Abstract:
An electronic device that includes a plug connector having a tab adapted to be inserted into a receptacle connector of a second device during a mating event, the tab including first and second opposing surfaces and a contact region formed at the first surface of the tab, the contact region including a plurality of contacts spaced apart along a first row, the plurality of contacts including a first contact, a power contact and a ground contact; a computer-readable memory having identification, configuration and authentication information relevant to the electronic device that can be communicated to the second device during a mating event stored therein; circuitry coupled to the first contact and configured to, after a mating event in which the plug connector is inserted into the receptacle connector, participate in a handshaking algorithm that includes receiving a command over the first contact from the second device and sending a response to the command that includes contact configuration information for the electronic device over the first contact to the second device; and power circuitry, coupled to the power contact, configured to deliver power to charge a device coupled to the electronic device via the plug connectors.
Abstract:
An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.
Abstract:
Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
Abstract:
An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.
Abstract:
An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
Abstract:
Cable structures with multi-material extruded strain reliefs and systems and methods for making the same are provided. In some embodiments, a cable structure may include at least two materials simultaneously extruded through a die and about a conductor. A relationship between the two materials may be changed during the simultaneous extrusion for varying the stiffness of the cable structure, which may thereby provide a strain relief region to the cable structure. One of the two materials may be stiffer than another of the two materials, and the ratio of the amount or thickness of one of the two materials with respect to the amount or thickness of the other of the two materials may be varied during the extrusion process to vary the stiffness of the cable structure along its length for providing the strain relief region.
Abstract:
Methods and apparatuses for improved efficiency of power transfer across an inductive charging interface by selectively activating, deactivating, or modifying one or more of a plurality of transmit coils associated with an inductive power transmitter are disclosed.
Abstract:
An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.
Abstract:
An inductive charging interface with magnetic retention can be used for charging electronic devices and accessories. For example, a magnetic core of an inductive charging configuration may be divided into two magnetic elements, one element can be housed within a receptacle or receiving connector of housing of an electric device and the other element can be housed within a plug or transmission connector. The poles of the two elements of the magnetic core may create a magnetic field to retain the plug connector in an aligned, mated position with the receptacle connector of the electronic device in addition to directing magnetic flux to flow in a circular path around and between the two elements of the magnetic core, thereby inducing a current for charging the internal battery of a device.
Abstract:
Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.