BATTERY MODULE HAVING HEAT DISSIPATION MEMBER OF NOVEL STRUCTURE AND BATTERY PACK EMPLOYED WITH THE SAME
    6.
    发明申请
    BATTERY MODULE HAVING HEAT DISSIPATION MEMBER OF NOVEL STRUCTURE AND BATTERY PACK EMPLOYED WITH THE SAME 有权
    具有新型结构的散热构件的电池模块和与其同时使用的电池组

    公开(公告)号:US20120094166A1

    公开(公告)日:2012-04-19

    申请号:US13275012

    申请日:2011-10-17

    IPC分类号: H01M10/50

    摘要: Disclosed is a battery module including a plurality of plate-shaped battery cells mounted in a module case in a stacked state, wherein each of the plate-shaped battery cells is configured in a structure in which an electrode assembly is mounted in a battery case formed of a laminate sheet, the battery module is configured in a structure in which a plurality of heat dissipation members disposed at two or more interfaces between the battery cells and a heat exchange member to integrally interconnect the heat dissipation members are mounted at one side of a battery cell stack, and heat generated from the battery cells during charge and discharge of the battery cells is removed by the heat exchange member via the heat dissipation members.

    摘要翻译: 公开了一种电池模块,其包括以堆叠状态安装在模块壳体中的多个板状电池单元,其中每个板状电池单元被构造成其中电极组件安装在形成的电池壳体中的结构 所述电池模块的结构是,设置在所述电池单元和热交换构件之间的两个或更多个界面处的多个散热构件,以一体地互连所述散热构件的结构, 电池单元堆叠,并且在电池单元的充电和放电期间由电池单元产生的热量通过散热构件被热交换构件去除。

    Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof
    8.
    发明授权
    Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof 有权
    具有防翘曲机构的集成电路封装系统及其制造方法

    公开(公告)号:US08703535B2

    公开(公告)日:2014-04-22

    申请号:US13490908

    申请日:2012-06-07

    IPC分类号: H01L21/00

    摘要: A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a warpage-compensation zone with a substrate-interior layer exposed from a top substrate-cover, and the warpage-compensation zone having contiguous exposed portion of the substrate-interior layer over corner portions of the package substrate; connecting an integrated circuit die to the package substrate with an internal interconnect; and forming an encapsulation over the integrated circuit die, with the encapsulation directly on the substrate-interior layer in the warpage-compensation zone.

    摘要翻译: 一种制造集成电路封装系统的方法包括:提供具有翘曲补偿区域的封装基板,其具有从顶部基板盖露出的基板内部层,并且所述翘曲补偿区域具有基板 - 在封装衬底的角部上的内层; 将集成电路管芯与内部互连连接到封装衬底; 以及在整个集成电路管芯上形成封装,其中封装直接在翘曲补偿区域中的衬底内层上。