Abstract:
A multilayer substrate minimizing differential loss is presented. The multilayer substrate for providing signals between an integrated circuit and a printed circuit board consists of a number of alternating electrically conductive and insulating layers. Differential signals are routed through the core insulating layer using differential pairs of plated through holes (PTHs). In addition, the multilayer substrate includes a number of plated through holes, which provide ground signals between conductive layers separated by the core layer. The multilayer substrate is configured such that a PTH providing ground is situated between each differential pair of plated ground holes, where the center or axis of each plated through hole is aligned in a collinear configuration.
Abstract:
The present invention provides an OSGi-based heterogeneous service integrating system comprising a Java virtual machine and an OSGi container, the system further comprises a service management module, a handler management module, a monitor module, a service discovery module and a handler module that are running on said OSGi container, wherein: said service management module is adapted to monitor requests for registering and using of a remote service, to manage different types of services, and to notify said handler management module to make corresponding publishing and calling for different service configuration types; said handler management module is adapted to manage said handler module and to publish service to and call service from remote end points, and to call the corresponding handler module based on information delivered by the service management module, and to maintain information of currently published services and adopted remote services; said monitor module is adapted to monitor a local service registry in said OSGi container and to obtain information to be monitored from the service management module; said service discovery module is adapted to make remote service discovery; and said handler module is adapted to realize access of a module within the OSGi container to a service outside the OSGi container.
Abstract:
The present invention discloses a solar lamp which includes a bottom seat, a housing, a solar cell, a control circuit board, rechargeable batteries and LEDs. The solar cell is installed at a top of the housing, the control circuit board, the rechargeable batteries and the LEDs are installed inside the housing, the top of the housing is provided with a top ornament and a lower side of the housing is supported by the bottom seat. The present invention enables a solar cell to have a larger power and the top ornament can compensate for incompleteness of the shape.
Abstract:
This invention relates to a method and apparatus for estimating artifacts in the image reconstruction of an object of interest (101). The inventive apparatus comprises a coil arrangement (105) comprising at least one transmitting coil (109, 109′) for generating a primary magnetic field to be applied to the object of interest (101), and at least one measurement coil (110, 110′) for measuring electrical signals induced by a secondary magnetic field, the secondary magnetic field being generated by the object of interest in response to the primary magnetic field; motion sensing means (112, 114, 112′, 114; 312, 314, 312′, 314′) for sensing a relative motion between the object of interest (101) and the coil arrangement (105) and generating a trigger signal when the relative motion occurs; and a processor (125) for calculating, in response to the trigger signal, a change of the conductivity distribution of the object of interest, based on the electrical signals measured before and after the relative motion, the change of the conductivity distribution representing artifacts caused by the relative motion.
Abstract:
A packaging structure and process of solar cell is disclosed. The packaging structure of solar cell comprises two conductive films and two surface electrodes disposed on a photovoltaic cell (PV cell), wherein two conductive films are respectively electrically coupled with the surface electrodes via a plurality of solder balls.
Abstract:
A method and apparatus for subcarrier selection for systems is described. In one embodiment, the system employs orthogonal frequency division multiple access (OFDMA). In one embodiment, a method for subcarrier selection comprises a subscriber measuring channel and interference information for subcarriers based on pilot symbols received from a base station, the subscriber selecting a set of candidate subcarriers, providing feedback information on the set of candidate subcarriers to the base station, and receiving an indication of subcarriers of the set of subcarriers selected by the base station for use by the subscriber.
Abstract:
Engineered antibodies to human IL-23p19 are provided, as well as uses thereof, e.g. in treatment of inflammatory, autoimmune, and proliferative disorders.
Abstract:
A method and apparatus for subcarrier selection for systems is described. In one embodiment, the system employs orthogonal frequency division multiple access (OFDMA). In one embodiment, a method for subcarrier selection comprises a subscriber measuring channel and interference information for subcarriers based on pilot symbols received from a base station, the subscriber selecting a set of candidate subcarriers, providing feedback information on the set of candidate subcarriers to the base station, and receiving an indication of subcarriers of the set of subcarriers selected by the base station for use by the subscriber.
Abstract:
A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.
Abstract:
A method is provided, comprising: copolymerizing a monomer comprising at least two amide groups, a monomer of formula (a) and a sulfonic acid or salt monomer, wherein R1 is CH3 or H. A polymer made by the method is provided. A method for coating an electrode is provided, comprising: providing an electrode; providing a solution of a free radical initiator, a monomer comprising at least two amide groups, a monomer of formula (a) and a sulfonic acid or salt monomer; wetting the electrode with the solution; and heating the wetted electrode; whereby the monomer comprising at least two amide groups, the monomer of formula (a), and the sulfonic acid or salt monomer are copolymerized; wherein R1 is CH3 or H. An electrode coated by the method is provided.