公开(公告)号：US20090321109A1

公开(公告)日：2009-12-31

申请号：US12352090

申请日：2009-01-12

申请人： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

发明人： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

IPC分类号： H05K7/20 ,  H05K3/10

CPC分类号： B82Y10/00 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/183 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0108 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述凹槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。

公开(公告)号：US20090301767A1

公开(公告)日：2009-12-10

申请号：US12222177

申请日：2008-08-04

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： H05K3/10 ,  H05K1/00

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density.

摘要翻译： 公开了一种印刷电路板，其包括使用包括碳纳米管和感光性粘合剂的导电浆料形成的凸块。 还提供了制造印刷电路板的方法。 印刷电路板包括使用具有碳纳米管的导电膏形成的凸块，并且可以实现与安装在其上的电子部件的良好的电连接。 可以以细间距形成凸块，从而实现高密度的电路层。

公开(公告)号：US20090294956A1

公开(公告)日：2009-12-03

申请号：US12219442

申请日：2008-07-22

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467 ,  F28F7/00 ,  H01L21/58 ,  B21D53/02

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin.

摘要翻译： 本发明公开了一种冷却翅片，其冷却性能优良，制造简单，包括冷却翅片的封装基板及其制造方法。 含有碳成分的可燃糊剂被施加到模具的凹槽中，从而形成具有对应于凹槽的图案的冷却翅片。 因此，能够制造具有各种构造的散热片，从而提高包含冷却片的封装基板的冷却性能。

公开(公告)号：US20080009146A1

公开(公告)日：2008-01-10

申请号：US11645710

申请日：2006-12-27

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H01R12/00

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 公开了一种印刷电路板及其制造方法。 一种印刷电路板，由绝缘基板构成，绝缘基板包括绝缘层，形成在绝缘层的一侧上的电路图形，以及与该绝缘层相连接且与电路图案电连接的层间通道， 层叠在绝缘层的另一侧的层叠层可以通过由放热形成的内层或接地层提供高的散热效果和高的抗弯强度 层。

公开(公告)号：US20070107934A1

公开(公告)日：2007-05-17

申请号：US11598140

申请日：2006-11-13

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 利用使用糊状凸块的印刷电路板的制造方法，其特征在于，包括：（a）对芯板进行穿孔以形成至少一个通孔，（b）通过填充电镀填充所述至少一个通孔并形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路， 可以通过增加镀层芯板的BVH的强度来实现层IVH结构，由于并行处理和集体堆叠，可以减少制造时间，由于粘贴凸块的铜箔可实现微电路 堆叠在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且凹坑覆盖可以 获得。