Method for manufacturing semiconductor device
    31.
    发明授权
    Method for manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US07416942B2

    公开(公告)日:2008-08-26

    申请号:US11708532

    申请日:2007-02-21

    摘要: A method for manufacturing a semiconductor device is provided. The method includes successively forming a first silicon film and a mask film above a semiconductor substrate through a gate insulating film, forming a plurality of trenches in the first silicon film and in the mask film to a depth to reach the semiconductor substrate, filling the plurality of trenches with the silicon oxide film, removing the mask film to expose the first silicon film existing between the silicon oxide films, selectively growing a second silicon film on the first silicon film, planarizing the second silicon film using an alkaline slurry exhibiting a pH of 13 or less and containing abrasive grains and a cationic surfactant, thereby obtaining a floating gate electrode film comprising the first and second silicon films, forming an interelectrode insulating film on the entire surface, and forming a control gate electrode film on the interelectrode insulating film.

    摘要翻译: 提供一种制造半导体器件的方法。 该方法包括通过栅极绝缘膜在半导体衬底上连续地形成第一硅膜和掩模膜,在第一硅膜和掩模膜中形成多个沟槽到达半导体衬底的深度,填充多个 的沟槽,去除掩模膜以暴露存在于氧化硅膜之间的第一硅膜,选择性地生长第一硅膜上的第二硅膜,使用表现出pH为 13以下,含有磨粒和阳离子性表面活性剂,从而得到包含第一和第二硅膜的浮栅电极膜,在整个表面上形成电极间绝缘膜,并在电极间绝缘膜上形成控制栅极电极膜。

    Methods for manufacturing semiconductor devices
    32.
    发明申请
    Methods for manufacturing semiconductor devices 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20070111433A1

    公开(公告)日:2007-05-17

    申请号:US11594726

    申请日:2006-11-09

    IPC分类号: H01L21/8242

    摘要: A method for manufacturing a semiconductor device comprises forming a first silicon layer above a semiconductor substrate; forming a stopper layer on said first silicon layer; partially removing said stopper layer and said first silicon layer above said semiconductor substrate to form a plurality of trenches; forming an insulating layer on said stopper layer with inside of said trenches; partially removing said insulating layer to expose said stopper layer; after partially removing said insulating layer, removing said stopper layer to expose said first silicon layer; selectively growing second silicon layer on said exposed first silicon layer; nonselectively growing a third silicon layer on said second silicon layer; and polishing at least a surface of said third silicon layer by performing chemical mechanical polishing.

    摘要翻译: 一种制造半导体器件的方法包括在半导体衬底上形成第一硅层; 在所述第一硅层上形成阻挡层; 部分地去除所述半导体衬底之上的所述阻挡层和所述第一硅层以形成多个沟槽; 在所述沟槽的内部在所述阻挡层上形成绝缘层; 部分地去除所述绝缘层以暴露所述阻挡层; 在部分地去除所述绝缘层之后,去除所述阻挡层以露出所述第一硅层; 在所述暴露的第一硅层上选择性地生长第二硅层; 在所述第二硅层上非选择地生长第三硅层; 以及通过进行化学机械抛光来抛光所述第三硅层的至少一个表面。

    Method of chemical/mechanical polishing of the surface of semiconductor device
    34.
    发明授权
    Method of chemical/mechanical polishing of the surface of semiconductor device 失效
    半导体器件表面的化学/机械抛光方法

    公开(公告)号:US06867138B2

    公开(公告)日:2005-03-15

    申请号:US10217646

    申请日:2002-08-14

    摘要: The surface of a semiconductor device is polished by first supplying a polishing pad with a slurry that contains a solvent, abrasive grains, and an additive for making the viscosity of the slurry variable so that the top portion of the polishing pad is soaked with the slurry, then supplying the polishing pad with a viscosity modifier for increasing the viscosity of the slurry and hardening the top portion of the polishing pad soaked with the slurry, and finally polishing the surface of the semiconductor device with the slurry having its viscosity increased and the polishing pad having its top portion hardened.

    摘要翻译: 通过首先向抛光垫提供含有溶剂,磨料颗粒和添加剂的浆料来抛光半导体器件的表面,以使浆料的粘度可变,使得抛光垫的顶部用浆料浸泡 然后向抛光垫提供粘度调节剂,以增加浆料的粘度并硬化用浆料浸泡的抛光垫的顶部,最后用其粘度增加的浆料和抛光剂抛光半导体器件的表面 垫的顶部硬化。

    Rotary X-ray tube and method of manufacturing connecting rod consisting
of pulverized sintered material
    35.
    发明授权
    Rotary X-ray tube and method of manufacturing connecting rod consisting of pulverized sintered material 失效
    旋转式X射线管及由粉碎烧结体组成的连杆的制造方法

    公开(公告)号:US5208843A

    公开(公告)日:1993-05-04

    申请号:US700861

    申请日:1991-05-16

    摘要: A rotary anode x-ray tube includes a vacuum vessel in which a cathode, an anode target, a connecting rod, a rotor, bearings, and a heat conducting plate are arranged. The cathode electrode emits electrons. The anode target generates x-rays when electrons emitted from the cathode electrode collide with the target. The connecting rod supports the anode target. The connecting rod is constituted by a rod member consisting of a pulverized sintered material. The rotor is mounted on the connecting rod. The anode target is rotatably supported by the bearings. The heat conducting plate is arranged between the anode target and the rotor. A heat conducting plate made of a material having excellent heat conduction characteristics can be arranged between the anode target and the rotor. The connecting rod is manufactured by processes such as plasticization including tube spinning.

    摘要翻译: 旋转阳极x射线管包括其中布置阴极,阳极靶,连杆,转子,轴承和导热板的真空容器。 阴极发射电子。 当从阴极发射的电子与靶碰撞时,阳极靶产生X射线。 连杆支撑阳极靶。 连杆由由粉碎的烧结材料构成的杆构件构成。 转子安装在连杆上。 阳极靶由轴承可旋转地支撑。 导热板配置在阳极靶和转子之间。 可以在阳极靶和转子之间设置由具有优异导热特性的材料制成的导热板。 连杆通过包括管纺的增塑等工艺制造。