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    Manipulating Surface Topology of BMG Feedstock
    32.
    发明申请
    Manipulating Surface Topology of BMG Feedstock 审中-公开
    操纵BMG原料的表面拓扑

    公开(公告)号：US20160102391A1

    公开(公告)日：2016-04-14

    申请号：US14740182

    申请日：2015-06-15

    Applicant: Apple Inc.

    Inventor： Christopher D. Prest ,  Joseph C. Poole ,  Joseph Stevick ,  Quoc Tran Pham ,  Theodore Andrew Waniuk

    IPC: C22C45/10 ,  C22C45/00 ,  C22C30/00 ,  C22C45/02

    CPC classification number: C22C45/10 ,  B22D17/00 ,  B22D25/06 ,  B22D41/01 ,  C22C1/002 ,  C22C1/02 ,  C22C30/00 ,  C22C33/003 ,  C22C45/00 ,  C22C45/001 ,  C22C45/003 ,  C22C45/02

    Abstract: Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.

    Abstract translation: 本文描述的是包含BMG的原料。 原料具有平均粗糙度至少为200微米的表面。 本文还描述了包含BMG的原料。 原料在原料熔化过程中支持在载体上时，在原料和载体之间具有高达载体总面积的50％的接触面积。 这些原料可以通过将BMG的铸锭成型为具有表面图案的摩尔制成，将一个或多个芯部包裹在具有粗糙表面，化学蚀刻，激光烧蚀，机械加工，研磨，喷砂或喷丸硬化的护套中。 原料可以在注射成型工艺中用作原料。

    Electronic Device Having Components With Stress Visualization Features
    34.
    发明申请
    Electronic Device Having Components With Stress Visualization Features 有权
    具有应力可视化特征的元件的电子器件

    公开(公告)号：US20150300961A1

    公开(公告)日：2015-10-22

    申请号：US14254501

    申请日：2014-04-16

    Applicant: Apple Inc.

    Inventor： Dhaval N. Shah ,  Joseph C. Poole

    IPC: G01N21/88

    CPC classification number: G01N21/8803 ,  G01M5/0041 ,  G01M5/005 ,  G01M5/0091 ,  G01M11/081 ,  G01N21/45 ,  G01N21/8851 ,  G01N2033/0095

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 可以使用这些电子器件结构上的涂层来形成应力感测结构。 应力感测结构可以具有在焊盘之间延伸的条形连接件，或者可以由橡皮布膜形成。 应力感测涂层可以由透明薄膜形成。 透明薄膜可以用单色光照亮，而摄像机捕获所得光学干涉图案的视频图像。 可以在测试期间捕获视频图像，其中设备结构暴露于来自设备和外部对象之间的冲击的压力。 应力感测涂层也可以由暴露于应力时产生裂纹的材料层形成。 应力传感结构可用于评估测试过程中的应力，并在正常使用设备期间监测应力。

    Methods for shielding electronic components from moisture
    35.
    发明授权
    Methods for shielding electronic components from moisture 有权
    屏蔽电子元件免受潮湿的方法

    公开(公告)号：US09161434B2

    公开(公告)日：2015-10-13

    申请号：US14230639

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： Nicholas G. Merz ,  Scott A. Myers ,  Gregory N. Stephens ,  Joseph C. Poole

    IPC: H01L21/00 ,  H05K1/02 ,  C23C16/50 ,  H05K3/28 ,  C23C16/04

    CPC classification number: H05K1/0216 ,  C23C16/042 ,  C23C16/50 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10189 ,  H05K2201/10371

    Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

    Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地，疏水涂层可以通过等离子体辅助化学气相沉积（PACVD）方法施加到完全组装的电路板上。 通常，完全组装的电路板可以具有各种部件，例如覆盖水敏电子器件的电磁干扰（EMI）屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中，板对板连接器的焊接引线可以被硅树脂密封覆盖。

    Cold chamber die casting with melt crucible under vacuum environment
    39.
    发明授权
    Cold chamber die casting with melt crucible under vacuum environment 有权
    在真空环境下使用熔体坩埚进行冷室压铸

    公开(公告)号：US08826968B2

    公开(公告)日：2014-09-09

    申请号：US13628267

    申请日：2012-09-27

    Applicant: Apple Inc.

    Inventor： Theodore A. Waniuk ,  Joseph Stevick ,  Sean O'Keeffe ,  Dermot J. Stratton ,  Joseph C. Poole ,  Matthew S. Scott ,  Christopher D. Prest

    IPC: B22D17/10 ,  B22D17/14

    CPC classification number: B22D25/06 ,  B22D1/002 ,  B22D17/10 ,  B22D17/14 ,  B22D17/20 ,  B22D17/30 ,  B22D27/15 ,  B22D35/04 ,  B22D41/00 ,  B22D41/02 ,  B22D41/08 ,  B22D41/16

    Abstract: Exemplary embodiments described herein relate to methods and systems for casting metal alloys into articles such as BMG articles. In one embodiment, processes involved for storing, pre-treating, alloying, melting, injecting, molding, etc. can be combined as desired and conducted in different chambers. During these processes, each chamber can be independently, separately controlled to have desired chamber environment, e.g., under vacuum, in an inert gas environment, or open to the surrounding environment. Due to the flexible, independent control of each chamber, the casting cycle time can be reduced and the production throughput can be increased. Contaminations of the molten materials and thus the final products are reduced or eliminated.

    Abstract translation: 本文描述的示例性实施例涉及将金属合金铸造成诸如BMG制品的制品的方法和系统。 在一个实施方案中，用于储存，预处理，合金化，熔化，注射，模塑等的方法可以根据需要组合并在不同的室中进行。 在这些过程中，每个室可以独立地被控制以具有期望的室环境，例如在真空中，在惰性气体环境中，或者对周围环境开放。 由于每个室的灵活独立控制，可以减少铸造周期时间并且可以提高生产量。 熔融材料和最终产品的污染减少或消除。

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