公开(公告)号：US20020129477A1

公开(公告)日：2002-09-19

申请号：US09341112

申请日：1999-07-07

发明人： JEAN-MARC BUREAU ,  FRANCOIS BERNARD

IPC分类号： H04R017/00 ,  H01K003/10

CPC分类号： B06B1/0629 ,  H05K1/0306 ,  H05K1/0393 ,  H05K3/0058 ,  Y10S29/001 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1057

摘要： The invention relates to a process for the fabrication of a multielement acoustic probe. This process comprises the use of a flexible circuit having conducting tracks on at least one of its sides, the joining of this circuit to a plate of piezoelectric material (having metallizations), the production of vias through the flexible circuit, in order to address the said metallizations, and the production of electrical contacts within the vias.

摘要翻译： 本发明涉及一种用于制造多元声学探针的方法。 该方法包括使用在其至少一个侧面上具有导电轨道的柔性电路，将该电路连接到压电材料板（具有金属化），通过柔性电路产生通孔，以便解决 表示金属化，以及在通孔内生产电气接触。

公开(公告)号：US20020121841A1

公开(公告)日：2002-09-05

申请号：US10025901

申请日：2001-12-26

申请人： Murata Manufacturing Co., Ltd.

发明人： Kazunobu Shimoe ,  Shuji Yamato ,  Takashi Marukawa

IPC分类号： H01L041/04 ,  H04R017/00 ,  H05K003/02

CPC分类号： H03H3/08 ,  H03H9/02897 ,  H03H9/25 ,  Y10T29/42 ,  Y10T29/49128 ,  Y10T29/49156

摘要： A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

摘要翻译： 制造通过倒装芯片接合系统通过凸块安装的表面声波装置的方法防止电极焊盘从压电基板剥离，并且压电基板中的裂纹在形成凸块期间或在制造过程中的其它时刻发生 处理。 在表面声波装置的制造方法中，通过蚀刻在压电基板上形成电极焊盘的第一电极层，在第一电极层是第一电极层之后，通过剥离法形成表面声波元件用电极 形成，然后形成包括电极焊盘的第二电极层和布线电极的电极膜。

公开(公告)号：US20020048219A1

公开(公告)日：2002-04-25

申请号：US09971095

申请日：2001-10-03

发明人： Igal Ladabaum ,  Paul A. Wagner

IPC分类号： H04R017/00

CPC分类号： B06B1/0681 ,  B06B2201/76

摘要： The present invention provides a microfabricated acoustic transducer with suppressed substrate modes. The modes are suppressed by either thinning the substrate such that a longitudinal ringing mode occurs outside of the frequency band of interest or by applying a judiciously designed damping material on the backside of the transducer substrate.

摘要翻译： 本发明提供了一种具有抑制衬底模式的微制造声学换能器。 通过使衬底变薄来抑制这些模式，使得纵向振铃模式发生在感兴趣的频带之外，或通过在换能器基板的背面施加明智地设计的阻尼材料。

公开(公告)号：US20020013987A1

公开(公告)日：2002-02-07

申请号：US09961836

申请日：2001-09-24

申请人： NGK Insulators, Ltd.

发明人： Toshikazu Hirota ,  Koji Kimura ,  Yukihisa Takeuchi

IPC分类号： H04R017/00 ,  H05K003/36

CPC分类号： H01L41/314 ,  G02B26/04 ,  G02B26/0858 ,  H01L41/0946 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49798

摘要： A piezoelectric/electrostrictive device includes: a driving portion which is driven by displacement of a piezoelectric/electrostrictive element, a movable portion which operates on the basis of a drive of the driving portion, and a fixed portion for supporting the above driving portion and movable portion. It has a driving portion including thin plates facing each other and a thin film piezoelectric/electrostrictive element formed on the surface of at least one of the thin plates, and the above fixed portion and the above movable portion are joined by the driving portion. In this piezoelectric/electrostrictive element, the movable portion can largely be displaced, and it is not easily affected by a harmful vibration in operation, and it is excellent in mechanical strength, handling efficiency, impact resistance, and moisture resistance.

摘要翻译： 压电/电致伸缩器件包括：通过压电/电致伸缩元件的位移驱动的驱动部分，基于驱动部分的驱动而操作的可动部分和用于支撑上述驱动部分并可移动的固定部分 一部分。 它具有包括彼此相对的薄板的驱动部分和形成在至少一个薄板的表面上的薄膜压电/电致伸缩元件，并且上述固定部分和上述可移动部分由驱动部分接合。 在这种压电/电致伸缩元件中，可移动部分可以大大移位，并且不容易受到操作中的有害振动的影响，并且机械强度，处理效率，耐冲击性和耐湿性都优异。

公开(公告)号：US20020003459A1

公开(公告)日：2002-01-10

申请号：US09945767

申请日：2001-09-04

发明人： Hiromi Yatsuda ,  Hiroaki Iijima ,  Nobuhiro Mineshima

IPC分类号： H04R017/00 ,  H03H009/00

CPC分类号： H03H9/1071 ,  H03H3/08 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4913

摘要： In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.

摘要翻译： 在表面声波（SAW）器件及其制造方法中，将SAW芯片倒装安装在封装中。 封装具有面向SAW芯片的电极形成表面的窗口。 安装SAW芯片后，将进程中的物品插入反应离子蚀刻设备中，窗口打开。 通过引入到离子蚀刻设备中的蚀刻气体来蚀刻SAW芯片的基板或电极。 可以在电极形成表面上形成膜来代替蚀刻。 因此，可以抑制由制造工艺的变化引起的特性的变化。

公开(公告)号：US20010044995A1

公开(公告)日：2001-11-29

申请号：US09911467

申请日：2001-07-25

发明人： Satoru Tezuka

IPC分类号： H04R017/00 ,  H04R031/00 ,  H05K003/20

CPC分类号： B06B1/0629 ,  A61B8/4494 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49048 ,  Y10T29/4908 ,  Y10T29/49128 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4922 ,  Y10T29/53261

摘要： This invention relates to a method of manufacturing an ultrasonic transducer. First, a plurality of printed boards in each of which a plurality of leads are formed in a line are stacked. The end portions of the leads protrude from each printed board. These lead end portions are inserted into a plurality of lead holes of an alignment jig. The plurality of printed boards are buried in the back surface of this alignment jig, and a backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

摘要翻译： 本发明涉及一种制造超声换能器的方法。 首先，堆叠形成有多条引线的多个印刷电路板。 引线的端部从每个印刷电路板突出。 这些引线端部插入到对准夹具的多个引线孔中。 多个印刷电路板埋设在该对准夹具的背面，通过树脂成型形成背衬层。 之后，将对准夹具从背衬层的表面去除，并且背衬层的表面变平。 由于引线的端部暴露于背衬层的该扁平表面，所以形成在换能器元件的后表面上的离散电极电连接到这些引线端部。 因此，通过使用对准夹具来提高引线排列的精度。 这降低了引线相对于换能器元件的离散电极的对准误差。

公开(公告)号：US20010029648A1

公开(公告)日：2001-10-18

申请号：US09799438

申请日：2001-03-05

申请人： Murata Manufacturing Co., Ltd.

发明人： Katsuhiro Ikada ,  Kenji Sakaguchi ,  Miki Takamiya

IPC分类号： H04R017/00

CPC分类号： H03H3/08 ,  Y10T29/42

摘要： A method of manufacturing a surface acoustic wave apparatus including the steps of forming a first conductive film, depositing a first resist on the first conductive film and patterning the first resist, dry-etching the first conductive film using the patterned first resist to form IDT electrodes, a short-circuit wiring electrode for establishing electrical connection between IDT electrodes, and a second conductive film provided where the second surface acoustic wave device is constructed, removing the second conductive film, depositing a second resist and heating the second resist, patterning the second resist on the electrodes, forming a second conductive film having a thickness which is different from the first conductive film, removing the second resist to form the electrodes of the second surface acoustic wave device and to expose the electrodes of the first surface acoustic wave device, and disconnecting the short-circuit wiring electrode.

摘要翻译： 一种表面声波装置的制造方法，包括以下步骤：形成第一导电膜，在第一导电膜上沉积第一抗蚀剂并构图第一抗蚀剂，使用图案化的第一抗蚀剂对第一导电膜进行干蚀刻，以形成IDT电极 ，用于建立IDT电极之间的电连接的短路布线电极和设置在所述第二弹性表面波器件的第二导电膜上的第二导电膜，去除所述第二导电膜，沉积第二抗蚀剂并加热所述第二抗蚀剂， 形成具有与第一导电膜不同的厚度的第二导电膜，除去第二抗蚀剂，形成第二弹性表面波元件的电极，露出第一弹性表面波元件的电极， 并断开短路布线电极。

公开(公告)号：US20010022487A1

公开(公告)日：2001-09-20

申请号：US09861738

申请日：2001-05-21

申请人： NGK Insulators, Ltd.

发明人： Yukihisa Takeuchi ,  Toshikatsu Kashiwaya ,  Nobuo Takahashi

IPC分类号： H01L041/04 ,  H02N002/00 ,  H04R017/00

CPC分类号： H01L41/1875 ,  H01H1/0036 ,  H01H57/00 ,  H01H2001/0042 ,  H01H2057/006 ,  H01L41/0973 ,  H01L41/098 ,  H01L41/314 ,  Y10T29/42

摘要： A ceramic element comprises a main actuator element 26 having an anti-ferroelectric film 22 and a pair of electrodes 24a, 24b formed on a first principal surface (front surface) of the anti-ferroelectric film 22, a vibrating section 18 for supporting the main actuator element 26, and a fixed section 20 for supporting the vibrating section 18 in a vibrating manner. The anti-ferroelectric film 22 after polarization has a region Zt in which its average dielectric constant is increased in an analog manner in accordance with a voltage V applied to the pair of electrodes 24a, 24b. Specifically, an expression of p/tnull2.5 is satisfied provided that an average film thickness of the anti-ferroelectric film 22 is t, and a pitch between the pair of electrodes 24a, 24b is p. Accordingly, the mechanical displacement amount is changed in an analog manner in accordance with the applied voltage, making it possible to maintain a displacement amount equivalent to that obtained during application of a driving voltage, in a no voltage-loaded state after completion of application of the driving voltage.

摘要翻译： 陶瓷元件包括具有抗铁电体膜22的主致动器元件26和形成在反铁电体膜22的第一主表面（前表面）上的一对电极24a，24b，用于支撑主铁芯的振动部分18 致动器元件26和用于以振动方式支撑振动部分18的固定部分20。 偏振后的反铁电体膜22具有根据施加到一对电极24a，24b的电压V的模拟方式增加平均介电常数的区域Zt。 具体地，如果反铁电体膜22的平均膜厚为t，并且一对电极24a，24b之间的间距为p，则p / t <= 2.5的表达式被满足。 因此，机械位移量根据所施加的电压以模拟方式改变，使得可以在完成施加之后的无电压负载状态下保持与施加驱动电压期间获得的位移量相当的位移量 的驱动电压。

公开(公告)号：US20040237271A1

公开(公告)日：2004-12-02

申请号：US10832077

申请日：2004-04-26

申请人： NGK Insulators, Ltd.

发明人： Koji Ikeda ,  Fumitake Takahashi ,  Kazuyoshi Shibata

IPC分类号： H04R017/00

CPC分类号： H01L41/43 ,  G11B5/483 ,  G11B5/4873 ,  H01L41/0946 ,  H01L41/273 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49798

摘要： A method of producing a piezoelectric/electrostrictive device having a base including a pair of movable parts opposing each other, a fixing part that connects the movable parts with each other at one end thereof, and mounting parts that extend for a predetermined length while holding slit-shaped gaps of a predetermined width along inside surfaces of said movable parts by being turned around at the other end of said movable parts, said piezoelectric/electrostrictive device having a piezoelectric/electrostrictive element disposed on at least one outside surface of said movable parts of said base, wherein a base block obtained by laminating and calcining a large number of ceramic green sheets is adopted as a material for forming said base, and the base including said movable parts, said fixing part, and said mounting parts is formed by cutting said base block at a predetermined site along a lamination direction of said ceramic green sheets.

摘要翻译： 一种制造压电/电致伸缩器件的方法，该压电/电致伸缩器件具有包括彼此相对的一对可动部件的基部，一端连接可动部件的固定部件，同时保持狭缝而延伸规定长度的安装部件 所述压电/电致伸缩装置具有压电/电致伸缩元件，所述压电/电致伸缩元件设置在所述可移动部分的至少一个外表面上，所述压电/电致伸缩元件设置在所述可移动部分的至少一个外表面上， 所述基底，其中通过层压和煅烧大量陶瓷生片而获得的基底块被用作形成所述基底的材料，并且包括所述可移动部分，所述固定部分和所述安装部分的基底通过切割所述基部 基块沿着所述陶瓷生片的层叠方向在预定位置。

公开(公告)号：US20040232802A1

公开(公告)日：2004-11-25

申请号：US10484832

申请日：2004-01-26

发明人： Yoshihiro Koshido

IPC分类号： H04R017/00 ,  H02N002/00

CPC分类号： H03H9/1092 ,  H03H3/08 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/105 ,  H03H9/6483 ,  Y10T29/42

摘要： A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the bonding substrate such that a protective space of the IDT is provided. The bonding substrate includes a through-hole in which an external terminal connection member connected to the conductive pad and an external terminal are disposed. The SAW is bonded to the bonding substrate by an adhesive layer including a solder layer.

摘要翻译： 表面声波装置包括具有设置在压电基板上的IDT的SAW，连接到IDT的导电焊盘和接合基板，其中SAW结合到接合基板，使得提供IDT的保护空间。 接合基板包括其中设置有连接到导电焊盘的外部端子连接构件和外部端子的通孔。 SAW通过包括焊料层的粘合剂层结合到接合衬底。