Abstract:
To provide a fluid control apparatus capable of reducing the space, while reducing the cost. A fluid control apparatus has a fluid controlling unit and a fluid introducing unit. The fluid introducing unit is divided into three parts: a first and a second inlet-side shutoff/open parts disposed on the inlet side, each made up of 2×N/2, disposed between the first and second inlet-side shutoff/open parts and the fluid controlling unit.
Abstract:
A thin film manufacturing method and a thin film manufacturing apparatus are provided to manufacture a thin film with good reproducibility. A dummy substrate is conveyed into a chamber, and a dummy processing gas is supplied to the dummy substrate. Moreover, a product substrate is conveyed into the chamber, and a raw material gas different from the dummy processing gas is supplied to the product substrate. The raw material gas contains metal material for manufacturing a thin film with a metal organic chemical vapor deposition (MOCVD) method. Since the raw material gas is not used as a dummy processing gas, the amount of metal material to be used can be minimized in manufacturing the thin film with good reproducibility.
Abstract:
A gas mixture supplying method includes supplying plural kinds of gases through gas supply lines connected to a common pipeline and supplying a gas mixture of the plural kinds of gases from a gas outlet of the common pipeline into a region where the gas mixture is used through a gas mixture supply line. When a typical gas supplied in a gaseous state from a gas supply unit and a liquid source gas vaporized by heating a liquid source material supplied from a liquid source material supply unit by a vaporizing unit are supplied simultaneously, the liquid source gas is supplied from one of the gas supply lines provided at a position closer to the gas outlet than that for the typical gas, and the liquid source gas is supplied to a downstream side of a filter for removing particles in the typical gas.
Abstract:
The present invention provides an optical fiber of which a zero dispersion wavelength falls within a range of between 1,250 nm and 1,350 nm inclusive, transmission loss at 1,550 nm is equal to or less than 0.185 dB/km, chromatic dispersion at 1,550 nm is within the range of 19±1 ps/nm·km, a dispersion slope at 1,550 nm is equal to or less than 0.06 ps/nm2·km, an effective area Aeff is equal to or more than 105 μm2, a cable cutoff wavelength λcc is equal to or less than 1,530 nm, polarization mode dispersion is equal to or less than 0.1 ps/km1/2, and a loss when the optical fiber is wound on a mandrel having an outer diameter of 20 mm is equal to or less than 10 dB/m.
Abstract:
The optical fiber includes a center core portion, a side core portion and clad portion, which has a dispersion value of 14-20 ps/nm/km at a wavelength of 1550 nm, a dispersion slope of 0.05-0.08 ps/nm2/km at a wavelength of 1550 nm and a transmission attenuation of 0.2 dB/km or less at a wavelength of 1550 nm, wherein the relative refractive index difference &Dgr;1 between the center core portion and the clad portion is 0.25-0.50%, the relative refractive index difference &Dgr;2 between the side core portion and the clad portion is 0.05-0.30%, an inequality &Dgr;2
Abstract:
In order to provide a thin film manufacturing method and a thin film manufacturing apparatus, wherein a thin film with good reproducibility can be manufactured at low cost, and in a way wherein resources are saved, a dummy substrate (S2) is conveyed into a chamber (51), dummy processing gas is supplied to the dummy substrate (S2), a product substrate (S3) is conveyed into the chamber (51), and raw material gas different from the dummy processing gas, and containing therein metal material for manufacturing a thin film with the Metal Organic Chemical Vapor Deposition (MOCVD) method, is supplied to the product substrate (S3). Since the raw material gas is not used as dummy processing gas, the amount of metal material to be used can be inhibited, and a thin film with good reproducibility can be manufactured at low cost, and in a way wherein resources are saved.
Abstract:
A gas mixture supplying method includes supplying plural kinds of gases through gas supply lines connected to a common pipeline and supplying a gas mixture of the plural kinds of gases from a gas outlet of the common pipeline to a region where the gas mixture is used through a gas mixture supply line. When two or more gases having different flow rates are supplied simultaneously, a gas having a relatively low flow rate is supplied from one of the gas supply lines provided at a position closer to the gas outlet than that for a gas having a relatively high flow rate.
Abstract:
To provide a fluid control apparatus capable of reducing the space, while reducing the cost.A fluid control apparatus 1 has a fluid controlling unit 2 and a fluid introducing unit 3. The fluid introducing unit 3 is divided into three parts: a first and a second inlet-side shutoff/open parts 5, 6 disposed on the inlet side, each made up of 2×N/2 on-off valves 23, and a fluid controlling unit-side shutoff/open part 7 made up of 4×M on-off valves 23, disposed between the first and second inlet-side shutoff/open parts 5, 6 and the fluid controlling unit 2.
Abstract:
[Problem] To provide a thin film production process and a thin film production device, both of which enable the production of a dielectric thin film having small surface roughness.[Solution] This thin film production process comprises: supplying a mixed gas to a substrate (S) that is placed in a chamber (51) and has been heated, wherein the mixed gas comprises a metal raw material gas that serves as a raw material for a dielectric thin film having perovskite-type crystals and an oxidation gas that can react with the metal raw material gas; stopping the supply of the metal raw material gas to the substrate (S); and, subsequent to the stopping of the supply of the metal raw material gas, limiting the supply of the oxidation gas to the substrate (S).
Abstract:
A gas mixture supplying method includes supplying plural kinds of gases through gas supply lines connected to a common pipeline and supplying a gas mixture of the plural kinds of gases from a gas outlet of the common pipeline into a region where the gas mixture is used through a gas mixture supply line. When a typical gas supplied in a gaseous state from a gas supply unit and a liquid source gas vaporized by heating a liquid source material supplied from a liquid source material supply unit by a vaporizing unit are supplied simultaneously, the liquid source gas is supplied from one of the gas supply lines provided at a position closer to the gas outlet than that for the typical gas, and the liquid source gas is supplied to a downstream side of a filter for removing particles in the typical gas.