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    WIRE GRID POLARIZER AND BACKLIGHT UNIT USING THE SAME
    31.
    发明申请
    WIRE GRID POLARIZER AND BACKLIGHT UNIT USING THE SAME 有权
    使用相同的网格偏振器和背光单元

    公开(公告)号：US20120075830A1

    公开(公告)日：2012-03-29

    申请号：US13240028

    申请日：2011-09-22

    Applicant: YOUNG-JAE LEE ,  Jin Su Kim ,  Jun Lee

    Inventor： YOUNG-JAE LEE ,  Jin Su Kim ,  Jun Lee

    IPC: F21V9/14 ,  G02B5/30

    CPC classification number: G02B5/3058

    Abstract: Provided is a wire grid polarizer and a backlight unit using the wire grid polarizer. The wire grid polarizer comprises a first grid layer thrilled on a substrate and provided with at least one of a first grid pattern, and a second grid layer formed on the first grid pattern and provided with at least one of a second grid pattern made of metal material wherein the first grid layer is made of high molecular substance having a lower refraction index than that of the substrate.According to the present invention, by forming a first grid pattern on a substrate using a high molecular substance layer and by forming a metal grid pattern on the first grid pattern, transmission rates of respective wavelengths depending on light angles of incident light are controlled and thereby minimizing color variations depending on view angle.

    Abstract translation: 提供了使用线栅偏振器的线栅偏振器和背光单元。 线栅偏振器包括在衬底上激发的第一栅格层，并且设置有形成在第一栅格图案上的第一栅格图案和第二栅格层中的至少一个，并且设置有由金属制成的第二栅格图案中的至少一个 材料，其中第一栅格层由具有比衬底的折射率低的折射率的高分子物质制成。 根据本发明，通过使用高分子物质层在基板上形成第一栅格图案，并且在第一栅格图案上形成金属栅格图案，控制根据入射光的光角度的各波长的透射率，由此 最小化取决于视角的颜色变化。

    Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer
    33.
    发明授权
    Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer 失效
    具有外部端子焊盘的堆叠半导体芯片封装和具有保护层的可堆叠芯片

    公开(公告)号：US06188129B1

    公开(公告)日：2001-02-13

    申请号：US09046136

    申请日：1998-03-23

    Applicant: Kyung Wook Paik ,  Jin Su Kim ,  Hyoung Soo Ko

    Inventor： Kyung Wook Paik ,  Jin Su Kim ,  Hyoung Soo Ko

    IPC: H01L2302

    CPC classification number: H01L25/0657 ,  H01L2224/16 ,  H01L2224/16108 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551

    Abstract: The stackable semiconductor chip includes a semiconductor chip having pads on an upper surface thereof, and an adhesive formed on lateral surfaces of the semiconductor chip. A first insulation layer is formed over the upper surface of the semiconductor chip and the adhesive, and defines a plurality of through holes which expose the pads. Metal lines, formed on the first insulation layer, are connected to a respective one of the pads via a respective one of the through holes. A protective layer is formed on the metal lines and the first insulation layer. A plurality of stackable semiconductor chips are stacked by disposing double-sided adhesive between the stackable semiconductor chips. Then a plurality of external terminal pads are formed on one of the lateral surfaces of the stack of stackable semiconductor chips. Each external terminal pad is electrically connected to at least one of the metal lines in one of the stackable semiconductor chips. Next, a solder ball is formed on each of the plurality of external terminal pads to produce a stacked semiconductor chip package.

    Abstract translation: 可堆叠半导体芯片包括其上表面具有焊盘的半导体芯片和形成在半导体芯片的侧表面上的粘合剂。 第一绝缘层形成在半导体芯片和粘合剂的上表面上，并且限定了暴露焊盘的多个通孔。 形成在第一绝缘层上的金属线通过相应的一个通孔连接到相应的一个焊盘。 在金属线和第一绝缘层上形成保护层。 通过在可堆叠的半导体芯片之间设置双面粘合剂来堆叠多个可堆叠的半导体芯片。 然后，在堆叠的可堆叠半导体芯片的堆叠的一个侧表面上形成多个外部端子焊盘。 每个外部终端焊盘电连接到一个可堆叠半导体芯片中的至少一个金属线。 接下来，在多个外部端子焊盘中的每一个上形成焊球以产生堆叠的半导体芯片封装。

    X-RAY IMAGING APPARATUS
    34.
    发明申请
    X-RAY IMAGING APPARATUS 有权
    X射线成像装置

    公开(公告)号：US20140334599A1

    公开(公告)日：2014-11-13

    申请号：US14117032

    申请日：2012-05-10

    Applicant: Heung-San Choi ,  Jin-Su Kim ,  Jung-Hoon Song

    Inventor： Heung-San Choi ,  Jin-Su Kim ,  Jung-Hoon Song

    IPC: A61B6/02 ,  A61B6/00

    CPC classification number: A61B6/02 ,  A61B5/0035 ,  A61B5/0077 ,  A61B6/14 ,  A61B6/4411 ,  A61B6/4417 ,  A61B6/501 ,  A61B6/5247

    Abstract: The present invention relates to an X-ray imaging apparatus, comprising: an X-ray imager including an X-ray beam generator for emitting an X-ray beam, an X-ray beam detector for detecting the X-ray beam to obtain an X-ray image of an object, and a main body unit in which the X-ray beam generator and the X-ray beam detector are installed; and a three-dimensional scanner arranged in the X-ray imager in order to obtain an image of the outer appearance of the object. According to the present invention, an X-ray image and an image of the outer appearance of an object, for example, an image of the skull and an image of the face, can be obtained at the same time, thereby minimizing image correction procedures for matching two images.

    Abstract translation: 本发明涉及一种X射线成像装置，其特征在于，包括：X射线成像仪，其包括用于发射X射线束的X射线束发生器，用于检测X射线束的X射线束检测器， 物体的X射线图像和安装有X射线束发生器和X射线束检测器的主体单元; 以及设置在X射线成像仪中的三维扫描仪，以获得物体外观的图像。 根据本发明，可以同时获得X射线图像和物体外观的图像，例如颅骨的图像和脸部的图像，从而最小化图像校正程序 用于匹配两个图像。

    METHOD AND SYSTEM FOR PROVIDING A FACE ADJUSTMENT IMAGE
    37.
    发明申请
    METHOD AND SYSTEM FOR PROVIDING A FACE ADJUSTMENT IMAGE 审中-公开
    用于提供面部调整图像的方法和系统

    公开(公告)号：US20130328869A1

    公开(公告)日：2013-12-12

    申请号：US14001037

    申请日：2012-02-09

    Applicant: Heung-san Choi ,  Jin-su Kim ,  Young-guk Park ,  Seung-hak Baek ,  Sang-hwan Joo ,  Hyung-jun Cho

    Inventor： Heung-san Choi ,  Jin-su Kim ,  Young-guk Park ,  Seung-hak Baek ,  Sang-hwan Joo ,  Hyung-jun Cho

    IPC: G06T19/20

    CPC classification number: G06T19/20 ,  G06T7/33 ,  G06T2207/10028 ,  G06T2207/10116 ,  G06T2207/20101 ,  G06T2207/30004 ,  G06T2207/30201 ,  G06T2210/41 ,  G06T2219/2021 ,  G16H50/50

    Abstract: The present invention relates to a method and system for providing a face adjustment image, the method comprising the steps of: (a) generating a matched image by superimposing a cephalometric image having a cranium image of a patient whose face is to be corrected with a three-dimensional facial image of the patient; and (b) displaying a predicted facial image on a screen by transforming soft skin tissues of the face according to the skeletal change in the cephalometric image. According to the present invention, the change in the soft skin tissues and the predicted facial image are displayed on a screen of a computer, a terminal or the like based on the skeletal change in cranium, teeth, prosthesis or the like supporting the soft skin tissues. Therefore, the change in the soft skin tissues can be predicted, thereby increasing the accuracy of a face correction operation, making it more accurate and convenient to plan the operation, and enhancing communication between the patient and medical staff.

    Abstract translation: 本发明涉及一种用于提供面部调整图像的方法和系统，该方法包括以下步骤：（a）通过将具有要被校正的患者的头颅图像的头颅图像叠加在一起来产生匹配图像 患者的三维面部图像; 以及（b）通过根据头颅图像中的骨骼变化转换脸部的软皮肤组织，在屏幕上显示预测的面部图像。 根据本发明，基于支撑柔软皮肤的颅骨，牙齿，假体等的骨骼变化，将软皮肤组织和预测面部图像的变化显示在计算机，终端等的屏幕上 组织。 因此，可以预测软皮肤组织的变化，从而提高面部矫正操作的准确性，使其更准确和方便地规划操作，并且增强患者和医务人员之间的沟通。

    EMBEDDED PRINTED CIRCUIT BOARD, MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    38.
    发明申请
    EMBEDDED PRINTED CIRCUIT BOARD, MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    嵌入式印刷电路板，多层印刷电路板及其制造方法

    公开(公告)号：US20110127070A1

    公开(公告)日：2011-06-02

    申请号：US12956545

    申请日：2010-11-30

    Applicant: Chi Hee Ahn ,  Sang Myung Lee ,  Yeong Uk Seo ,  Jin Su Kim ,  Sung Woon Yoon ,  Myoung Hwa Nam

    Inventor： Chi Hee Ahn ,  Sang Myung Lee ,  Yeong Uk Seo ,  Jin Su Kim ,  Sung Woon Yoon ,  Myoung Hwa Nam

    IPC: H05K1/02 ,  B32B37/22 ,  H05K3/00

    CPC classification number: H05K3/465 ,  H05K3/0032 ,  H05K3/045 ,  H05K3/107 ,  H05K3/184 ,  H05K3/4661 ,  H05K2203/054 ,  Y10T29/49124 ,  Y10T29/49155

    Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.

    Abstract translation: 提供嵌入式PCB，使用嵌入式PCB的多层PCB及其制造方法。 制造嵌入式PCB的方法包括：使用激光使绝缘层图案化的第一步骤，使得绝缘层的一部分被选择性地蚀刻以形成电路图案区域;以及第二步骤， 图案区域与电镀材料形成电路图案。 因此，制造嵌入式PCB的方法可以使用激光器同时或顺序地蚀刻光致抗蚀剂层和绝缘层，以形成电路图案，从而获得微图案并简化制造工艺，并实现多层结构的对准精度 使用嵌入式PCB的PCB层，从而提高产品的可靠性和产量。

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