得放电单元由毛毡构成，并且压电元件而不是线圈型变压器被用于产生 高压。 因此，本发明具有提高离子发生器的便携性的效果，本发明具有提高离子发生效率的效果，尽管通过将根据本发明的离子发生器构成离子发生器来提高离子发生器的便携性， 单元由毛毡构成，压电元件而不是线圈型变压器用于产生高电压的高电压产生单元中。

公开(公告)号：US08773006B2

公开(公告)日：2014-07-08

申请号：US13590832

申请日：2012-08-21

Applicant: Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

Inventor： Byung Mok Kim ,  Young Jun Cho ,  Yon Tae Moon ,  Su Jung Jung ,  Seo Yeon Kwon ,  Son Kyo Hwang

IPC: H01J1/02

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.

Abstract translation: 公开了一种发光器件封装。 发光器件包括具有由侧壁和底表面限定的空腔的封装主体，设置在空腔中的发光器件，插入到封装主体中并设置在发光器件下方的散热器和设置在第二电极图案 围绕散热器并通过引线接合电连接到发光器件。 第二电极图案包括接合线的第一区域和连接到第一区域的第二区域，第一区域的宽度与第二区域的宽度不同。

公开(公告)号：US08736153B2

公开(公告)日：2014-05-27

申请号：US13618719

申请日：2012-09-14

Applicant: Kenji Nezu

Inventor： Kenji Nezu

IPC: H01J1/02 ,  H01J7/24 ,  H01J61/52 ,  H01K1/58

CPC classification number: F21V29/83 ,  F21K9/23 ,  F21K9/238 ,  F21S8/026 ,  F21V3/062 ,  F21V23/006 ,  F21V23/02 ,  F21V29/508 ,  F21V29/713 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A lamp apparatus includes an apparatus body including a housing having a cap at one end side, and thermal conducting fins provided on an inner surface of the housing so as to extend from the one end side along the other end side thereof and project inward of the housing, a thermal radiation plate attached to the other end side of the housing in a state in which one surface side is in contact with the thermal conducting fins, a light-emitting body attached to the other surface side of the thermal radiation plate, and a lighting circuit disposed in the housing and configured to light the light-emitting body.

Abstract translation: 一种灯装置，包括：设备本体，其具有在一端侧具有盖的壳体，以及设置在所述壳体的内表面上的导热翅片，以沿着所述壳体的另一端侧从所述一端侧延伸， 壳体，在一个表面侧与导热翅片接触的状态下附接到壳体的另一端侧的热辐射板，附接到热辐射板的另一个表面侧的发光体，以及 照明电路，设置在所述壳体中并且被配置为对所述发光体进行点亮。

公开(公告)号：US08680755B2

公开(公告)日：2014-03-25

申请号：US13738605

申请日：2013-01-10

Applicant: Dong Nyung Lim ,  Tae Young Choi ,  Do Hwan Kim ,  Cheon Joo Kim

Inventor： Dong Nyung Lim ,  Tae Young Choi ,  Do Hwan Kim ,  Cheon Joo Kim

IPC: H01J1/02 ,  H01J7/24

CPC classification number: H05B33/02 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/061 ,  F21V3/062 ,  F21V17/12 ,  F21V23/006 ,  F21V29/773 ,  F21V29/78 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: A lighting device may be provided that includes: a heat sink which includes a base and a member extending from the base; a light source module which is disposed on a lateral surface of the member; and a reflector which is disposed on the member and has a disposition recess exposing the light source module, wherein the at least two light source modules are provided and the light source module includes a terminal plate which electrically connects the at least two light source modules, and wherein the terminal plate is disposed on the reflector.

Abstract translation: 可以提供照明装置，其包括：散热器，其包括基部和从基部延伸的部件; 光源模块，其设置在所述构件的侧面上; 以及设置在所述构件上并具有露出所述光源模块的布置凹部的反射器，其中，设置所述至少两个光源模块，并且所述光源模块包括电连接所述至少两个光源模块的端子板， 并且其中所述端子板设置在所述反射器上。

公开(公告)号：US08664838B2

公开(公告)日：2014-03-04

申请号：US13989483

申请日：2011-12-08

Applicant: Chuan Yuan ,  Xiaoqing Duan ,  Yan Xiong

Inventor： Chuan Yuan ,  Xiaoqing Duan ,  Yan Xiong

IPC: H01J1/02

CPC classification number: F21V29/20 ,  F21K9/00 ,  F21V17/00 ,  F21V29/67 ,  F21V29/677 ,  F21V29/70 ,  F21V29/85 ,  F21Y2115/10 ,  Y10T29/49826

Abstract: The invention provides an illumination apparatus (10) and a method of assembling the illumination apparatus. The illumination apparatus comprises a light source (101) having a plurality of LED arrays, wherein at least two of the plurality of LED arrays have different lumen degradations as a function of junction temperature of the respective LED arrays; and a heat dissipation unit (102) configured to be capable of dissipating heat generated by the light source, wherein the heat dissipation unit is mounted on a first surface of the light source in such a way that there is a gap between the first surface and the heat dissipation unit when the light source is not in operation, and the gap is narrowed or can be deemed to disappear when the light source reaches a preset temperature, so that the heat dissipation efficiency of the heat dissipation unit is improved.

Abstract translation: 本发明提供一种照明装置（10）和组装照明装置的方法。 所述照明装置包括具有多个LED阵列的光源（101），其中所述多个LED阵列中的至少两个LED阵列具有作为各个LED阵列的结温的函数的不同的流明退化; 以及散热单元（102），其能够散发由所述光源产生的热量，其中所述散热单元以所述第一表面和所述第一表面之间存在间隙的方式安装在所述光源的第一表面上， 当光源不工作时的散热单元，并且当光源达到预设温度时间隙变窄或可以认为消失，从而提高了散热单元的散热效率。

公开(公告)号：US08653723B2

公开(公告)日：2014-02-18

申请号：US12706869

申请日：2010-02-17

Applicant: Densen Cao ,  Zhaohui Lin

Inventor： Densen Cao ,  Zhaohui Lin

IPC: H01J1/02 ,  H01J7/24

CPC classification number: F21V29/51 ,  F21K9/232 ,  F21V3/00 ,  F21V29/67 ,  F21V29/677 ,  F21V29/773 ,  F21Y2103/33 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: The invention discloses a three dimensional LED arrangement and heat management method using a heat transfer or conduction pipe to enable rapid heat transfer from a three dimensional cluster of LEDs to a heatsink with or without active cooling, the light emitted from the three dimensional cluster not being obstructed by a heat sink arrangement such that the light beam profile generated by the light appears similar to that generated by traditional incandescent bulbs.

Abstract translation: 本发明公开了一种三维LED布置和热管理方法，其使用传热管或传导管，以使得能够从三维聚簇的快速热传递到具有或不具有主动冷却的散热器，从三维簇发射的光不是 被散热器布置阻挡，使得由光产生的光束轮廓类似于传统白炽灯产生的。

公开(公告)号：US20140010347A1

公开(公告)日：2014-01-09

申请号：US13893519

申请日：2013-05-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do-yoon KIM ,  Yong-chul KIM ,  Il-hwan KIM ,  Shang-hyeun PARK ,  Tae-won JEONG

IPC: H01J19/24 ,  H01J1/02 ,  H01J35/06

CPC classification number: H01J19/24 ,  B82Y99/00 ,  H01J1/02 ,  H01J3/021 ,  H01J9/02 ,  H01J31/127 ,  H01J35/06 ,  H01J35/065 ,  H01J63/02 ,  H01J63/06 ,  H01J2203/0208 ,  H01J2235/062 ,  H01J2235/068 ,  H01J2329/4608 ,  Y10S977/939

Abstract: A mesh electrode adhesion structure includes: a substrate, and an opening defined in the substrate; a mesh electrode on the substrate, and a first combination groove defined in the mesh electrode; and an adhesion layer between the substrate and the mesh electrode. The mesh electrode includes: a mesh region corresponding to the opening defined in the substrate, and an adhesion region in which the first combination groove exposes the adhesion layer.

Abstract translation: 网状电极粘合结构包括：基板和限定在基板中的开口; 基板上的网状电极以及限定在网状电极中的第一组合槽; 以及基板和网状电极之间的粘附层。 网状电极包括：对应于在基板中限定的开口的网格区域，以及第一组合凹槽暴露粘合层的粘合区域。

公开(公告)号：US08610343B2

公开(公告)日：2013-12-17

申请号：US13492645

申请日：2012-06-08

Applicant: John Charles Cipolla

Inventor： John Charles Cipolla

IPC: H01J1/00 ,  H01J13/08 ,  H01J1/02

CPC classification number: B23K1/19 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/16 ,  B23K2103/172 ,  H01J19/06 ,  H01J23/02 ,  H01J25/50

Abstract: Components for use in vacuum electron devices are fabricated from highly oriented pyrolytic graphite (HOPG) and exhibit excellent thermal conductivity, low sputtering rates, and low ion erosion rates as compared to conventional components made from copper or molybdenum. HOPG can be reliably brazed by carefully controlling tolerances, calculating braze joint material volume, and applying appropriate compression during furnace operations. The resulting components exhibit superior thermal performance and enhanced resistance to ion erosion and pitting.

Abstract translation: 用于真空电子器件的组件由高取向热解石墨（HOPG）制成，并且与由铜或钼制成的常规元件相比，显示出优异的导热性，低溅射速率和低离子侵蚀速率。 HOPG可以通过仔细控制公差，计算钎焊接头材料体积以及在炉子操作期间施加适当的压缩来可靠地钎焊。 所得组分表现出优异的热性能和增强的抗离子侵蚀和点蚀性能。

公开(公告)号：US08593041B1

公开(公告)日：2013-11-26

申请号：US13583221

申请日：2012-08-31

Applicant: Zexin Wu

Inventor： Zexin Wu

IPC: H01J1/02

CPC classification number: G02F1/133603 ,  G02B6/0085 ,  G02F2001/133628

Abstract: The present invention discloses a heatsink apparatus for use with a backlight module. The heatsink apparatus is used to dissipate heat buildup from a light source, and includes a heatsink and a backframe. The heatsink is thermally in contact with the light source. The backframe and the heatsink jointly define a ventilation shaft on a surface of the backframe. The present invention further includes a backlight module incorporated with the heatsink. With the provision of the ventilation shaft of the heatsink, the performance of the heat dissipation is increased, and the service life of the light source is therefore prolonged.

Abstract translation: 本发明公开了一种与背光模块一起使用的散热装置。 散热装置用于散发来自光源的热积聚，并且包括散热器和后框架。 散热器与光源热接触。 后框架和散热器在背框的表面上共同限定通风轴。 本发明还包括与散热器结合的背光模块。 通过设置散热器的通风轴，散热性能提高，光源的使用寿命延长。

公开(公告)号：US08581478B2

公开(公告)日：2013-11-12

申请号：US13377835

申请日：2010-05-26

Applicant: Ralph Bertram ,  Nicole Breidenassel ,  Klaus Burkard ,  Florian Zeus

Inventor： Ralph Bertram ,  Nicole Breidenassel ,  Klaus Burkard ,  Florian Zeus

IPC: H01J1/02 ,  H01J7/24

CPC classification number: F21V29/004 ,  F21K9/232 ,  F21V3/00 ,  F21V29/713 ,  F21V29/773 ,  F21Y2115/10

Abstract: A cooling member for at least one semiconductor light emitting element, in particular an LED, may include a mounting cavity for accommodating at least part of a control electronics unit, whereby the cooling member is composed of multiple cooling member parts, whereby each of which cooling member parts includes part of a wall of the mounting cavity.

Abstract translation: 用于至少一个半导体发光元件，特别是LED的冷却构件可以包括用于容纳控制电子单元的至少一部分的安装空腔，由此冷却构件由多个冷却构件部件组成，由此每个冷却构件的冷却 构件部分包括安装腔的壁的一部分。