NEURAL STIMULATOR WITH PERCUTANEOUS CONNECTIVITY
    31.
    发明申请
    NEURAL STIMULATOR WITH PERCUTANEOUS CONNECTIVITY 有权
    神经刺激器具有连贯性

    公开(公告)号:US20120203318A1

    公开(公告)日:2012-08-09

    申请号:US13500731

    申请日:2010-09-30

    IPC分类号: A61N1/00

    摘要: An implantable neurostimulation system includes both implantable and external components. Electrical connectivity between the external and implanted components is achieved through a plurality of feedthrough pins located within an insulative wall of a percutaneous port embedded in the skin. The percutaneous port has the general shape and appearance of a small thimble, embedded in the skin with its open end facing outwardly from the skin surface, and with its closed end located below the skin surface, thereby forming a cavity or dimple in the skin. Various plugs or cartridges can be removably inserted into the cavity of the percutaneous port, in various orientations, to facilitate appropriate connectivity between the external and implanted components of the system through selected ones of the feedthrough pins. A mesh edging secured around the periphery wall of the port promotes tissue ingrowth and vascularization, thereby forming a percutaneous seal around the port that prevents infection.

    摘要翻译: 植入式神经刺激系统包括可植入和外部组件。 外部和植入部件之间的电连接通过位于皮肤内的经皮端口的绝缘壁内的多个穿通针来实现。 经皮端口具有嵌入皮肤中的小套管的一般形状和外观,其开口端从皮肤表面向外,并且其封闭端位于皮肤表面下方,从而在皮肤中形成空腔或凹坑。 可以以各种取向将各种插头或药筒可移除地插入到经皮端口的空腔中,以通过选定的馈通针来促进系统的外部部件和植入部件之间的适当连接。 围绕端口的周围壁固定的网状边缘促进组织向内生长和血管形成,从而在端口周围形成防止感染的经皮密封。

    Electrode contact configurations for an implantable stimulator
    35.
    发明授权
    Electrode contact configurations for an implantable stimulator 有权
    可植入刺激器的电极接触配置

    公开(公告)号:US07702385B2

    公开(公告)日:2010-04-20

    申请号:US11280582

    申请日:2005-11-16

    IPC分类号: A61N1/05

    摘要: An exemplary implantable stimulator includes at least one electrode contact array and at least one additional electrode contact. Both the electrode contact array and the additional electrode contact are disposed on an external surface of the stimulator. The electrode contact array includes multiple electrode contacts that are configured to have a first polarity. The additional electrode is configured to have a second polarity. One or more of the electrode contacts disposed on the stimulator are configured to deliver monopolar stimulation and/or multipolar stimulation. Exemplary methods of stimulating a stimulation site within a patient include providing at least one electrode contact array and at least one additional electrode contact. Both the electrode contact array and the additional electrode contact are disposed on an external surface of the stimulator. The electrode contact array includes multiple electrode contacts that are configured to have a first polarity. The additional electrode is configured to have a second polarity. The method further includes applying an electrical stimulation current to the stimulation site via one or more of the electrode contacts that are disposed on the stimulator.

    摘要翻译: 示例性可植入刺激器包括至少一个电极接触阵列和至少一个附加电极接触。 电极接触阵列和附加电极接触都设置在刺激器的外表面上。 电极接触阵列包括被配置为具有第一极性的多个电极接触。 附加电极被配置为具有第二极性。 设置在刺激器上的一个或多个电极接触器被配置成传递单极刺激和/或多极刺激。 刺激患者内的刺激部位的示例性方法包括提供至少一个电极接触阵列和至少一个另外的电极接触。 电极接触阵列和附加电极接触都设置在刺激器的外表面上。 电极接触阵列包括被配置为具有第一极性的多个电极接触。 附加电极被配置为具有第二极性。 该方法还包括经由设置在刺激器上的一个或多个电极接触件向刺激部位施加电刺激电流。

    Implanted ceramic case with enhanced ceramic case strength
    40.
    发明授权
    Implanted ceramic case with enhanced ceramic case strength 失效
    嵌入式陶瓷表壳,增强陶瓷表壳强度

    公开(公告)号:US06411854B1

    公开(公告)日:2002-06-25

    申请号:US09353237

    申请日:1999-07-14

    IPC分类号: A61N1375

    CPC分类号: A61N1/375

    摘要: An implantable medical device is made from an electronic subassembly hermetically sealed in a ceramic case filled with a potting material. Use of the potting material enhances the capacity of the device to withstand mechanical shock without failure. The device includes a hollow ceramic or other case having an open end to which a metal ring is hermetically bonded. The inside surface of the ceramic case is treated (cleansed and activated) to assure the potting material adheres to it. The potting material, while in a non-cured fluid or quasi-fluid state, is inserted inside of the ceramic case. The electronic circuitry is next inserted into the open end of the ceramic case while the potting material is still in a non-cured, soft or fluid state. The electronic circuitry displaces some of the potting material and the potting material fills the voids between the electronic circuitry and the ceramic case. The potting material is then slowly cured, and once cured, supports the walls of the ceramic case and protects the electronic circuitry embedded therein. A header (to which the electronic circuitry is attached) is hermetically bonded to the metal band on the open end of the ceramic case, thereby hermetically sealing the implantable device.

    摘要翻译: 植入式医疗装置由密封在填充有灌封材料的陶瓷壳体中的电子组件制成。 灌封材料的使用增强了设备承受机械冲击而无故障的能力。 该装置包括中空陶瓷或具有开口端的其它壳体,金属环与气密结合。 陶瓷外壳的内表面被处理(清洁和激活),以确保灌封材料粘附在其上。 灌封材料在未固化的流体或准流体状态下插入陶瓷壳体内部。 接下来,电子电路插入到陶瓷外壳的开口端,同时灌封材料仍处于非固化,软或流体状态。 电子电路置换一些灌封材料,并且灌封材料填充电子电路和陶瓷壳体之间的空隙。 灌封材料然后缓慢固化,一旦固化,就支撑陶瓷壳体的壁并保护嵌入其中的电子电路。 将标题(电子电路连接到其上)与陶瓷外壳的开口端上的金属带气密地结合,从而气密地密封可植入装置。