Abstract:
In a method of fabricating a semiconductor device, isolation structures are formed in a substrate to define active regions. Conductive structures are formed on the substrate to cross over at least two of the active regions and the isolation structures, the conductive structures extending in a first direction. An interfacial layer is conformally formed on the substrate in contact with the conductive structures. A first insulation layer is provided on the interfacial layer, wherein the first insulation layer is formed using a flowable chemical vapor deposition (CVD) process, and wherein the interfacial layer reduces a tensile stress generated at an interface between the conductive structures and the first insulation layer while the first insulation layer is formed.
Abstract:
Provided are an ink composition for a printing method, in which the ink composition is applied to a printing blanket, a portion of a coating film is removed using a cliche, and then the coating film remaining on the printing blanket is transferred to an object to be printed, in which the ink composition before printing satisfies the following [Equation 1] [INKST≦BNKγc] and the ink coating film on the printing blanket satisfies the following [Equation 2] [BNKγc≦INKSE≦SUBSE] immediately before the removal of the portion of the ink coating film from the printing blanket using the cliche, and a printing method using the same.
Abstract:
Provided is a method for making a privacy film. In the method, a nickel mold having desired intagliated patterns are prepared, and a curable resin is then injected into the nickel mold to prepare a master mold. A UV curable resin is injected into the master mold, and then cured to thereby form a film where uneven patterns are formed. A black ink is injected into a concave portion of the film. The method provides advantages such as process simplicity, excellent production efficiency, and low fabrication cost.
Abstract:
The present invention relates to a method for etching glass or metal using a negative photoresist and a method for fabricating a cliche using the same. In the method for etching glass or metal according to the present invention, since adhesion strength between the negative photoresist and the metal or the metal oxide is excellent, the photoresist layer is not corroded by the metal or metal oxide etching solution, it is unnecessary to produce an inverse photomask, the fabrication process is simple, and a low resolution light source such as mixed wavelength type light source is capable of being used, thus, economic efficiency is ensured.
Abstract:
The present invention relates to a method of preparing a photochromic film or plate comprising printing a photochromic substance in the unit of an independent spot on a part or the whole of a basic material and forming a protective layer on the basic material, on which the photochromic substance is coated, so as to protect the photochromic substance. According to the present invention, the photochromic substance is printed in the unit of an independent spot so that the printed unit spots are isolated from each other, thereby prolonging the life of the photochromic substance.
Abstract:
A method and resultant device, in which metal nanoparticles are self-assembled into two-dimensional lattices. A periodic hole pattern (wells) is fabricated on a photoresist substrate, the wells having an aspect ratio of less than 0.37. The nanoparticles are synthesized within inverse micelles of a polymer, preferably a block copolymer, and are self-assembled onto the photoresist nanopatterns. The nanoparticles are selectively positioned in the holes due to the capillary forces related to the pattern geometry, with a controllable number of particles per lattice point.
Abstract:
An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.
Abstract translation:本发明的示例性实施例涉及一种导电结构体,其包括具有AlO x N y的变暗图案层及其制造方法。 根据本发明的示例性实施例的导电结构体可以防止导电图案层的反射而不影响导电图案层的导电性,并且通过改善吸光度来改善导电图案层的隐蔽性。 因此,可以通过使用根据本发明的示例性实施例的导电结构体来开发具有改善的可视性的显示面板。
Abstract:
The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer.
Abstract:
The present invention relates to a touch panel comprising a structure body comprising: a substrate; a conducting pattern that is provided on at least one surface of the substrate; and a light absorption pattern provided on at least one surface of the conducting pattern and provided on at least a portion of regions corresponding to the conducting pattern, and a method for manufacturing the same.
Abstract:
Provided are a single-sided one-sheet type capacitive touch screen and a method for manufacturing the same. The touch screen includes: a substrate; a first conductive pattern disposed on the substrate in a vertical direction and including at least two pattern columns having two or more conductive pattern regions electrically connected with each other; a second conductive pattern disposed on the same surface of the substrate as the surface where the first conductive pattern is disposed, not being electrically connected with the first conductive pattern, and including two or more conductive pattern regions not electrically connected with each other; a transparent conductive bridge electrically connecting the conductive pattern regions of the second conductive pattern in a horizontal direction; and a transparent insulating part disposed between the transparent conductive bridge and the first conductive pattern to electrically insulate the transparent conductive bridge and the first conductive pattern.