Abstract:
A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).
Abstract:
A process for forming a microtip cathode structure on a field emission display panel which avoids the need of vacuum depositing a lift-off layer for the microtip deposition overstructure in specially equipped reactors to accomplish a deposition at a grazing angle, by co-patterening the lift-off layer together with an underlying metal grid layer using a succession of different etching steps through the openings of a grid definition mask. According to an embodiment, nickel is used as lift-off material and is either wet-etched or sputter-etched before performing a plasma etch of the underlying grid metal layer. According to an alternative embodiment, the masking resist layer is used as lift-off material.
Abstract:
A CMOS twin-tub negative voltage switching architecture is for a non-volatile memory device and includes a negative voltage multiplier for generating a increased voltage value starting from a single main power supply. A voltage regulator feedback is connected to the voltage multiplier for regulating the generated negative voltage value; and a plurality of independent switch circuits each one receiving as an input the negative voltage value and producing as an output a predetermined local negative voltage.
Abstract:
An operational amplifier frequency self-compensated with respect to closed-loop gain comprises a transconductance input stage and an amplifier output stage connected serially together to receive an input signal on at least one input terminal of the amplifier and generate an amplified signal on an output terminal of the amplifier. Provided between the input and output stages is an intermediate node which is connected to a compensation block to receive a frequency-variable compensation signal therefrom. The compensation block is coupled with its input to the input terminal of the amplifier. The compensation block is connected to receive at least the feedback signal. Preferably, the compensation signal is variable as a function of a gain value which is determined by the feedback circuit, and said variation of the compensation signal occurs in a relationship of inverse proportionality to the gain value.
Abstract:
A MOS transistor capable of withstanding relatively high voltages is of a type integrated on a region included in a substrate of semiconductor material, having conductivity of a first type and comprising a channel region intermediate between a first active region of source and a second active region of drain. Both these source and drain regions have conductivity of a second type and extend from a first surface of the substrate. The transistor also has a gate which includes at least a first polysilicon layer overlying the first surface of at least the channel region, to which it is coupled capacitively through a gate oxide layer. According to the invention, the first polysilicon layer includes a mid-portion which only overlies the channel region and has a first total conductivity of the first type, and a peripheral portion with a second total conductivity differentiated from the first total conductivity. The peripheral portion partly overlies the source and drain active regions toward the channel region.
Abstract:
A process for manufacturing an integrated circuit comprising an array of memory cells, providing for: a) forming in a memory cell array area of a semiconductor layer (6) an active area for the memory cells; b) forming over said active area for the memory cells a gate oxide layer (8); c) forming over the whole integrated circuit a first layer of conductive material (9); d) forming over the first layer of conductive material (9) a layer of insulating material (10); e) removing the layer of insulating material (10) from outside the memory cell array area; f) forming over the whole integrated circuit a second layer of conductive material (11) which in the memory cell array area is separated from the first layer of conductive material (9) by the insulating material layer (10), while outside the memory cell array area is directly superimposed over said first layer of conductive material (9); g) inside the memory cell array area, defining first strips (22) of the second layer of conductive material (11) for forming rows (3) of the memory cell array (1), and outside the memory cell array area defining second strips (17) of the second layer of conductive material (11) for forming interconnection lines (100) for electrically interconnecting the rows (3) of the memory cell array with a circuitry (5,RD) said, first strips (22) and the second strips (17) of the second layer of conductive material (11) are automatically joined at respective ends thereof at said boundary region.
Abstract:
In switch-capacitor systems for extremely low supply voltage, employing a fully differential switched op-amp, proper functioning of nMOS switches coupled to the inverting input node of an integrated stage capable of outputting a common mode control signal is made possible by retaining the ground potential on the input node to prevent body effects on the threshold of nMOS switches by means of an auxiliary switched capacitor.
Abstract:
A fast operating, electronic overvoltage protection device intended for a power transistor having at least one control terminal of the MOS type is disclosed. The device comprises a Zener diode associated with the power transistor and integrated together therewith in a semiconductor substrate, and a second transistor connected to the power transistor into a Darlington configuration and also connected to the Zener diode. The protection from overvoltages provided by the device is very fast in operation, and can be implemented in integrated form at reduced cost and without introducing parasitic elements.
Abstract:
A circuit for detecting the coincidence between a binary information unit stored therein and an external datum comprises at least one programmable memory element, a sensing circuit for reading a datum stored in the programmable memory element and a digital comparator for comparing the datum stored in the programmable memory element with the external datum. The sensing circuit comprises a bistable latch having at least one set input coupled to the programmable memory element and an output suitable to take either one of two logic levels according to a programming state of the programmable memory element, the output supplying directly the digital comparator.
Abstract:
A digital-to-analog converter includes a potentiometric string suitable for realizing a relatively high number of bits that significantly reduces the silicon area requirement and simplifies mismatch compensation. The structure includes a first resistance string to realize a first DAC to convert a first number of most significative bits, and a second potentiometric string functionally connected in cascade to the first, but realized with MOS transistors. The structure of the invention allows the coupling of the two DACs in cascade by exploiting the MOS transistors that form the second potentiometric string, that is, the second DAC, thus avoiding the use of operational switches or amplifiers which may provide error sources. Moreover, the structure of the invention lends itself to the implementation of efficient compensation circuits for integral and differential linearity errors.