Methods for attaching structures using heat activated thermoset film and induction heating
    34.
    发明授权
    Methods for attaching structures using heat activated thermoset film and induction heating 有权
    使用热活化热固性薄膜和感应加热连接结构的方法

    公开(公告)号:US09492967B2

    公开(公告)日:2016-11-15

    申请号:US14254431

    申请日:2014-04-16

    Applicant: Apple Inc.

    Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

    Abstract translation: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上,或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。

    LOW PROFILE CONNECTOR
    35.
    发明申请
    LOW PROFILE CONNECTOR 有权
    低型连接器

    公开(公告)号:US20150357733A1

    公开(公告)日:2015-12-10

    申请号:US14300855

    申请日:2014-06-10

    Applicant: Apple Inc.

    Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.

    Abstract translation: 一种电路板对板连接器,包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件,这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。

    CABLE STRUCTURES WITH MULTI-MATERIAL EXTRUDED STRAIN RELIEFS AND SYSTEMS AND METHODS FOR MAKING THE SAME
    36.
    发明申请
    CABLE STRUCTURES WITH MULTI-MATERIAL EXTRUDED STRAIN RELIEFS AND SYSTEMS AND METHODS FOR MAKING THE SAME 审中-公开
    具有多材料挤压应变消除和系统的电缆结构及其制造方法

    公开(公告)号:US20150357083A1

    公开(公告)日:2015-12-10

    申请号:US14501784

    申请日:2014-09-30

    Applicant: Apple Inc.

    CPC classification number: H01B13/141

    Abstract: Cable structures with multi-material extruded strain reliefs and systems and methods for making the same are provided. In some embodiments, a cable structure may include at least two materials simultaneously extruded through a die and about a conductor. A relationship between the two materials may be changed during the simultaneous extrusion for varying the stiffness of the cable structure, which may thereby provide a strain relief region to the cable structure. One of the two materials may be stiffer than another of the two materials, and the ratio of the amount or thickness of one of the two materials with respect to the amount or thickness of the other of the two materials may be varied during the extrusion process to vary the stiffness of the cable structure along its length for providing the strain relief region.

    Abstract translation: 提供具有多材料挤压应变消除的电缆结构以及用于制造其的系统及方法。 在一些实施例中,电缆结构可以包括同时挤出通过模头和围绕导体的至少两种材料。 两个材料之间的关系可以在同时挤压期间改变以改变电缆结构的刚度,从而可以为电缆结构提供应变消除区域。 两种材料中的一种可以比两种材料中的一种材料更硬,并且两种材料中的一种材料的量或厚度相对于两种材料中另一种材料的量或厚度的比例可以在挤出过程中变化 以沿着其长度改变电缆结构的刚度,以提供应变消除区域。

    MULTI-COIL INDUCTION
    37.
    发明申请
    MULTI-COIL INDUCTION 审中-公开
    多线圈感应

    公开(公告)号:US20150303699A1

    公开(公告)日:2015-10-22

    申请号:US14256628

    申请日:2014-04-18

    Applicant: Apple Inc.

    Abstract: Methods and apparatuses for improved efficiency of power transfer across an inductive charging interface by selectively activating, deactivating, or modifying one or more of a plurality of transmit coils associated with an inductive power transmitter are disclosed.

    Abstract translation: 公开了通过选择性地激活,去激活或修改与感应功率发射器相关联的多个发射线圈中的一个或多个的,从而提高跨感应充电接口的功率传输效率的方法和装置。

    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating
    38.
    发明申请
    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating 有权
    使用热活性热固性薄膜和感应加热连接结构的方法

    公开(公告)号:US20150298392A1

    公开(公告)日:2015-10-22

    申请号:US14254431

    申请日:2014-04-16

    Applicant: Apple Inc.

    Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

    Abstract translation: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上,或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。

    INDUCTIVE CHARGING INTERFACE WITH MAGNETIC RETENTION FOR ELECTRONIC DEVICES AND ACCESSORIES
    39.
    发明申请
    INDUCTIVE CHARGING INTERFACE WITH MAGNETIC RETENTION FOR ELECTRONIC DEVICES AND ACCESSORIES 有权
    用于电子设备和配件的磁感应电感式接口

    公开(公告)号:US20150091388A1

    公开(公告)日:2015-04-02

    申请号:US14500543

    申请日:2014-09-29

    Applicant: APPLE INC.

    Abstract: An inductive charging interface with magnetic retention can be used for charging electronic devices and accessories. For example, a magnetic core of an inductive charging configuration may be divided into two magnetic elements, one element can be housed within a receptacle or receiving connector of housing of an electric device and the other element can be housed within a plug or transmission connector. The poles of the two elements of the magnetic core may create a magnetic field to retain the plug connector in an aligned, mated position with the receptacle connector of the electronic device in addition to directing magnetic flux to flow in a circular path around and between the two elements of the magnetic core, thereby inducing a current for charging the internal battery of a device.

    Abstract translation: 具有磁保持力的感应充电接口可用于对电子设备和附件进行充电。 例如,感应充电结构的磁芯可以被分成两个磁性元件,一个元件可以容纳在电气设备的外壳的插座或接收连接器中,而另一个元件可被容纳在插头或传输连接器内。 磁芯的两个元件的极点可以产生磁场,以将插头连接器保持在与电子设备的插座连接器对准的配合位置,除了引导磁通量在圆周路径内流动 磁芯的两个元件,从而引起用于为设备的内部电池充电的电流。

    Hotbar device and methods for assembling electrical contacts to ensure co-planarity
    40.
    发明授权
    Hotbar device and methods for assembling electrical contacts to ensure co-planarity 有权
    Hotbar器件和组装电触点的方法,以确保共面性

    公开(公告)号:US08893952B2

    公开(公告)日:2014-11-25

    申请号:US14037156

    申请日:2013-09-25

    Applicant: Apple Inc.

    Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

    Abstract translation: 本文提供了用于在连接器中组装共面电触头的装置和方法。 在一个方面,一种组装的示例性方法包括将焊料沉积在连接器插头外壳中,将电触点定位在焊料沉积物上,使热条朝向接触每个电触头的外壳移动,以使每个电触头的顶表面平坦化 与外壳接触并用加热的热棒熔化焊料,以将电触点焊接到外壳。 在一个方面,示例性的热条装置包括用于将电触点可释放地连接到热棒的磁体。 另一方面,热水箱包括用于加热电触点和用于接触外壳的绝缘陶瓷部分的金属部分。 在另一方面,导电热棒包括远离底部加热表面延伸的侧部部分,有助于流过热棒的更均匀的电流流动。

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