公开(公告)号：US06555893B1

公开(公告)日：2003-04-29

申请号：US10054934

申请日：2002-01-25

Applicant: David Cheng-Hsiung Chen ,  Joe Ko

Inventor： David Cheng-Hsiung Chen ,  Joe Ko

IPC: H01L2900

CPC classification number: H01L23/5227 ,  H01L21/761 ,  H01L23/5222 ,  H01L27/08 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: The present invention provides a bar circuit for reducing cross talk and eddy current of an integrated circuit. The bar circuit comprises a semiconductor substrate with a first conductivity type; a strip of first well with a second conductivity type in the semiconductor substrate; and a strip of second well with the second conductivity type in the semiconductor substrate. The strip of second well is located below and adjacent to the strip of first well, whereby forms a junction barrier for reducing the cross talk and the eddy current.

Abstract translation: 本发明提供一种用于减少集成电路的串扰和涡电流的条形电路。 棒电路包括具有第一导电类型的半导体衬底; 在半导体衬底中具有第二导电类型的第一阱条; 以及在半导体衬底中具有第二导电类型的第二阱条。 第二井的条带位于第一井的下方并且邻近第一井的条带，由此形成用于减少串扰和涡流的连接屏障。

公开(公告)号：US06454519B1

公开(公告)日：2002-09-24

申请号：US08813480

申请日：1997-03-07

Applicant: Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

Inventor： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC: B65G4905

CPC classification number: H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US06366103B1

公开(公告)日：2002-04-02

申请号：US09348751

申请日：1999-07-06

Applicant: David Cheng

Inventor： David Cheng

IPC: G01R1073

CPC classification number: G01R31/2887

Abstract: A multiple test probe system is disclosed. The multiple test probe system includes a support and a mount pivotally coupled to the support. The mount is capable of pivoting to a number of testing positions. A number of probe assemblies are coupled to the mount and associated with a corresponding number of testing positions. The probe assemblies include a number of electrical contacts coupled to a number of wires in a probe bus regardless of a testing position of the mount. The multiple test probe system further includes an actuator coupled to the mount to cause the mount to move between the testing positions.

Abstract translation: 公开了一种多重测试探针系统。 多个测试探针系统包括支撑件和枢转地联接到支撑件的安装件。 该安装座能够枢转到多个测试位置。 多个探针组件耦合到安装件并与相应数量的测试位置相关联。 探针组件包括耦合到探针总线中的多个电线的多个电触头，而与安装座的测试位置无关。 多个测试探针系统还包括联接到安装件的致动器，以使安装件在测试位置之间移动。

公开(公告)号：US6154041A

公开(公告)日：2000-11-28

申请号：US258066

申请日：1999-02-26

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B7/06 ,  G01R27/02 ,  G01R31/26 ,  G01R31/02

CPC classification number: G01R27/02 ,  G01B7/06 ,  G01R31/2648

Abstract: A method and apparatus for measuring sheet resistance and thickness of thin films and substrates. A four-point probe assembly engages the surface of a film on a substrate, and the thickness of the substrate is determined from the point of contact between the probes and film. A measuring apparatus then outputs a voltage waveform which applies a voltage to probes of the probe assembly. An inverter inverts the voltage and provides the inverted voltage on another probe of the probe assembly, thus inducing a current in these probes of the four point probe and through the surface of the film. Two other probes measure a voltage in the film created by the current. The voltages on the current probes provide a voltage close to zero at the other probes, thus allowing these other probes to measure voltages with greater precision. The current created by the voltage waveform and the voltage created across the inner probes are measured for each voltage level of the waveform. A sheet resistance of the film is determined by calculating the slope of a least square fit line of the measured current and voltage. The sheet resistance is proportional to the slope of the least square line. The thickness of the film is calculated by dividing the film resistivity by the calculated sheet resistance.

Abstract translation: 一种用于测量薄膜和薄膜的薄层电阻和厚度的方法和装置。 四点探头组件接合衬底上的膜的表面，并且从探针和膜之间的接触点确定衬底的厚度。 然后，测量装置输出对探针组件的探头施加电压的电压波形。 逆变器反转电压并在探针组件的另一个探针上提供反相电压，从而在四点探针的这些探针中并通过膜的表面引起电流。 另外两个探头测量由电流产生的电影中的电压。 电流探头上的电压在其他探头上提供接近零的电压，从而允许其他探头以更高的精度测量电压。 针对波形的每个电压电平测量由电压波形产生的电流和内部探针产生的电压。 通过计算测量的电流和电压的最小二乘拟合线的斜率来确定膜的薄层电阻。 薄层电阻与最小二乘线的斜率成比例。 通过将膜电阻率除以计算的薄层电阻来计算膜的厚度。

公开(公告)号：US5708279A

公开(公告)日：1998-01-13

申请号：US613674

申请日：1996-03-11

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00 ,  G01N21/86

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.

Abstract translation: 一种用于测量表面形貌的方法，其特征在于用激光扫描单元对表面进行多次扫描，并利用多次扫描来创建表面的地形图。 表面形貌数据也可用于计算由施加到半导体晶片表面的薄膜引起的压缩或拉伸应力。 本发明的装置沿x方向扫描激光束的表面，并且检测激光束在z方向上的反射部分的位移。 一对光电探测器用于将反射光束的z方向位移转换为模拟信号，并将其数字化并输入微型计算机进行分析。 表面的多次扫描优选通过将工件放置在可旋转到各种角度位置的基座上来实现。

公开(公告)号：US5292393A

公开(公告)日：1994-03-08

申请号：US808786

申请日：1991-12-16

Applicant: Dan Maydan ,  Sasson Somekh ,  David N. Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

Inventor： Dan Maydan ,  Sasson Somekh ,  David N. Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

IPC: H01L21/00 ,  C23C16/00 ,  B65G1/06

CPC classification number: H01L21/67167 ,  H01L21/67201

Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R-.theta. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.

Abstract translation: 公开了一种集成的模块化多室真空处理系统。 该系统包括一个加载锁定，可以包括一个外部盒式电梯和一个内部装载锁定晶片升降机，并且还包括围绕负载锁的周边的站，用于将一个，两个或几个真空处理室连接到负载锁定室。 机器人被安装在装载锁中，并且利用通过双重四杆连杆机构连接到端部执行器的同心轴驱动系统，用于将选定的R（θ）运动传递到叶片以在外部升降机上加载和卸载晶片， 内部电梯和各个处理室。 该系统独特地适用于实现各种类型的IC处理，包括蚀刻，沉积，溅射和快速热退火室，从而为使用不同工艺的多步骤顺序处理提供了机会。

公开(公告)号：US5028565A

公开(公告)日：1991-07-02

申请号：US398653

申请日：1989-08-25

Applicant: Mei Chang ,  Cissy Leung ,  David N. Wang ,  David Cheng

Inventor： Mei Chang ,  Cissy Leung ,  David N. Wang ,  David Cheng

IPC: C23C16/06 ,  C23C16/08 ,  C23C16/22 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/768

CPC classification number: H01L21/76838 ,  H01L21/28556 ,  H01L21/32051 ,  Y10S148/025

Abstract: An improved process is disclosed for the deposition of a layer of tungsten on a semiconductor wafer in a vacuum chamber wherein the improvements comprise depositing tungsten on the semiconductor wafer in the presence of nitrogen gas to improve the reflectivity of the surface of the resulting layer of tungsten; maintaining the vacuum chamber at a pressure of from about 20 to 760 Torr to improve the deposition rate of the tungsten, as well as to improve the reflectivity of the tungsten surface; and, when needed, the additional step of forming a nucleation layer on the semiconductor layer prior to the step of depositing tungsten on the semiconductor wafer to improve the uniformity of the deposited tungsten layer.

公开(公告)号：US4668338A

公开(公告)日：1987-05-26

申请号：US814638

申请日：1985-12-30

Applicant: Dan Maydan ,  Sasson Somekh ,  Mei Cheng ,  David Cheng

Inventor： Dan Maydan ,  Sasson Somekh ,  Mei Cheng ,  David Cheng

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: H01J37/32623 ,  H01J37/3266 ,  H01L21/31116 ,  H01L21/32137 ,  H01J2237/3341

Abstract: A magnetically-enhanced, variable magnetic field, RIE mode plasma etch process for etching materials such as dielectrics and polycrystalline, is disclosed. The variable magnetic field permits optimization of selected characteristics such as etch rate, etch selectivity, ion bombardment and radiation damage, etch uniformity, and etch anisotropy.

Abstract translation: 公开了用于蚀刻诸如电介质和多晶的材料的磁增强型可变磁场RIE模式等离子体蚀刻工艺。 可变磁场允许优化所选择的特性，例如蚀刻速率，蚀刻选择性，离子轰击和辐射损伤，蚀刻均匀性和蚀刻各向异性。

公开(公告)号：US4130898A

公开(公告)日：1978-12-19

申请号：US828801

申请日：1977-08-29

Applicant: John C. Urbach ,  David Cheng

Inventor： John C. Urbach ,  David Cheng

IPC: G11B7/09 ,  G11B7/125 ,  G11C13/04 ,  G11C13/08 ,  G11C7/00

CPC classification number: G11B7/128 ,  G11C13/048

Abstract: An optical data recording system in which during recording the writing beam is made to move at the same velocity as the recording medium whereby motion blur is minimized or reduced. Movement of the writing beam at the same velocity as the recording medium is achieved by supplying a constantly varying frequency RF signal to an acousto-optic device which deflects (diffracts) the writing beam in accordance with the instantaneous frequency of the RF signal. The acousto-optic device can also be utilized to amplitude modulate the writing beam.

Abstract translation: 一种光学数据记录系统，其中在记录写入光束期间以与记录介质相同的速度移动，由此运动模糊被最小化或减小。 通过向声光装置提供恒定变化的频率RF信号，根据RF信号的瞬时频率偏转（衍射）写入光束来实现与记录介质以相同速度的写入光束的移动。 声光装置也可用于幅度调制书写光束。

公开(公告)号：US20140068981A1

公开(公告)日：2014-03-13

申请号：US13614149

申请日：2012-09-13

Applicant: David Cheng ,  Jocelynn Cheng

Inventor： David Cheng ,  Jocelynn Cheng

IPC: G09F3/10

CPC classification number: G09F3/10

Abstract: The device described herein includes self-adhering graphics presented in a multiple perspectives so that when applied to structural containers, such as cardboard boxes, the containers are transformed, child playthings.

Abstract translation: 本文描述的装置包括以多个视角呈现的自粘附图形，使得当应用于诸如纸板箱的结构容器时，容器被转换，儿童玩具。