公开(公告)号：US08435666B2

公开(公告)日：2013-05-07

申请号：US13324871

申请日：2011-12-13

申请人： Jinkyu Lee ,  Hee Soo Yoon ,  BumHyun Lee ,  Dal Mo Kang ,  Minjung Kim

发明人： Jinkyu Lee ,  Hee Soo Yoon ,  BumHyun Lee ,  Dal Mo Kang ,  Minjung Kim

IPC分类号： H01M2/14 ,  H01M2/00 ,  H01M6/42 ,  H01M6/46 ,  H01M2/02

CPC分类号： H01M10/5004 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6555

摘要： Disclosed herein is a battery module including a plurality of battery cells mounted in a module case in a stacked state, wherein cooling members are mounted at interfaces between the battery cells, the module case is configured in a structure in which two opposite sides of the module case are open so that corresponding portions of the battery cell stack are exposed outward through the two open opposite sides of the module case, the cooling members are partially exposed outward through the two open opposite sides of the module case, and a coolant flows along the two open opposite sides of the module case while contacting the outwardly exposed portions of the cooling members.

摘要翻译： 这里公开了一种电池模块，其包括以堆叠状态安装在模块壳体中的多个电池单元，其中，冷却构件安装在电池单元之间的界面处，模块壳体被构造成其中模块的两个相对侧 壳体打开，使得电池单元堆叠的相应部分通过模块壳体的两个敞开的相对侧向外暴露，冷却构件通过模块壳体的两个敞开的相对侧部分地向外暴露，并且冷却剂沿着 模块壳体的两个敞开的相对侧，同时接触冷却构件的向外暴露的部分。

公开(公告)号：US08409918B2

公开(公告)日：2013-04-02

申请号：US12875998

申请日：2010-09-03

申请人： DaeWook Yang ,  SeungWon Kim ,  MinJung Kim

发明人： DaeWook Yang ,  SeungWon Kim ,  MinJung Kim

IPC分类号： H01L21/44 ,  H01L23/02

CPC分类号： H01L23/28 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00012

摘要： A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting.

摘要翻译： 半导体器件具有衬底，其具有通过衬底形成的多个导电通孔和形成在衬底上的导电层。 第一密封剂沉积在衬底的管芯附着区域外部的衬底上。 第一密封剂围绕衬底上的每个管芯附着区域，并且管芯附着区域没有第一密封剂。 连接相邻管芯附着区域的通道也没有第一密封剂。 在形成第一密封剂之后，第一半导体管芯安装在管芯附着区域内的衬底上。 第二半导体管芯安装在管芯附着区域内的第一管芯上。 可以在第一和第二模具下沉积底部填充材料。 第二密封剂沉积在第一和第二管芯和第一密封剂上。 第一密封剂在模具安装期间减少基板的翘曲。

公开(公告)号：US20120171532A1

公开(公告)日：2012-07-05

申请号：US13339803

申请日：2011-12-29

申请人： BumHyun LEE ,  MinJung KIM ,  Jin Kyu LEE ,  Hee Soo YOON ,  DalMo KANG ,  Jong Moon YOON

发明人： BumHyun LEE ,  MinJung KIM ,  Jin Kyu LEE ,  Hee Soo YOON ,  DalMo KANG ,  Jong Moon YOON

IPC分类号： H01M10/50 ,  H01M2/10 ,  H01M2/36

CPC分类号： H01M2/1077 ,  H01M10/613 ,  H01M10/647 ,  H01M10/6551 ,  H01M10/6556 ,  H01M10/6557 ,  H01M10/6568

摘要： Disclosed is a battery pack configured to have a structure in which two or more battery modules, each including a plurality of battery cells or unit modules (unit cells) which can be charged and discharged, are mounted in a space defined between a pack case and a base plate, wherein cooling members, each including a heat dissipation fin disposed in contact with outsides of corresponding ones of the unit cells and a coolant conduit connected to a lower end of the heat dissipation fin to allow a coolant to flow therealong, are mounted at interfaces between the unit cells, the base plate, located below the battery modules, is configured to form a coolant flow channel having a coolant flow direction corresponding to the coolant flow direction in the coolant conduit, the pack case is coupled to the base plate in a state in which the battery modules are mounted on the base plate.

摘要翻译： 公开了一种电池组，其被配置为具有两个或更多个电池模块，每个电池模块包括可以充放电的多个电池单元或单元模块（单元电池），其被安装在包装盒和包装盒 基板，其中，各冷却部件各自包括设置成与相应单元电池的外部接触的散热片和连接到散热片的下端以允许冷却剂沿其流动的冷却剂导管， 在单元电池之间的接口处，位于电池模块下方的基板被构造成形成具有与冷却剂导管中的冷却剂流动方向相对应的冷却剂流动方向的冷却剂流动通道，所述包装盒联接到基板 在电池模块安装在基板上的状态下。

公开(公告)号：US20120088135A1

公开(公告)日：2012-04-12

申请号：US13274864

申请日：2011-10-17

申请人： Minjung KIM ,  Jinkyu LEE ,  Dal Mo KANG ,  Hee Soo YOON

发明人： Minjung KIM ,  Jinkyu LEE ,  Dal Mo KANG ,  Hee Soo YOON

IPC分类号： H01M10/48 ,  H01M10/50

CPC分类号： H01M10/486 ,  H01M2/206 ,  H01M10/613 ,  H01M10/647 ,  H01M10/6555

摘要： Disclosed herein is a battery module including two or more battery cells, wherein the battery module is configured in a structure in which a sensor (a “temperature sensor”) to measure the temperature of at least one of the battery cells is disposed between the at least one of the battery cells and a corresponding member contacting the at least one of the battery cells, the corresponding member is provided at a region thereof contacting the at least one of the battery cells with a groove formed in a shape corresponding to the temperature sensor, and the temperature sensor is disposed in contact with the outside of the at least one of the battery cells in a state in which the temperature sensor is mounted in the groove.

摘要翻译： 本文公开了一种包括两个或更多个电池单元的电池模块，其中电池模块被配置为其中测量至少一个电池单元的温度的传感器（“温度传感器”）设置在at 电池单元中的至少一个和与至少一个电池单元相接触的相应构件，相应构件设置在与至少一个电池单元接触的区域处，形成为与温度传感器相对应的形状 并且在将温度传感器安装在槽中的状态下，温度传感器被设置成与至少一个电池单元的外部接触。

公开(公告)号：US20120056334A1

公开(公告)日：2012-03-08

申请号：US12875998

申请日：2010-09-03

申请人： DaeWook Yang ,  SeungWon Kim ,  MinJung Kim

发明人： DaeWook Yang ,  SeungWon Kim ,  MinJung Kim

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/28 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00012

摘要： A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting.

摘要翻译： 半导体器件具有衬底，其具有通过衬底形成的多个导电通孔和形成在衬底上的导电层。 第一密封剂沉积在衬底的管芯附着区域外部的衬底上。 第一密封剂围绕衬底上的每个管芯附着区域，并且管芯附着区域没有第一密封剂。 连接相邻管芯附着区域的通道也没有第一密封剂。 在形成第一密封剂之后，第一半导体管芯安装在管芯附着区域内的衬底上。 第二半导体管芯安装在管芯附着区域内的第一管芯上。 可以在第一和第二模具下沉积底部填充材料。 第二密封剂沉积在第一和第二管芯和第一密封剂上。 第一密封剂在模具安装期间减少基底的翘曲。

公开(公告)号：US20080108092A1

公开(公告)日：2008-05-08

申请号：US11837756

申请日：2007-08-13

申请人： Corey Abate-Shen ,  Michael Shen ,  Minjung Kim

发明人： Corey Abate-Shen ,  Michael Shen ,  Minjung Kim

IPC分类号： G01N33/574 ,  C07K16/18 ,  C12N5/06

CPC分类号： C07K16/22 ,  C07K16/3069 ,  G01N33/57434

摘要： The present invention pertains to a monoclonal antibody, or fragment thereof, having an antigen-binding specific region for NKX3.1 and to a hybridoma cell line for producing the monoclonal antibody. The present invention also pertains to a method for detecting the presence of NKX3.1 in a sample. The method comprises (a) contacting a biopsy tissue sample with a monoclonal antibody, or a fragment thereof, having an antigen-binding specific region for NIX3.1, under conditions permitting immunospecific binding between the monoclonal antibody, or a fragment thereof, and NKX3.1 in the sample; and (b) detecting whether immunospecific binding has occurred to detect the presence of NKX3.1 in the sample.

摘要翻译： 本发明涉及具有NKX3.1的抗原结合特异性区域和用于制备单克隆抗体的杂交瘤细胞系的单克隆抗体或其片段。 本发明还涉及用于检测样品中NKX3.1的存在的方法。 该方法包括（a）在允许单克隆抗体或其片段与NKX3之间的免疫特异性结合的条件下，将活检组织样品与具有NIX3.1的抗原结合特异性区域的单克隆抗体或其片段接触 .1样品中 和（b）检测是否发生了免疫特异性结合以检测样品中NKX3.1的存在。