Abstract:
An inverted Galilean finder is composed of an objective lens of a negative power and an eyepiece of a positive power, which are formed from a polystyrene resin by injection molding. The objective lens has a concave surface oriented to the eyepiece, and the eyepiece has a convex surface oriented to the objective lens. The inverted Galilean finder satisfies the following conditions: −0.75≦f1/f2≦−0.60 f1≦−22 −3.2≦f1/d≦−1.5 wherein f1 is a focal length of the objective lens, f2 is a focal length of the eyepiece, and “d” is an on-axis surface distance between the concave surface of the objective lens and the convex surface of the eyepiece. The inverted Galilean finder of the present invention provides a magnification of about 0.6 to 0.8.
Abstract:
A front light includes a light source, a light guide for receiving light from the light source through an end surface of the light guide and outputting the light through a first large surface which is substantially perpendicular to the end surface, and a polarization selecting section for selectively transmitting light having particular polarization, the polarization selecting section being attached to the first large surface of the light guide such that any reflection does not occur at an interface between the polarization selecting section and the light guide.
Abstract:
Disclosed is an isocyanuric acid adduct of 2-vinyl-4,6-diamino-S-triazine represented by the following structural formula: ##STR1## This adduct is prepared by heating 2-vinyl-4,6-diamino-S-triazine and isocyanuric acid in the presence of water, preferably by using sodium sulfide as a polymerization inhibitor. This adduct is valuable as a hardening agent for an epoxy resin.
Abstract:
An information processing system includes a first system and a second system. The first system and the second system each includes: hardware; a compensation section configured to provide execution environments for execution of a process using the hardware of the system to which the compensation section belongs; and a processing section configured to execute a predetermined process in the execution environments provided by the compensation section. The hardware of the first system and the hardware of the second system are different in nature from each other. The compensation section of one of the first system and the second system compensates for the differences between the hardware of the first system and the hardware of the second system to provide the processing section of the other with the execution environments which are not affected by the differences between the hardware of the first system and the hardware of the second system.
Abstract:
[Problem] To provide a thin film production process and a thin film production device, both of which enable the production of a dielectric thin film having small surface roughness.[Solution] This thin film production process comprises: supplying a mixed gas to a substrate (S) that is placed in a chamber (51) and has been heated, wherein the mixed gas comprises a metal raw material gas that serves as a raw material for a dielectric thin film having perovskite-type crystals and an oxidation gas that can react with the metal raw material gas; stopping the supply of the metal raw material gas to the substrate (S); and, subsequent to the stopping of the supply of the metal raw material gas, limiting the supply of the oxidation gas to the substrate (S).
Abstract:
Each of light guides (2) has: a reflection surface (2e); and a light emitting surface (2c) that is opposite to the reflection surface (2e) and is not covered by a neighboring light guide (2). The light emitting surface (2c) is made up of a first emitting surface (7) and a second emitting surface (8). The first emitting surface (7) is substantially parallel with the reflection surface (2e). The second emitting surface (8) is substantially parallel with an irradiated surface. The each of the light guides (2) is provided with microprisms (9) serving as diffusing means at least in a first emitting surface region (12) in which there is the first emitting surface (7).
Abstract:
In order for a light guide set including a light source such as an LED and a light guide member receiving light without leakage of light from the light source or the like to be provided, in the light guide set (ST) that includes an LED (32) and an light guide bar (11) which includes a light reception end (12R) receiving light from the LED (32) and which guides the received light and a holding member (25) which holds the LED (32) and the light reception end (12R) thereof on the side of the LED (32), a protrusion (11P) (a second engagement portion/a first engagement portion) is formed in the light guide bar (11), and an opening hole (26Dh) (the first engagement portion/the second engagement portion) is formed in the holding member (25).
Abstract:
A backlight (illumination device) according to the present invention includes a plurality of light sources, and a light guiding body for causing light emitted from the light sources to be emitted from a light emitting surface. The light sources are provided inside the light guiding body, and emit light in directions which are substantially parallel to a light emitting surface of the light guiding body. At least two of the plurality of light sources emit the light in directions which are different from each other. More specifically, at least two of the plurality of light sources are provided so as to face each other, and provided so that one of the plurality of light sources emits light toward the other one of the plurality of light sources, and vice versa.
Abstract:
An illumination device including a plurality of illumination areas, each of which is individually controllable, includes a plurality of light-emitting devices disposed in a matrix pattern in each of the illumination areas where emission colors are disposed in a different manner between adjacent rows and between adjacent columns. Consequently, the emission of uneven luminance or uneven color is prevented from occurring in boundary portions of each of the illumination areas.
Abstract:
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.