公开(公告)号：US07458703B2

公开(公告)日：2008-12-02

申请号：US11488067

申请日：2006-07-18

Applicant: Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

Inventor： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

IPC: F21V7/00

CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

Abstract translation: 具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。 下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。 上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。 漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。 上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

公开(公告)号：US20070181899A1

公开(公告)日：2007-08-09

申请号：US11646424

申请日：2006-12-28

Applicant: Min Sang Lee ,  Byung Man Kim ,  Seon Goo Lee ,  Dong Yeoul Lee ,  Alex Chae ,  Je Myung Park

Inventor： Min Sang Lee ,  Byung Man Kim ,  Seon Goo Lee ,  Dong Yeoul Lee ,  Alex Chae ,  Je Myung Park

IPC: H01L33/00

CPC classification number: H01L33/647 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

Abstract: Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.

Abstract translation: 提供一种LED封装，其包括由用作第一电极的第一区域和与所述第一区域的一部分重叠形成的第二区域构成的第一封装，所述第二区域限定模制材料填充腔; 安装在第一包装的第一区域上的一个或多个LED芯片; 形成在所述第一封装的第二区域下方的第二封装，所述第二封装由所述第一区域和绝缘构件绝缘，以用作第二电极; 用于电连接LED芯片和第二封装的导线; 以及填充在第一封装的第二区域内的成型材料，以保护LED芯片和导线。 第一和第二包装由铝形成。

公开(公告)号：US20070145387A1

公开(公告)日：2007-06-28

申请号：US11680847

申请日：2007-03-01

Applicant: Seon Goo LEE ,  Bum Joon JIN ,  Kyung Taeg HAN ,  Chang Wook KIM

Inventor： Seon Goo LEE ,  Bum Joon JIN ,  Kyung Taeg HAN ,  Chang Wook KIM

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.

Abstract translation: 本发明涉及一种LED外壳及其制造方法。 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。 以这种方式，本发明可以通过将电气连接部件与导热部分隔离来克服限制的应用问题。

公开(公告)号：US20070120290A1

公开(公告)日：2007-05-31

申请号：US11617844

申请日：2006-12-29

Applicant: Joon Ho YOON ,  Seon Goo LEE ,  Doo Hoon AHN

Inventor： Joon Ho YOON ,  Seon Goo LEE ,  Doo Hoon AHN

IPC: B29C45/14

CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0041 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed herein is a method for producing a molding compound resin tablet for wavelength conversion. The method comprises the steps of wet-dispersing a phosphor powder in a translucent liquid resin to form a molding compound resin body in which the phosphor powder is dispersed, and grinding the molding compound resin body into a powder form and applying a predetermined pressure to the resin powder. Further disclosed is a method for manufacturing a white light emitting diode using the molding compound resin tablet by a transfer molding process.

Abstract translation: 本文公开了一种用于生产用于波长转换的模塑料树脂片剂的方法。 该方法包括以下步骤：将荧光体粉末分散在半透明液体树脂中以形成其中分散有荧光体粉末的模塑复合树脂体，并将模塑料树脂体研磨成粉末形式，并将预定压力施加到 树脂粉。 进一步公开了一种通过传递模塑法制造使用该模塑复合树脂片的白色发光二极管的方法。

公开(公告)号：US07208772B2

公开(公告)日：2007-04-24

申请号：US11186971

申请日：2005-07-22

Applicant: Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

Inventor： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC: H01L29/22 ,  H01L23/48

CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2224/0401

Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

Abstract translation: 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：USD512029S1

公开(公告)日：2005-11-29

申请号：US29220264

申请日：2004-12-28

Applicant: Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

Designer： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

公开(公告)号：US06469258B1

公开(公告)日：2002-10-22

申请号：US09648946

申请日：2000-08-23

Applicant: Choon Heung Lee ,  Won Dai Shin ,  Chang Hoon Ko ,  Won Sun Shin ,  Seon Goo Lee ,  Won Kyun Lee ,  Tae Hoan Jang ,  Jun Young Yang

Inventor： Choon Heung Lee ,  Won Dai Shin ,  Chang Hoon Ko ,  Won Sun Shin ,  Seon Goo Lee ,  Won Kyun Lee ,  Tae Hoan Jang ,  Jun Young Yang

IPC: H01R1204

CPC classification number: H05K1/0259 ,  H01L23/60 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/09354 ,  H01L2924/00

Abstract: A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.

Abstract translation: 用于半导体封装的电路板被设计为在基于电路板的半导体封装的制造中提供与相应设备的完全接地，从而防止由静电电荷引起的电路板或半导体芯片的损坏。 用于半导体封装的印刷电路板包括：树脂基板; 芯片安装区，形成在树脂基板的顶表面上，用于在其上安装半导体芯片; 多个精细电路图案，其径向设置在芯片安装区域的周边并延伸到芯片安装区域的边缘; 在树脂基板的底面上以阵列形成的多个球状接头，与导电球熔合; 导电通孔，其将树脂基材的顶表面上的电路图案连接到树脂基材的底表面上的球接头; 涂覆在树脂基材的顶表面和底表面上的保护层，以保护电路图案免受外部环境的影响，并使球体向外露出; 以及用于去除设置在基板的边缘并连接到多个电路图案以在半导体制造中去除静电电荷的静电电荷的装置。

公开(公告)号：USRE45596E1

公开(公告)日：2015-06-30

申请号：US13294405

申请日：2011-11-11

Applicant: Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

Inventor： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

IPC: H01L29/22 ,  H01L23/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

Abstract translation: 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US08202746B2

公开(公告)日：2012-06-19

申请号：US12204049

申请日：2008-09-04

Applicant: Seon Goo Lee ,  Geun Chang Ryo ,  Dong Yeoul Lee ,  Yong Tae Kim ,  Young Jae Song

Inventor： Seon Goo Lee ,  Geun Chang Ryo ,  Dong Yeoul Lee ,  Yong Tae Kim ,  Young Jae Song

IPC: H01L21/00

CPC classification number: B29C45/14655 ,  B29C45/1671 ,  B29C45/34 ,  B29L2011/0016 ,  H01L2224/49107 ,  H01L2224/73265

Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.

Abstract translation: 提供一种制造LED封装的方法，该方法包括制备模具，该模具包括上表面和具有外周表面和由外周表面包围的凹表面的下表面，模具具有从 上表面到下表面; 制备其中形成有发光部的基底; 形成在除了形成发光部的区域之外的基板的预定区域中的入口; 将模具定位在发光部分上; 通过将模塑料注入基座的入口来形成模具构件; 并移除模具。

公开(公告)号：US20100289051A1

公开(公告)日：2010-11-18

申请号：US12842493

申请日：2010-07-23

Applicant: Seon Goo LEE ,  Kyung Taeg Han ,  Seong Yeon Han

Inventor： Seon Goo LEE ,  Kyung Taeg Han ,  Seong Yeon Han

IPC: H01L33/52 ,  H01L33/00 ,  H01L21/78 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Abstract translation: 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。