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31.
公开(公告)号:US5192913A
公开(公告)日:1993-03-09
申请号:US851716
申请日:1992-03-16
IPC分类号: G01R31/02 , G01R31/28 , G01R31/305
CPC分类号: G01R31/025 , G01R31/2853 , G01R31/305
摘要: A method of electrically testing an electrical component containing a plurality of networks with at least one node. The method uses segmented, charge limiting testing to charge the nodes and detect shorted or disconnected nodes while preventing accumulated charges in the networks from making uncharged nodes appear charged. The method is well suited for voltage contrast electron beam testing of unpopulated high density multichip modules and interconnect substrates.
摘要翻译: 一种用至少一个节点电测试包含多个网络的电气部件的方法。 该方法使用分段的电荷限制测试来对节点进行充电并检测短路或断开的节点,同时防止网络中的累积电荷使得不带电节点出现充电。 该方法非常适用于未填充的高密度多芯片模块和互连衬底的电压对比电子束测试。
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公开(公告)号:US09304308B2
公开(公告)日:2016-04-05
申请号:US13593970
申请日:2012-08-24
申请人: Rama R. Goruganthu
发明人: Rama R. Goruganthu
IPC分类号: G02B21/00 , G02B21/10 , G02B27/28 , G01N21/47 , G01N21/956
CPC分类号: G02B21/0052 , G01N21/47 , G01N21/956 , G01N2021/4709 , G01N2021/4733 , G01N2021/4735 , G02B21/0032 , G02B21/10 , G02B27/286
摘要: The present application discloses various implementations of a laser scanning module. In one implementation, such a laser scanning module comprising an optical isolator including first and second linear polarizers, a collimating optics configured to receive light produced by a laser light source and to pass a substantially collimated light beam to the first linear polarizer, and a scanning unit situated to receive light passed by the second linear polarizer. The first linear polarizer is separated from the collimating optics by a first distance less than a second distance separating the second linear polarizer from the scanning unit.
摘要翻译: 本申请公开了激光扫描模块的各种实现方式。 在一个实现中,这种激光扫描模块包括包括第一和第二线性偏振器的光隔离器,准直光学器件被配置为接收由激光光源产生的光并将基本上准直的光束传递到第一线性偏振器,以及扫描 单元,用于接收由第二线性偏振器通过的光。 第一线性偏振器与准直光学元件分开第一距离小于将第二线性偏振器与扫描单元隔开的第二距离。
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公开(公告)号:US08537464B2
公开(公告)日:2013-09-17
申请号:US12653235
申请日:2009-12-09
申请人: Rama R. Goruganthu
发明人: Rama R. Goruganthu
CPC分类号: G02F1/093 , G01N21/956 , G02B21/0016 , G02B21/10 , G02B27/28 , G02F2201/58 , G02F2203/07
摘要: According to one embodiment, an optical isolation module includes first and second linear polarizers, a Faraday rotator situated between the first and second linear polarizers and a transmissive element including a half-wave plate also situated between the first and second linear polarizers. In one embodiment, a method for performing optical isolation includes rotating an axis of polarization of a linearly polarized light beam by a first rotation in a first direction, and selectively rotating a portion of the linearly polarized light beam by a second rotation in the first direction to produce first and second linearly polarized light beam portions. As a result, the first linearly polarized light beam portion undergoes the first rotation, and the second linearly polarized light beam portion undergoes the first and second rotations. The method further includes filtering one of the first and second linearly polarized light beam portions to produce a light annulus.
摘要翻译: 根据一个实施例,光隔离模块包括第一和第二线性偏振器,位于第一和第二线性偏振器之间的法拉第旋转器和包括也位于第一和第二线性偏振器之间的半波片的透射元件。 在一个实施例中,一种执行光学隔离的方法包括:沿第一方向旋转线偏振光束的偏振轴,并且使第一方向上的第二旋转选择性地旋转一部分线偏振光束 以产生第一和第二直线偏振光束部分。 结果,第一直线偏振光束部分经历第一旋转,并且第二线偏振光束部分经历第一和第二旋转。 该方法还包括对第一和第二直线偏振光束部分之一进行滤波以产生光环。
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公开(公告)号:US20120320455A1
公开(公告)日:2012-12-20
申请号:US13593970
申请日:2012-08-24
申请人: Rama R. Goruganthu
发明人: Rama R. Goruganthu
CPC分类号: G02B21/0052 , G01N21/47 , G01N21/956 , G01N2021/4709 , G01N2021/4733 , G01N2021/4735 , G02B21/0032 , G02B21/10 , G02B27/286
摘要: The present application discloses various implementations of a laser scanning module. In one implementation, such a laser scanning module comprising an optical isolator including first and second linear polarizers, a collimating optics configured to receive light produced by a laser light source and to pass a substantially collimated light beam to the first linear polarizer, and a scanning unit situated to receive light passed by the second linear polarizer. The first linear polarizer is separated from the collimating optics by a first distance less than a second distance separating the second linear polarizer from the scanning unit.
摘要翻译: 本申请公开了激光扫描模块的各种实现方式。 在一个实现中,这种激光扫描模块包括包括第一和第二线性偏振器的光隔离器,准直光学器件被配置为接收由激光光源产生的光并将基本上准直的光束传递到第一线性偏振器,以及扫描 单元,用于接收由第二线性偏振器通过的光。 第一线性偏振器与准直光学元件分开第一距离小于将第二线性偏振器与扫描单元隔开的第二距离。
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公开(公告)号:US06994584B1
公开(公告)日:2006-02-07
申请号:US10231560
申请日:2002-08-30
IPC分类号: H01R13/00
CPC分类号: H01L23/3675 , B82Y10/00 , H01L23/055 , H01L23/145 , H01L23/373 , H01L24/48 , H01L2224/16 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , Y10S977/833 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.
摘要翻译: 提供了用于安装电路装置的各种装置及其制造方法。 在一方面,提供一种包括用于保持集成电路的部件的装置。 该构件包含第一多个碳纳米管以增强其导热性。 至少有一个导体成员从该成员突出。 在另一方面,提供一种制造电子部件的界面的方法,其包括形成包含第一多个碳纳米管并在所述部件上形成至少一个导体的部件。
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36.
公开(公告)号:US06992773B1
公开(公告)日:2006-01-31
申请号:US09386112
申请日:1999-08-30
IPC分类号: G01B9/02
CPC分类号: G01N21/95684
摘要: According to one aspect of the disclosure and a particular example application directed to a flip-chip packaged die, a method for detecting a defect in a surface of the die includes directing light through a first beam splitter; directing light of a known wavelength at the beam splitter, wherein the first beam splitter is adapted to direct a first beam of light into the back side of the semiconductor die which reflects a second beam of light back; and redirecting the second beam to a second beam splitter, the second beam splitter generating third and fourth beams of light. Analysis of the third and fourth beams of light is then performed, and this analysis can include using detectors in respective paths of the third and fourth beams of light to generate an arrival time differential and then comparing the differential with a reference previously generated using a nondefective die.
摘要翻译: 根据本公开的一个方面和针对倒装芯片封装管芯的特定示例应用,用于检测管芯表面中的缺陷的方法包括将光引导通过第一分束器; 将所述已知波长的光导向所述分束器,其中所述第一分束器适于将第一光束引导到所述半导体管芯的反射第二光束的背面; 以及将所述第二光束重定向到第二分束器,所述第二分束器产生第三和第四光束。 然后执行第三和第四光束的分析,并且该分析可以包括在第三和第四光束的相应路径中使用检测器以产生到达时间差,然后将差分与先前使用无缺陷 死。
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公开(公告)号:US06873166B1
公开(公告)日:2005-03-29
申请号:US10234882
申请日:2002-09-04
IPC分类号: G01R31/28 , G01R31/311 , H01L21/66 , G01R31/06
CPC分类号: G01R31/2898 , G01R31/2851 , G01R31/2877 , G01R31/311 , H01L22/20
摘要: According to an example embodiment, a system for testing a semiconductor die is provided. The semiconductor die has circuitry on one side and silicon on an opposite side, and the opposite side may be AR coated. The opposite side is thinned, the die is powered, and a portion of the circuitry is heated to cause a reaction (e.g., a circuit failure or recovery) in a target region. The circuitry is monitored, and the circuit that reacts to the heat is detected and analyzed.
摘要翻译: 根据示例性实施例,提供了一种用于测试半导体管芯的系统。 半导体管芯在一侧具有电路,在相对侧具有硅,并且相对侧可以涂覆AR。 相对侧变薄,管芯被供电,并且电路的一部分被加热以引起目标区域中的反应(例如,电路故障或恢复)。 监测电路,并检测和分析与热量反应的电路。
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公开(公告)号:US06714294B1
公开(公告)日:2004-03-30
申请号:US10209844
申请日:2002-07-31
IPC分类号: G01N2100
CPC分类号: G01N21/9501
摘要: Methods and apparatus for inspecting a sample are provided. In one aspect, a method of inspection is provided that includes generating an entangled set of particle beams and directing one of the entangled set of particle beams to a location of a workpiece. One of the entangled set of particle beams interacts with the location of the workpiece. One of the entangled set of particle beams is observed after the interaction with the location of the workpiece to inspect the location of the workpiece.
摘要翻译: 提供了检查样品的方法和设备。 一方面,提供了一种检查方法,其包括产生纠缠的一组粒子束并将一组纠缠的粒子束引导到工件的位置。 一组纠缠的粒子束与工件的位置相互作用。 在与工件的位置相互作用之后观察到一组纠缠的粒子束,以检查工件的位置。
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公开(公告)号:US06483326B1
公开(公告)日:2002-11-19
申请号:US09371754
申请日:1999-08-10
IPC分类号: G01R3126
CPC分类号: G01R31/2898 , G01R31/2851 , G01R31/2877 , G01R31/311 , H01L22/20
摘要: According to an example embodiment, a method for testing a semiconductor die is provided. The semiconductor die has circuitry on one side and silicon on an opposite side, and the opposite side may be AR coated. The opposite side is thinned, the die is powered, and a portion of the circuitry is heated to cause a reaction (e.g., a circuit failure or recovery) in a target region. The circuitry is monitored, and the circuit that reacts to the heat is detected and analyzed.
摘要翻译: 根据示例实施例,提供了一种用于测试半导体管芯的方法。 半导体管芯在一侧具有电路,在相对侧具有硅,并且相对侧可以涂覆AR。 相对侧变薄,管芯被供电,并且电路的一部分被加热以引起目标区域中的反应(例如,电路故障或恢复)。 监测电路,并检测和分析与热量反应的电路。
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公开(公告)号:US06469529B1
公开(公告)日:2002-10-22
申请号:US09580716
申请日:2000-05-30
IPC分类号: G01R31302
CPC分类号: G01R31/311
摘要: Integrated circuit devices are analyzed using an integrated system adapted to obtain time-resolved information from the back side of a silicon based semiconductor chip using hot carrier emissions. According to an example embodiment of the present invention, a system is adapted to analyze a semiconductor device under test (DUT) using a plurality of sensors mounted to a microscope having an objective lens. The plurality of sensors include a global acquisition sensor, a single-point acquisition sensor, and a navigation sensor. The integrated system is adapted to use the plurality of sensors individually and simultaneously. The integrated system improves the analysis of the DUT for reasons including that it makes possible the performance of more than one type of analysis simultaneously using a single test arrangement.
摘要翻译: 使用集成系统分析集成电路器件,该系统适于使用热载流子发射从硅基半导体芯片的背面获得时间分辨信息。 根据本发明的示例性实施例,系统适用于使用安装在具有物镜的显微镜上的多个传感器来分析被测半导体器件(DUT)。 多个传感器包括全局采集传感器,单点采集传感器和导航传感器。 集成系统适于单独和同时使用多个传感器。 集成系统改进了DUT的分析原因,包括使用单个测试装置可以同时执行多种类型的分析。
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