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    APPARATUS FOR MEASURING WARPAGE CHARACTERISTIC OF SPECIMEN
    31.
    发明申请
    APPARATUS FOR MEASURING WARPAGE CHARACTERISTIC OF SPECIMEN 审中-公开
    用于测量样品的温度特性的装置

    公开(公告)号：US20130100460A1

    公开(公告)日：2013-04-25

    申请号：US13411286

    申请日：2012-03-02

    申请人： Seung Wan WOO ,  Suk Jin Ham ,  Kum Young Ji ,  Chae Hyun Na ,  Chang Yun Lee

    发明人： Seung Wan WOO ,  Suk Jin Ham ,  Kum Young Ji ,  Chae Hyun Na ,  Chang Yun Lee

    IPC分类号： G01B11/25

    CPC分类号： G01B11/25 ,  G01B11/306

    摘要： There is provided an apparatus for measuring a warpage characteristic of a specimen, the apparatus including: a light irradiating unit irradiating light toward the specimen; alight transmitting member transmitting the light irradiated by the light irradiating unit therethrough and including a reference lattice pattern to allow a shadow to be formed on the specimen; a sensing unit sensing the shadow formed on the specimen by the reference lattice pattern; and a heating plate disposed under the light transmitting member and heating the specimen mounted thereon, wherein the reference lattice pattern formed on the light transmitting member is formed of a conductive material and is connected to a power supplying unit to thereby generate heat when power is supplied.

    摘要翻译： 提供了一种用于测量试样的翘曲特性的装置，该装置包括：将光照射到试样的光照射单元; 透光构件透射由照射单元照射的光，并且包括参考点阵图案，以允许在样本上形成阴影; 感测单元，通过参考点阵图案感测在样本上形成的阴影; 以及加热板，其设置在所述透光部件的下方并加热安装在其上的试样，其中形成在所述透光部件上的所述参考格子图案由导电材料形成，并且连接到供电单元，从而在供电时产生热量 。

    APPARATUS AND METHOD FOR MEASURING CHARACTERISTICS OF MULTI-LAYERED THIN FILMS
    32.
    发明申请
    APPARATUS AND METHOD FOR MEASURING CHARACTERISTICS OF MULTI-LAYERED THIN FILMS 审中-公开
    用于测量多层薄膜特性的装置和方法

    公开(公告)号：US20120176623A1

    公开(公告)日：2012-07-12

    申请号：US13076060

    申请日：2011-03-30

    申请人： Chang Yun Lee ,  Suk Jin Ham ,  June Sik Park

    发明人： Chang Yun Lee ,  Suk Jin Ham ,  June Sik Park

    IPC分类号： G01B11/02

    CPC分类号： G01B9/02044 ,  G01B9/0203 ,  G01B9/0209 ,  G01B9/02091 ,  G01B11/0675 ,  G01N21/45 ,  G01N21/8422 ,  G01N2021/8438

    摘要： Disclosed herein are an apparatus and method for measuring characteristics of multi-layered thin films. There is provided an apparatus for measuring characteristics of multi-layered films, including: a light source member irradiating light to a sample formed of the multi-layered thin films; an interference-reflection member splitting light into a first beam for acquiring reference reflection light and a second beam for acquiring sample reflection light, and generating an interference signal when the light shutter is opened, and generating the reflection signal when the light shutter is closed; a sample member scanning and irradiating the sample by the second beam and transferring a support to which the sample is fixed; an interference-reflection light detection member splitting and detecting the intensity of the generated interference signal and reflection signal for each wavelength; and a signal processing member using the intensity of the interference signal for each wavelength and the reflection signal for each wavelength detected from the interference-reflection detection unit to image the multi-layered thin films of the sample, calculating reflectivity, refractive index, and the thickness of the multi-layered thin films. By this configuration, the performance of measuring characteristics of multi-layered thin films can be improved.

    摘要翻译： 本发明公开了一种用于测量多层薄膜特性的装置和方法。 提供了一种用于测量多层膜的特性的装置，包括：将光照射到由多层薄膜形成的样品上的光源; 干涉反射构件将光分成用于获取参考反射光的第一光束和用于获取样本反射光的第二光束，并且当光闸打开时产生干涉信号，并且当光快门关闭时产生反射信号; 样品构件通过第二光束扫描和照射样品并转移固定有样品的载体; 干涉反射光检测部件，分别检测所生成的干涉信号的强度和各波长的反射信号; 以及信号处理部件，对于每个波长使用干涉信号的强度和从干涉反射检测部检测出的每个波长的反射信号，对样品的多层薄膜进行成像，计算反射率，折射率和 多层薄膜的厚度。 通过该结构，能够提高多层薄膜的测定特性的性能。

    High Temperature Chromatography Apparatus and Method Thereof
    34.
    发明申请
    High Temperature Chromatography Apparatus and Method Thereof 审中-公开
    高温色谱仪及其方法

    公开(公告)号：US20120006104A1

    公开(公告)日：2012-01-12

    申请号：US12891954

    申请日：2010-09-28

    申请人： Dong Hyun Cho ,  Hee Jin Lee ,  Sung Chan Park ,  Suk Jin Ham

    发明人： Dong Hyun Cho ,  Hee Jin Lee ,  Sung Chan Park ,  Suk Jin Ham

    IPC分类号： G01N30/16 ,  G01N21/33 ,  G01N1/10

    CPC分类号： G01N30/30

    摘要： Disclosed herein are a high temperature chromatography apparatus and a method thereof. The high temperature chromatography apparatus includes: an eluent pump; a sample dissolving unit that uniformly dissolves an insoluble sample; an injecting unit that mixes and injects the sample and the eluent; a column unit that separates materials; a detector that detects materials; a temperature measuring unit that measures the temperature of the sample dissolving unit, the injecting unit, and the column unit; a heating device that increases or decreases the temperature of the sample dissolving unit, the injecting unit, and the column unit; a temperature controller that maintains the measured temperature and the setting temperature to be the same as each other; and a controller.

    摘要翻译： 本文公开了高温色谱装置及其方法。 高温色谱装置包括：洗脱液泵; 均匀溶解不溶性样品的样品溶解单元; 注射单元，其混合并注射样品和洗脱液; 分离材料的柱单元; 检测材料的检测器; 温度测量单元，其测量样品溶解单元，注射单元和柱单元的温度; 加热装置，其增加或减少样品溶解单元，注射单元和柱单元的温度; 温度控制器，其将测量温度和设定温度保持彼此相同; 和控制器。

    Light emitting device and method of manufacturing the same
    35.
    发明申请
    Light emitting device and method of manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号：US20080023687A1

    公开(公告)日：2008-01-31

    申请号：US11599391

    申请日：2006-11-15

    申请人： Seung Tae Choi ,  Hyun Soo Kim ,  Jin Seung Choi ,  Suk Jin Ham ,  Ki Hwan Kwon ,  Chang Youl Moon

    发明人： Seung Tae Choi ,  Hyun Soo Kim ,  Jin Seung Choi ,  Suk Jin Ham ,  Ki Hwan Kwon ,  Chang Youl Moon

    IPC分类号： H01L29/06

    CPC分类号： H01L33/0079 ,  H01L33/54

    摘要： A method of manufacturing a light emitting device includes: forming a plurality of independent light emitting portions on a growth substrate; separating the light emitting portions from the growth substrate; mounting the light emitting portions onto a receiving substrate; and dicing the receiving substrate, onto which the light emitting portions are mounted, into a light emitting unit. Residual stress, which occurs when the light emitting portions are separated from the substrate, can be reduced, and the light emitting portions can be mounted onto the receiving substrate in a fluid state, whereby the light emitting device can be easily mass produced with excellent quality, and its manufacturing costs can be reduced.

    摘要翻译： 一种制造发光器件的方法包括：在生长衬底上形成多个独立的发光部分; 将发光部分与生长衬底分离; 将发光部分安装在接收基板上; 并将其上安装有发光部分的接收基板切割成发光单元。 当发光部分与基板分离时发生的残余应力可以减小，并且发光部分可以以流体状态安装到接收基板上，由此可以容易地以优质的质量批量生产发光器件 ，其制造成本可以降低。

    Packaging chip and packaging method thereof
    36.
    发明申请
    Packaging chip and packaging method thereof 失效
    包装芯片及其包装方法

    公开(公告)号：US20060273444A1

    公开(公告)日：2006-12-07

    申请号：US11390220

    申请日：2006-03-28

    申请人： Kyu-dong Jung ,  Woon-bae Kim ,  In-sang Song ,  Moon-chul Lee ,  Jun-sik Hwang ,  Suk-jin Ham

    发明人： Kyu-dong Jung ,  Woon-bae Kim ,  In-sang Song ,  Moon-chul Lee ,  Jun-sik Hwang ,  Suk-jin Ham

    IPC分类号： H01L23/48

    CPC分类号： H01L23/055 ,  H01L23/04 ,  H01L27/14618 ,  H01L2224/16

    摘要： A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.

    摘要翻译： 提供电路模块封装的封装芯片和封装电路模块的方法。 包装芯片包括基底晶片; 基底晶片上的电路模块; 封装晶片，其具有空腔并与所述基底晶片组合，使得所述电路模块装配在所述腔内; 连接所述空腔的上表面和下表面的连接电极; 以及连接电极和封装晶片之间的晶种层。 该方法包括蚀刻封装晶片的下表面以形成空腔，在下表面的区域中堆叠金属层，将基底晶片与封装晶片组合，抛光封装晶片，通过封装晶片形成通孔， 将种子层堆叠在包装晶片上，电镀通孔内部，去除种子层并形成电极。