Abstract:
A logic chip and a memory chip to be accessed by the logic chip are mounted in a single package. A pattern generator of the logic chip operates during a first test mode to generate internal test pattern(s) for the memory chip. A pattern selector selects, during the first test mode, the internal test pattern(s) outputted from the pattern generator, selects, during a second test mode, an external test pattern supplied via a test terminal, and outputs the selected test pattern to the memory chip. The memory chip mounted in the package is tested by use of, in accordance with a mode selecting signal, either the internal test pattern(s) (the first test mode) generated within the logic chip or the external test pattern (the second test mode) supplied from the exterior.
Abstract:
A logic chip and a memory chip to be accessed by the logic chip are mounted in a single package. A pattern generator of the logic chip operates during a first test mode to generate internal test pattern for the memory chip. A pattern selector selects, during the first test mode, the internal test pattern outputted from the pattern generator, selects, during a second test mode, an external test pattern supplied via a test terminal, and outputs the selected test pattern to the memory chip. The memory chip mounted in the package is tested by use of, in accordance with a mode selecting signal, either the internal test pattern in the first test mode, generated within the logic chip, or the external test pattern in the second test mode, supplied from the exterior.
Abstract:
A semiconductor memory device includes a first bit line connected to a memory cell via a transistor, a transfer gate, a second bit line connected to the first bit line via the transfer gate, a sense amplifier connected to the second bit line, a first precharge circuit for precharging the first bit line, a second precharge circuit for precharging the second bit line, a control circuit which precharges the first bit line by the first precharge circuit after closing the transfer gate, followed by subsequent precharging of the second bit line by the second precharge circuit.
Abstract:
A semiconductor integrated circuit device comprises a plurality of MIS transistors, and an integrated circuit unit including logic gate circuits configured by a combination of the plurality of MIS transistors. Each of the MIS transistors has a gate including a circuit element represented by an equivalent circuit in which a capacitance and resistance are parallel-connected.
Abstract:
A semiconductor integrated circuit includes a switch unit for controlling the supply of a power source voltage to a signal amplification circuit for receiving an input signal, and a control unit for selectively turning ON and OFF the switch unit in accordance with the amplitude or frequency of the input signal. By the constitution, it is possible to provide an input circuit or an output circuit capable of being applied to an input/output interface adapted for a small amplitude operation.
Abstract:
A delay circuit and a plurality of accepting circuits are comprised. The input signal supplied from exterior is delayed for a predetermined length of time by the delay circuit, and then it is distributed and output to the plurality of the receiver circuits. The delay time of the delay circuit is adjusted to optimize an accepting timing to an input signal by a clock signal in each of the accepting circuit. The each accepting circuit reliably accepts the delayed input signal respectively in synchronization with a clock signal. Therefore, it is unnecessary to respectively provide a delay circuit in the plurality of the accepting circuits. As a result, the plurality of accepting circuits can reliably accept input signals without enlarging a circuit scale. A plurality of delay circuits, a plurality of accepting circuits, and an operating circuit are comprised. The delay circuit receives a plurality of input signals, and outputs each of the delayed input signals respectively to the plurality of accepting circuits. The accepting circuit accepts the delayed input signals in synchronization with a clock signal. More than one of the delayed input signals are supplied to the operating circuit to perform a logic operation. The delay time of the each delay circuit, for example, is in accordance with the supplying timing to the input signal supplied to the operating circuit. As a result, the operating circuit performs the logic operation with a sufficient timing margin.
Abstract:
An electronic circuit apparatus having a bus, a plurality of stubs branched from the bus, and a plurality of semiconductor devices having signal input/output terminals connected to the corresponding stubs. The electronic circuit apparatus includes at least one impedance circuit arranged between the bus and at least one of the stubs, and each impedance circuit has a high-pass filter characteristic. Therefore, ringing is suppressed, attenuation in the high-frequency components of a transmission signal is prevented, the definition of the signal is maintained, and transmission frequency and speed are both improved.
Abstract:
According to a semiconductor memory for one aspect of the present invention, a memory cell transistor is formed in a P-type first well region which is formed at the surface of a P-type semiconductor substrate, and a back bias voltage is applied to the P-type first well region and the P-type substrate. Further, an N-type retrograde region is formed by implanting a high energy N-type impurity, so that a deeper, N-type second well region is formed by employing the N-type retrograde region. Further, a P-type third well region is formed in the N-type second well region, and a P-type emitter region is also formed therein. Thus, together the P-type emitter region, the N-type second well region, and the P-type third well region constitute a lateral PNP transistor. In addition, the ground voltage is maintained for the P-type third well region, which serves as a collector region.
Abstract:
A semiconductor device having the function of generating an internal clock signal delayed by a predetermined phase by adjusting the phase of an external clock signal, includes a first clock phase circuit for roughly adjusting the phase of the external clock signal; and a second clock phase adjusting circuit for controlling the phase of the internal clock signal with higher accuracy than the first clock phase adjusting circuit. The semiconductor device having such a construction executes phase comparisons by the first and second clock phase adjusting circuits independently of each other, and when a phase control operation by the second clock phase adjusting circuit is made subordinate to that of the first clock phase adjusting circuit, the delay time of each of a plurality of delay elements inside the first clock phase adjusting circuit is set to a value larger than a power source jitter resulting from a noise of a power source and a jitter of the external clock signal.
Abstract:
A semiconductor memory device includes a memory cell array having a number of memory cells configured in a square or rectangular formation, the memory cell array having predetermined capacitive loads which are different at different memory locations, the capacitive loads including a smallest capacitive load and a largest capacitive load. A refresh address counter outputs a number of bit signals which constitute a refresh address signal, the refresh address signal indicating an address of a memory cell to be refreshed in the memory device, the bit signals having predetermined high/low-state change periods which are different from each other, the bit signals including a first bit signal corresponding to the smallest capacitive load and a second bit signal corresponding to the largest capacitive load. A selector is provided to connect the refresh address counter outputs to the memory cell array, and assigns the predetermined high/low-state change periods for the respective bit signals of the refresh address signal in accordance with a correspondence between the bit signals and the capacitive loads. A refresh address signal generating method is also disclosed for use in the semiconductor memory device.