Abstract:
Semiconductor package containing an integrated-circuit chip, characterized in that it comprises a leadframe formed from spaced-apart electrical connection leads (5), the integrated-chip being fixed to or supported by a front surface of the leads, electrical connection means (16) for connecting the integrated-chip to the electrical connection leads and a block (20) of an encapsulation material in which at least the electrical connection leads are at least partly embedded.
Abstract:
A photodiode comprises three superposed doped regions, namely a first doped region adjacent to a surface (S) of a semiconductor substrate, an intermediate second doped region and a third doped region in contact with the bulk of the substrate. The bulk of the substrate and the second doped region form first and second electrodes of the photodiode, respectively. The photodiode furthermore includes a third electrode in contact with the first doped region. The third electrode comprises an intermediate portion of a first electrically conducting material, placed in contact with the first doped region, and an external connection portion of a second electrically conducting material, placed in contact with the intermediate portion.
Abstract:
The vertical insulated gate transistor includes, on a semiconductor substrate, a vertical pillar incorporating one of the source and drain regions at the top, a gate dielectric layer situated on the flanks of the pillar and on the top surface of the substrate, and a semiconductor gate resting on the gate dielectric layer. The other of the source and drain regions is in the bottom part of the pillar PIL and the insulated gate includes an isolated external portion 15 resting on the flanks of the pillar and an isolated internal portion 14 situated inside the pillar between the source and drain regions. The isolated internal portion is separated laterally from the isolated external portion by two connecting semiconductor regions PL1, PL2 extending between the source and drain regions, and forming two very fine pillars.
Abstract:
The invention provides for a process and a device for de-interlacing a video signal, wherein at output (S) is produced a signal (Sde) of video images de-interlaced by interpolating the pixels missing from the interlaced video signal presented at input (E), the interpolation on the output signal (Sde) being composed selectively (10) from a spatial interpolation (6), based on a transition detection and from a temporal interpolation (8) with a decision being made on the variable degree of presence of spatial interpolation and/or of temporal interpolation in the output signal (Sde), the decision being made as a function of a motion detection in the relevant area of the image, wherein the decision is made additionally as a function of a detection of the detail (2) in a relevant area of the image.
Abstract:
A asynchronous frame receiver includes an input for receiving asynchronous frames. The asynchronous frames include standard characters, and a header that has a data bit length greater than a data bit length of the standard characters. A break character detection unit detects the break character. A standard character processing unit for detecting the standard characters is activated by the break character detection unit based upon the break character being detected.
Abstract:
A process for fabricating an integrated circuit includes forming a gate on a crystalline silicon substrate, and amorphizing a region of the substrate to obtain an amorphous silicon region. Dopant is implanted in a subregion lying substantially within the amorphous silicon region of the substrate to form drain and source extensions. A source and drain are then formed at a low temperature.
Abstract:
A method for generating a signal with a frequency equal to a product of a reference frequency and a real number includes providing an output signal from an oscillator, and performing a first integer division of a frequency of the output signal by a first integer divider to obtain a first intermediate signal. A first measurement signal representative of a time difference between the first intermediate signal and a reference signal having the reference frequency is determined. The method further includes generating a first comparison signal derived from the first measurement signal, and generating a second comparison signal dependent on a period of the reference signal, on integer and decimal parts of the real number and on the first integer divider. The first and second comparison signals are compared to obtain an error signal representative of a time difference between a period of a current output signal and the period of the reference signal. The first integer division is deactivated to deliver an error signal to the input of the oscillator, with the output signal from the oscillator forming the desired signal with a frequency equal to the product of the reference frequency and the real number.
Abstract:
The semiconductor memory device includes a non-volatile programmable and electrically erasable memory cell with a single layer of gate material and a floating gate transistor and a control gate, within an active semiconducting area formed in a region of the substrate and delimited by an isolation region. The layer of gate material in which the floating gate is made extends integrally above the active area without overlapping part of the isolation region, and the transistor is electrically isolated from the control gate by PN junctions that will be inverse polarized.
Abstract:
A memory cell in an EEPROM includes a floating gate transistor that includes a first conducting terminal and a control gate. A method of controlling the memory cell includes setting a state of the memory cell by simultaneously applying voltage pulses of opposite polarities respectively to the first conducting terminal and to the control gate. The voltage pulses including a first portion having a first slope and a second portion having a second slope, wherein the second slope is based upon the polarities of the voltage pulses. The method allows the amplitude of the voltage pulses to be reduced.
Abstract:
In a particular embodiment using a distributed architecture, the electronic device comprises a source memory means partitioned in N elementary source memories for storing a sequence of input data, processing means clocked by a clock signal and having N outputs for producing per cycle of the clock signal N data respectively associated to N input data respectively stored in the N elementary source memories at relative source addresses, N single port target memories, N interleaving tables containing for each relative source address the number of one target memory and the corresponding relative target address therein, N cells connected in a ring structure, each cell being further connected between one output of the processing means, one interleaving table, and the port of one target memory, each cell being adapted to receive data from said output of the processing means and from its two neighbouring cells or to write at least some of these received data sequentially in the associated target memory, in accordance with the contents of said interleaving tables.