公开(公告)号：US20180239095A1

公开(公告)日：2018-08-23

申请号：US15902923

申请日：2018-02-22

Applicant: Ayar Labs, Inc.

Inventor： Mark Wade ,  Chen Sun ,  John Fini ,  Roy Edward Meade ,  Vladimir Stojanovic ,  Alexandra Wright

IPC: G02B6/42 ,  H01L29/06

CPC classification number: G02B6/423 ,  G02B6/3636 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/4283 ,  H01L29/0649

Abstract: A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.

公开(公告)号：US20180062761A1

公开(公告)日：2018-03-01

申请号：US15687413

申请日：2017-08-25

Applicant: Ayar Labs, Inc.

Inventor： Mark Wade ,  Chen Sun ,  Nandish Mehta

IPC: H04B10/67 ,  G02B6/293 ,  G02B6/12 ,  H01L27/144 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L31/028 ,  H01L31/0312 ,  H01L31/0368 ,  H01L31/103 ,  H01L31/18

CPC classification number: H04B10/67 ,  G02B6/12004 ,  G02B6/29338 ,  G02B6/4289 ,  G02B2006/12061 ,  G02B2006/12078 ,  G02B2006/12123 ,  H01L27/1443 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/024 ,  H01L31/028 ,  H01L31/0312 ,  H01L31/03682 ,  H01L31/103 ,  H01L31/1804

Abstract: An optical cavity is formed to have a circuitous configuration. The optical cavity is configured to receive light coupled from a waveguide. At least two photodetector sections are formed over respective portions of the optical cavity. Each of the at least two photodetector sections is configured to detect light present within the optical cavity. Each of the at least two photodetector sections is configured for separate and independent control.

公开(公告)号：US20240418939A1

公开(公告)日：2024-12-19

申请号：US18816979

申请日：2024-08-27

Applicant: Ayar Labs, Inc.

Inventor： Pavan Bhargava ,  Derek Van Orden ,  Mark Wade ,  John Fini ,  Chen Sun ,  Milos Popovic ,  Anatol Khilo

IPC: G02B6/293 ,  G02B6/27 ,  G02B6/42 ,  G02B27/10 ,  H04B10/60

Abstract: An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.

公开(公告)号：US12057332B2

公开(公告)日：2024-08-06

申请号：US15646039

申请日：2017-07-10

Applicant: Ayar Labs, Inc.

Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic

IPC: H01L21/304 ,  B05D1/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/36 ,  G03F7/16 ,  G03F9/00 ,  H01L21/67 ,  H01S5/026

CPC classification number: H01L21/6715 ,  B05D1/005 ,  G02B6/12004 ,  G02B6/1225 ,  G02B6/3692 ,  G03F7/162 ,  G03F9/708 ,  G03F9/7084 ,  H01S5/0265 ,  G02B2006/12061

Abstract: A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These specific regions are etched to form etched regions through the backside of the chips to a specified depth within the chips. The specified depth may correspond to an etch stop material. Etching of the backside of the wafer can also be done along the chip kerf regions to reduce stress during singulation/dicing of individual chips from the wafer. Etching of the backside of the chips can be done with the chips still part of the intact wafer. Or, the wafer having the pattered and developed photoresist on its backside can be singulated/diced before etching through the backside of the individual chips. The etched region(s) formed through the backside of a chip can be used for attachment of optical component(s) to the chip.

公开(公告)号：US11709319B2

公开(公告)日：2023-07-25

申请号：US17353776

申请日：2021-06-21

Applicant: Ayar Labs, Inc.

Inventor： Pavan Bhargava ,  Derek Van Orden ,  Mark Wade ,  John Fini ,  Chen Sun ,  Milos Popovic ,  Anatol Khilo

IPC: G02B6/293 ,  G02B27/10 ,  G02B6/27 ,  G02B6/42 ,  H04B10/60

CPC classification number: G02B6/29343 ,  G02B6/272 ,  G02B6/2766 ,  G02B6/2773 ,  G02B6/2934 ,  G02B6/4213 ,  G02B6/4215 ,  G02B27/1006 ,  H04B10/60

Abstract: An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.

公开(公告)号：US20230194782A1

公开(公告)日：2023-06-22

申请号：US18168555

申请日：2023-02-13

Applicant: Ayar Labs, Inc.

Inventor： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC: G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43

CPC classification number: G02B6/12019 ,  G02B6/12016 ,  G02B6/29335 ,  G02B6/125 ,  G02B6/43 ,  G02B2006/12107 ,  H04B10/25

Abstract: An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US11579361B2

公开(公告)日：2023-02-14

申请号：US17184537

申请日：2021-02-24

Applicant: Ayar Labs, Inc.

Inventor： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC: G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43 ,  H04B10/25

Abstract: An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US20220224433A1

公开(公告)日：2022-07-14

申请号：US17583185

申请日：2022-01-24

Applicant: Ayar Labs, Inc.

Inventor： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/50

Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US11280959B2

公开(公告)日：2022-03-22

申请号：US16856387

申请日：2020-04-23

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Chen Sun ,  Shahab Ardalan ,  John Fini ,  Forrest Sedgwick

IPC: G02B6/13 ,  G02B6/12 ,  H01L21/66 ,  G01M11/00

Abstract: An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

公开(公告)号：US11237333B2

公开(公告)日：2022-02-01

申请号：US16831734

申请日：2020-03-26

Applicant: Ayar Labs, Inc.

Inventor： Pavan Bhargava ,  John Fini ,  Derek Van Orden ,  Chen Sun ,  Mark Wade

IPC: G02B6/26 ,  G02B6/293 ,  G02F1/225

Abstract: A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.