Abstract:
An arrangement is for measuring characteristic parameters of intermodulation distortion of a device under test. The arrangement may include a generator of at least two tones at different test frequencies, and an attenuation path feeding the device with a replica of the two tones attenuated of a factor equal to the gain of the device. The arrangement may also include a circuit for generating a difference signal between the signal output by the device and the two tones, and a circuit input with the difference signal and measuring the characteristic parameters as a function thereof.
Abstract:
A method for sensing a back electromotive force induced in a winding of a voice coil electro-mechanical actuator controlled in a discontinuous mode by alternating conduction phases to off-phases includes sensing voltage at terminals of the winding during an off-phase The winding is driven during a conduction phase immediately preceding the off-phase to invert, during a final portion of the conduction phase before entering an off-phase, a direction of flow of the current through the winding.
Abstract:
A dual resistance heater for a phase change material region is formed by depositing a resistive material. The heater material is then exposed to an implantation or plasma which increases the resistance of the surface of the heater material relative to the remainder of the heater material. As a result, the portion of the heater material approximate to the phase change material region is a highly effective heater because of its high resistance, but the bulk of the heater material is not as resistive and, thus, does not increase the voltage drop and the current usage of the device.
Abstract:
A non-volatile memory electronic device is integrated on a semiconductor and is of the Flash EEPROM type with a NAND architecture including at least one memory matrix divided into physical sectors, intended as smallest erasable units, and organized in rows or word lines and columns or bit lines of memory cells. At least one row or word line of a given physical sector is electrically connected to at least one row or word line of an adjacent physical sector to form a single logic sector being erasable, with the source terminals of the corresponding cells of the pair of connected rows referring to a same selection line of a source line.
Abstract:
A control circuit for a pulsed width modulation controller includes a main controlled switch to selectively block an energization signal from a switched mode power supply and a free-wheeling synchronous switch for selectively transferring the energization signal as an output signal. The controller also includes a control circuit that includes: a PWM module having an input terminal, for connection with the switched mode power supply, and a PWM comparator; a drive circuit for the main controlled switch controlled by the PWM comparator; a low-side drive circuit for the free-wheeling synchronous switch controlled by the PWM comparator; and a ramp generator having a synchronization terminal connected to the power supply and a comparator sensing the signal on the synchronization terminal. The ramp signal from the ramp generator defines the threshold of the PWM comparator to thereby control operation of the drive circuits.
Abstract:
A non-volatile memory device includes a chip of semiconductor material. The chip includes a memory and control means for performing a programming operation, an erasing operation and a reading operation on the memory in response to corresponding external commands. The chip further includes testing means for performing at least one test process including the repetition of at least one of said operations by the control means, and a single access element for enabling the testing means.
Abstract:
A current sense amplifier, in particular for low voltage applications, of the type incorporated in a memory electronic device and including a differential amplifier having inputs respectively associated with a matrix circuit leg, connected to a cell to be sensed, and a reference circuit leg, connected a reference cell. At least the matrix circuit leg has a first MOS transistor to which an inverter is connected in a cascode configuration and a first input of the differential amplifier corresponding to the matrix circuit leg is coupled to a conduction terminal of the first MOS transistor and to the bitline of the memory matrix by a second MOS transistor.
Abstract:
The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.
Abstract:
The method for block coding data, such as video data, via a compression operation includes applying to input-data blocks a discrete-cosine-transform (DCT) operation and a quantization operation to produce compressed-data blocks. The compressed-data blocks are subjected to a coding operation to obtain compressed output flows; and an inverse-quantization operation and an inverse-discrete-cosine-transform (IDCT) operation are applied on the compressed-data blocks to obtain reconstructed blocks. The method includes controlling generation of mismatch errors from the input-data blocks by detecting data blocks from the input-data blocks and compressed-data blocks that are liable to cause mismatch errors, and modifying the blocks that are liable to cause mismatch errors prior to the coding operation.
Abstract:
A process manufactures a wafer using semiconductor processing techniques. A bonding layer is formed on a top surface of a first wafer; a deep trench is dug in a substrate of semiconductor material belonging to a second wafer. A top layer of semiconductor material is formed on top of the substrate so as to close the deep trench at the top and form at least one buried cavity. The top layer of the second wafer is bonded to the first wafer through the bonding layer. The two wafers are subjected to a thermal treatment that causes bonding of at least one portion of the top layer to the first wafer and widening of the buried cavity. In this way, the portion of the top layer bonded to the first wafer is separated from the rest of the second wafer, to form a composite wafer.