公开(公告)号：US07893947B2

公开(公告)日：2011-02-22

申请号：US11880903

申请日：2007-07-26

Applicant: Xin Fang

Inventor： Xin Fang

IPC: G06T11/20 ,  G09G5/00 ,  G09G5/02 ,  G06K9/40 ,  G06K9/32 ,  H04N1/46

CPC classification number: G06T11/20 ,  G01C11/04 ,  G06K9/4638 ,  G06T7/13 ,  G06T2207/10081 ,  G06T2207/30004 ,  G06T2207/30164 ,  G06T2207/30196

Abstract: A method for extracting edge with subpixel accuracy in photogrammetry, comprising steps of: a. capturing into a computer a picture, of which the edge is to be extracted; b. defining as a cell four neighboring pixels that form a square; c. recognizing the type of each cell composed of the four pixels; d. finding out side or sides of the cell that intersect with, the edge and figuring out the subpixel accuracy coordinates of the intersection points by linear interpolation; and e. connecting the intersection points to extract the edge. By this method edge curve is extracted rapidly and accurately. The edge determined in this way can be subpixel accurate.

Abstract translation: 一种用于在摄影测量中提取具有子像素精度的边缘的方法，包括以下步骤：a。 将计算机中的边缘捕获到图像中; b。 定义为形成正方形的四个相邻像素的单元格; C。 识别由四个像素组成的每个单元的类型; d。 找出与边缘相交的单元格的边或边，并通过线性插值计算交点的子像素精度坐标; 和e。 连接交叉点提取边缘。 通过这种方法，边缘曲线被快速准确地提取。 以这种方式确定的边缘可以是子像素准确。

公开(公告)号：US20050195554A1

公开(公告)日：2005-09-08

申请号：US11060109

申请日：2005-02-17

Applicant: William Borland ,  Xin Fang

Inventor： William Borland ,  Xin Fang

IPC: H01G4/01 ,  H01G4/255 ,  H05K1/09 ,  H05K1/16 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46 ,  H01G4/005

CPC classification number: H01G4/01 ,  H01G4/255 ,  H05K1/092 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09236 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2203/107 ,  H05K2203/171 ,  H05K2203/175

Abstract: In a printed wiring board, capacitors have electrode layers that may be selectively trimmed to obtain high tolerances. The electrode layers can be formed from a plurality of elongated electrode portions, each of which can be selectively trimmed. The electrode layers can also be formed from interdigitated elongated electrode portions.

Abstract translation: 在印刷电路板中，电容器具有可以选择性地修整以获得高公差的电极层。 电极层可以由多个细长电极部分形成，每个细长电极部分可以选择性地修整。 电极层也可以由叉指的细长电极部分形成。

公开(公告)号：US20050154105A1

公开(公告)日：2005-07-14

申请号：US10754348

申请日：2004-01-09

Applicant: John Summers ,  Thomas Dueber ,  Cheng-Chung Chen ,  Xin Fang ,  John Felten

Inventor： John Summers ,  Thomas Dueber ,  Cheng-Chung Chen ,  Xin Fang ,  John Felten

IPC: C08L101/12 ,  C08K3/08 ,  C08K3/22 ,  C08K5/3447 ,  C08L3/00 ,  C08L25/06 ,  C08L45/00 ,  C08L61/04 ,  C08L65/00 ,  C08L67/00 ,  C08L67/03 ,  C08L71/12 ,  C09D7/12 ,  C09D145/00 ,  C09D167/03 ,  C09D201/00 ,  C09J9/02 ,  H01C7/00 ,  H01C17/06 ,  H01C17/065 ,  H01G4/18 ,  H05K1/16 ,  H05K3/28 ,  C08K3/10 ,  C08K3/18

CPC classification number: H01C17/06586 ,  C08K3/08 ,  C08K3/12 ,  C08K3/22 ,  C08L25/06 ,  C08L61/04 ,  C08L65/00 ,  C08L67/00 ,  C08L67/03 ,  C08L71/12 ,  C09D167/03 ,  C09J9/02 ,  H05K1/167 ,  H05K3/285 ,  C08L2666/16 ,  C08L2666/06 ,  C08L2666/22

Abstract: A composition comprising: a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less; one or more metals or metal compounds; and an organic solvent. The polymer can optionally include sites that can crosslink with one or more crosslinking agents. The compositions can be used to produce electronic components such as resistors, discrete or planar capacitors, conductive adhesives and electrical and thermal conductors. The invention is also directed to a composition comprising a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less, and an organic solvent. These compositions can also be used in a number of electronic applications such as an encapsulant and as an integrated circuit packaging material.

Abstract translation: 一种组合物，其包含：玻璃化转变温度高于250℃，吸水率为2％以下的聚合物; 一种或多种金属或金属化合物; 和有机溶剂。 聚合物可以任选地包括可以与一种或多种交联剂交联的位点。 组合物可用于生产电子部件，例如电阻器，分立或平面电容器，导电粘合剂和电导体和导热体。 本发明还涉及包含玻璃化转变温度高于250℃，吸水率为2％以下的聚合物和有机溶剂的组合物。 这些组合物也可用于许多电子应用中，例如密封剂和集成电路封装材料。

公开(公告)号：US20050063135A1

公开(公告)日：2005-03-24

申请号：US10664638

申请日：2003-09-18

Applicant: William Borland ,  Xin Fang

Inventor： William Borland ,  Xin Fang

IPC: H01G4/01 ,  H01G4/255 ,  H05K1/09 ,  H05K1/16 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46 ,  H01G4/005

CPC classification number: H01G4/01 ,  H01G4/255 ,  H05K1/092 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09236 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2203/107 ,  H05K2203/171 ,  H05K2203/175

Abstract: In a printed wiring board, capacitors have electrode layers that may be selectively trimmed to obtain high tolerances. The electrode layers can be formed from a plurality of elongated electrode portions, each of which can be selectively trimmed. The electrode layers can also be formed from interdigitated elongated electrode portions.