公开(公告)号：US20080197475A1

公开(公告)日：2008-08-21

申请号：US11822113

申请日：2007-07-02

Applicant: Cheng Tang Huang

Inventor： Cheng Tang Huang

IPC: H01L23/488

CPC classification number: H01L24/11 ,  H01L23/525 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays the metallic layer of the semiconductor substrate and has a receiving space. The lifting layer and conductive layer are formed in the receiving space, wherein the conductive layer extends for connection to a bump. The lifting layer is partially connected to the dielectric layer. As a result, the conductive layer can be stably deposited on the edge of the dielectric layer for enhancing the reliability of the packaging conductive structure.

Abstract translation: 提供了一种用于半导体衬底的封装导电结构以及用于形成该结构的方法。 包装导电结构的电介质层部分覆盖半导体衬底的金属层并具有接收空间。 提升层和导电层形成在接收空间中，其中导电层延伸以连接到凸块。 提升层部分连接到电介质层。 结果，导电层可以稳定地沉积在电介质层的边缘上，以提高封装导电结构的可靠性。

公开(公告)号：US20080197467A1

公开(公告)日：2008-08-21

申请号：US11898612

申请日：2007-09-13

Applicant: J.B. Chyi ,  Cheng Tang Huang

Inventor： J.B. Chyi ,  Cheng Tang Huang

IPC: H01L23/495 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/116 ,  H01L2224/13007 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/013

Abstract: A conductive structure for a semiconductor integrated circuit and method for forming the conductive structure are provided. The semiconductor integrated circuit has a pad and a passivation layer partially covering the pad to define a first opening portion having a first lateral size. The conductive structure electrically connects to the pad via the first opening portion. The conductive structure comprises a support layer defining a second opening portion. A conductor is formed in the second opening portion to serve as a bump having a planar top surface.

Abstract translation: 提供了一种用于半导体集成电路的导电结构和用于形成导电结构的方法。 半导体集成电路具有焊盘和钝化层，其部分地覆盖焊盘以限定具有第一横向尺寸的第一开口部分。 导电结构经由第一开口部分电连接到焊盘。 导电结构包括限定第二开口部分的支撑层。 导体形成在第二开口部分中以用作具有平坦顶表面的凸块。

公开(公告)号：US20050168522A1

公开(公告)日：2005-08-04

申请号：US11072600

申请日：2005-03-04

Applicant: Ah Tee ,  Cherng Teo ,  Cheng Tang

Inventor： Ah Tee ,  Cherng Teo ,  Cheng Tang

IPC: B41J2/165

CPC classification number: B41J2/16538

Abstract: An inkjet printhead squeegee is split on one side so that its wiping force on a printhead is highest on the front stroke and much lighter on the backstroke when the surface is dry. Alternatively, the split can be arranged so that the front stroke is light enough to leave the printhead wet, and then the backstroke is much firmer to completely squeegee the printhead dry. The result is high pressure strokes on a dry printhead are avoided.

公开(公告)号：US06839348B2

公开(公告)日：2005-01-04

申请号：US09303296

申请日：1999-04-30

Applicant: Cheng Tang ,  Chickayya G. Naik

Inventor： Cheng Tang ,  Chickayya G. Naik

IPC: H04L12/18 ,  H04L12/46 ,  H04L12/56 ,  H04L12/28

CPC classification number: H04L45/16 ,  H04L12/18 ,  H04L12/185 ,  H04L12/4645 ,  H04L45/04

Abstract: The invention relates to a system and method for efficiently distributing multicast messages within computer networks configured to have one or more virtual local area network (VLAN) domains. A multicast network device (MND), having a plurality of interfaces, includes a multicast controller for efficiently distributing multicast messages among subscribing entities associated with various VLAN domains. The multicast controller, which is in communicating relationship with the interfaces, includes a VLAN assignment engine for assigning responsibility for the VLAN domains to the extent there are multiple MNDs. The multicast controller also accesses a multicast tag source to establish a plurality of novel VLAN tags for efficiently distributing multicast messages, including a sub-regional Multicast VLAN Identifier (MVLAN-ID) that encompasses all of the VLAN domains for which the respective MND is responsible, and one or more color-limited MVLAN-IDs that encompass all of the VLAN domains for which the MND is responsible except for one. The multicast controller then tags multicast messages with its sub-regional or a color-limited MVLAN-ID depending on whether the message is considered internal or external by the respective MND. The tagged messages are then forwarded for distribution to the subscribers associated with the various VLAN domains.

公开(公告)号：US06812234B2

公开(公告)日：2004-11-02

申请号：US10425167

申请日：2003-04-29

Applicant: Richard Jiao ,  Gregori Morriello ,  Lihu Yang ,  Stephen D. Goble ,  Sander G. Mills ,  Alexander Pasternak ,  Changyou Zhou ,  Gabor Butora ,  Shankaran Kothandaraman ,  Deodialsingh Guiadeen ,  Christopher Moyes ,  Cheng Tang

Inventor： Richard Jiao ,  Gregori Morriello ,  Lihu Yang ,  Stephen D. Goble ,  Sander G. Mills ,  Alexander Pasternak ,  Changyou Zhou ,  Gabor Butora ,  Shankaran Kothandaraman ,  Deodialsingh Guiadeen ,  Christopher Moyes ,  Cheng Tang

IPC: A61K314375

CPC classification number: C07D471/04

Abstract: The present invention is directed to compounds of the formula I: (wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, X, n and the dashed line are defined herein) which are useful as modulators of chemokine receptor activity. In particular, these compounds are useful as modulators of the chemokine receptor CCR-2.

Abstract translation: 本发明涉及式I化合物：其中R 1，R 2，R 3，R 4，R 5，R 6，R 7，R 7， R 9，R 10，X，n和虚线在本文中定义），其可用作趋化因子受体活性的调节剂。 特别地，这些化合物可用作趋化因子受体CCR-2的调节剂。

公开(公告)号：US06251565B1

公开(公告)日：2001-06-26

申请号：US09376665

申请日：1999-08-16

Applicant: Hsi-Harng Yang ,  Min-Chieh Chou ,  Cheng-Tang Pan ,  Chuan-Kang Mu

Inventor： Hsi-Harng Yang ,  Min-Chieh Chou ,  Cheng-Tang Pan ,  Chuan-Kang Mu

IPC: C25D110

CPC classification number: C25D1/10 ,  B81C99/009 ,  G03F7/0035 ,  Y10S430/168

Abstract: A method of making molds for use in manufacturing high precision and high density multiple-lead microstructures. If employs microphoto etching process used in semiconductor manufacturing process to project X-ray and ultraviolet light on a photoresist layer through a X-ray co-mask and a generally used mask to produce exposing process. Through etching and electroplating processes, a plurality of identical punch molds may be made. The punch molds are aligned stacked up one upon the other until a desired height is reached. The stacked up punch molds are electroplated to form a lead punch die for producing microparts desired.

Abstract translation: 一种制造用于制造高精度和高密度多铅微结构的模具的方法。 如果使用半导体制造工艺中使用的微照片蚀刻工艺通过X射线辅助掩模和通常使用的掩模将X射线和紫外光投影在光致抗蚀剂层上以产生曝光过程。 通过蚀刻和电镀工艺，可以制成多个相同的冲模。 冲压模具一个一个地堆叠在一起直到达到所需的高度。 堆叠的冲压模具被电镀以形成用于生产所需的微孔的铅冲模。

公开(公告)号：US20230111986A1

公开(公告)日：2023-04-13

申请号：US17905345

申请日：2021-03-19

Applicant: Nikolaos KAVALOPOULOS ,  Roderich RÖMHILD ,  Po-Cheng TANG ,  Johan KREUGER ,  Dan ANDERSSON

Inventor： Nikolaos KAVALOPOULOS ,  Roderich RÖMHILD ,  Po-Cheng TANG ,  Johan KREUGER ,  Dan ANDERSSON

IPC: C12Q1/20 ,  C12M1/32

Abstract: A cell population (55) is cultured on a cell culture substrate (50) while agents contained in agent reservoirs (31, 33, 35) at predefined positions in a culture container (10) diffuse through the substrate (50) and form at least partly overlapping concentration gradients in the substrate (50) within combination areas (41, 43, 45) and substantially non-overlapping concentration gradients in the substrate (50) peripheral to an outer boundary of the agent reservoirs (31, 33, 35). Inhibition end points (61, 63, 65) of respective inhibition zones (60, 62, 64) substantially lacking any growth of the cell population (55) peripheral to the outer boundary of the agent reservoirs (31, 33, 35) and growth end points (71, 73, 75) of respective growth zones (70, 72, 74) comprising growth of the cell population (55) within the combination areas (41, 43, 45) are determined and used to determine interaction effects between the agents on the cell population (55).

公开(公告)号：US08612186B2

公开(公告)日：2013-12-17

申请号：US13038330

申请日：2011-03-01

Applicant: Cheng-Tang Wu ,  Wei Hu

Inventor： Cheng-Tang Wu ,  Wei Hu

IPC: G06F17/50 ,  G06F7/60 ,  G06G7/48

CPC classification number: G06F17/5018

Abstract: System, method and software product for numerically simulating structural behaviors of an engineering product in compressible and near-incomprssible region is disclosed. Meshfree enriched finite element method (ME-FEM) is used for such numerical simulation. ME-FEM requires an engineering product be represented by a FEM model comprising a plurality of finite elements. Finite elements used in the ME-FEM are generally low-order finite elements. Each of the finite elements in the FEM model is enriched by at least one meshfree enriched (ME) node located within the element's domain. Each ME node has additional degrees-of-freedom for the element it belongs independent from those of the corner nodes. A displacement based first-order convex meshfree approximation is applied to the ME node. The convex meshfree approximation has Knonecker-delta property at the element's boundary. The gradient matrix of ME-FEM element satisfies integration constraint. ME-FEM interpolation is an element-wise meshfree interpolation that is discrete divergence-free at the incompressible limit.

Abstract translation: 公开了一种用于数值模拟工程产品在可压缩和近不可逆区域中的结构行为的系统，方法和软件产品。 无网格富集有限元法（ME-FEM）用于这种数值模拟。 ME-FEM要求工程产品由包括多个有限元素的FEM模型表示。 ME-FEM中使用的有限元素通常是低阶有限元。 FEM模型中的每个有限元素都由位于元素域内的至少一个无网格富集（ME）节点来丰富。 每个ME节点对于其所属的元件具有额外的自由度，独立于角点节点。 基于位移的一阶凸无网格近似被应用于ME节点。 凸无网格近似在元素边界处具有Knonecker-delta属性。 ME-FEM元素的梯度矩阵满足积分约束。 ME-FEM插值是在不可压缩极限处为离散无差异的元素无网格内插。

公开(公告)号：US20130089670A1

公开(公告)日：2013-04-11

申请号：US13464765

申请日：2012-05-04

Applicant: Yi-Che Su ,  Ya-Tin Yu ,  Yun-Shan Huang ,  Wei-Cheng Tang ,  Yuung-Ching Sheen

Inventor： Yi-Che Su ,  Ya-Tin Yu ,  Yun-Shan Huang ,  Wei-Cheng Tang ,  Yuung-Ching Sheen

IPC: B05D5/00 ,  B05D3/00 ,  C09D5/00

CPC classification number: C09D5/1675

Abstract: A method of manufacturing a hydrophobic coating material, including: (a) mixing a siloxane precursor, water, and a catalyst to proceed with a sol-gel reaction to form a solution having particles therein, wherein the sol-gel reaction is performed without using any organic solvent; (b) chemically modifying the particles with a hydrophobic agent to form surface-modified particles; and (c) adding a surfactant to the solution containing the surface-modified particles to form a hydrophobic coating material. A hydrophobic coating material and a hydrophobic coating formed by the hydrophobic coating material are also provided. The hydrophobic coating material may preferably have a low VOC (Volatile organic compound) value, and may disperse in a water phase solution.

Abstract translation: 一种制造疏水性涂料的方法，包括：（a）将硅氧烷前体，水和催化剂混合以进行溶胶 - 凝胶反应以形成其中具有颗粒的溶液，其中在不使用溶胶 - 凝胶反应的情况下进行溶胶 - 凝胶反应 任何有机溶剂; （b）用疏水剂化学改性颗粒以形成表面改性的颗粒; 和（c）在含有表面改性粒子的溶液中加入表面活性剂以形成疏水性涂料。 还提供疏水涂层材料和由疏水涂层材料形成的疏水涂层。 疏水性涂料优选具有低VOC（挥发性有机化合物）值，并且可分散在水相溶液中。

公开(公告)号：US08284925B2

公开(公告)日：2012-10-09

申请号：US11778904

申请日：2007-07-17

Applicant: Jui Yuan Tsai ,  Wen Chi Wang ,  Wei Cheng Tang

Inventor： Jui Yuan Tsai ,  Wen Chi Wang ,  Wei Cheng Tang

IPC: H04M3/00

CPC classification number: H04M1/72527 ,  H03M11/24 ,  H04M1/6058

Abstract: A jack detection circuit includes a transition circuit and an AD converter. The transition circuit linearizes analog signals sent from a switching circuit. The AD converter converts the linearized analog signals to digital output signals thereby decreasing the complexity of signal recognition.

Abstract translation: 插座检测电路包括转换电路和AD转换器。 转换电路将从开关电路发送的模拟信号线性化。 AD转换器将线性化模拟信号转换为数字输出信号，从而降低信号识别的复杂度。