Abstract:
A writing circuit for a phase change memory is provided. The writing circuit comprises a driving current generating circuit, a first switch device, a first memory cell and a second switch device. The driving current generating circuit provides a writing current to the first memory cell. The first switch device is coupled to the driving current generating circuit. The first memory cell is coupled between the first switch device and the second switch device. The second switch device is coupled between the first memory cell and a ground, wherein when the driving current generating circuit outputs the writing current to the first memory cell, the second switch device is turned on after the first switch device has been turned on for a first predetermined time period.
Abstract:
A panoramic camera system is disclosed that includes an unified optical system, an image capture device, and a processing unit. The unified optical system may include a first set of lenses that guide images received from horizontal directions of a target scene that surrounds the unified optical system. The unified optical system may also include a deflecting device that deflects the images guided through the first set of lenses and a second set of lenses that projects the images deflected by the deflecting device. The image capture device collects the projected images into a determined pattern based on the second set of lenses. Moreover, the processing unit processes the collected images from the image capture device to generate at least one of image signals and video signals representing a panoramic rendition of the target scene.
Abstract:
A method for preparing a multi-level flash memory structure comprises the steps of forming a protrusion in a semiconductor substrate, forming a plurality of storage structures at the sides of the protrusion, forming a dielectric layer overlying the storage structures and the protrusion of the semiconductor substrate, forming a gate structure on the dielectric layer, and forming a plurality of diffusion regions at the sides of the protrusion. Each of the storage structures includes a charge-trapping site and an insulation structure isolating the charge-trapping site from the semiconductor substrate.
Abstract:
An integrated circuit structure comprises a semiconductor substrate, a device region positioned in the semiconductor substrate, an insulating region adjacent to the device region, an isolation structure positioned in the insulating region and including a bottle portion and a neck portion filled with a dielectric material, and a dielectric layer sandwiched between the device region and the insulation region.
Abstract:
A method for preparing a multi-level flash memory comprising the steps of forming a recess in a semiconductor substrate, forming a plurality of storage structures at the sides of the recess, and forming a gate structure having a lower block in the recess and an upper block on the lower block. The storage structures are separated by the gate structure, and each of the storage structures includes a charge-trapping site and an insulation structure surrounding the charge-trapping site.
Abstract:
A data sensing method for a dynamic random access memory including a storage capacitor configured to store data, a bit line, a transistor connecting the storage capacitor and the bit line, a reference bit line, and a sense amplifier connecting the bit line and the reference bit line. The data sensing method comprises the steps of turning off the transistor when the stored data is a predetermined value before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line, and turning on the transistor when the stored data is opposite to the predetermined value such that a charge sharing process occurs between the storage capacitor and a parasitic capacitor of the bit line before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line.
Abstract:
A phase change memory and method for fabricating the same are provided. The phase change memory element includes: a substrate; rectangle-shaped dielectric patterns formed on the substrate and parallel with each other; electric conductive patterns partially covering a first sidewall and the top surface of the dielectric pattern and the substrate to expose the first sidewall and a second sidewall of the dielectric pattern, wherein the electric conductive patterns covering the same dielectric pattern are apart from each other; a phase change spacer formed on the substrate and directly in contact with the exposed first and second sidewalls of the dielectric patterns, wherein the two adjacent electric conductive patterns covering the same dielectric pattern are electrically connected by the phase change spacer; and a dielectric layer formed on the substrate.
Abstract:
A method of fabricating a capacitor over bit line (COB) is provided. First, a substrate is provided and a plurality of word lines is formed on the substrate. Next, a plurality of landing plug contacts (LPCs) are formed between the word lines and a plurality of first contacts is then formed on the LPCs. Thereafter, a plurality of second contacts is formed on a first portions of the first contacts and a plurality of bit lines connecting a second portions of the first contacts is formed, simultaneously. An inter-layer dielectric (ILD) layer is formed on the substrate to cover the second contacts and the bit lines. Subsequently, a plurality of capacitors is formed in the ILD layer. Thus, the fabrication of the capacitor is simplified.
Abstract:
A test key for a semiconductor structure is provided for in-line defecting defects of the contact. The test key is disposed on a scribe line of a wafer substrate, and includes conductive structures and contacts under test. The conductive structures are electrically connected with the substrate and the contacts under test are not electrically connected with the substrate. The conductive structures and the contacts under test are regularly arranged in array. When an electronic beam is utilized to perform in-line monitoring, the normal contacts under test will be shown as bright dots and the bright dots are regularly arranged in the array; any contact under test with defect will be shown as a dark dot which results in an irregular arrangement of the bright dots.
Abstract:
A phase change memory wherein several phase change storage elements are coupled in series to share a single current source. The current provided by the current source is directed by a plurality of switches. To write/read the phase change storage elements, the invention provides techniques to control the current value generated by the current source and controls the states of the switches. The impedance summation of the phase change storage elements vary with the data stored therein.