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31.发明授权公开(公告)号：US12002913B2
公开(公告)日：2024-06-04
申请号：US17417660
申请日：2020-10-22
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu Li , Guangcai Yuan , Zhanfeng Cao , Ke Wang , Qi Qi
CPC classification number: H01L33/62 , H01L33/005 , H01L2933/0066
Abstract: The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.
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公开(公告)号：US20240105893A1
公开(公告)日：2024-03-28
申请号：US17769022
申请日：2021-06-11
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ke Wang , Zhanfeng Cao , Qi Qi , Yan Qu
CPC classification number: H01L33/62 , H01L25/167
Abstract: A substrate, a backlight module, and a display apparatus, which relates to the technical field of display. The substrate is configured to display or provide a backlight, and the substrate includes: a bonding region (OB) and a plurality of light-emitting regions (OA); each of the plurality of light-emitting regions (OA) includes a first metal layer (1) and a first conductive adhesive (2) located on the first metal layer (1), the first conductive adhesive (2) is a photo-curing conductive adhesive; and the bonding region (OB) includes a second metal layer (3) and a second conductive adhesive (4) located on the second metal layer (3).
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公开(公告)号：US20240088170A1
公开(公告)日：2024-03-14
申请号：US18518526
申请日：2023-11-23
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/1251 , H01L27/127
Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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公开(公告)号：US11894394B2
公开(公告)日：2024-02-06
申请号：US17281015
申请日：2020-01-03
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhanfeng Cao , Yingwei Liu , Ke Wang , Guocai Zhang , Jianguo Wang , Zhiwei Liang , Haixu Li , Muxin Di
CPC classification number: H01L27/124 , C25D7/123 , C25D17/007 , H01L27/127 , H01L27/156
Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.
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公开(公告)号：US11796877B2
公开(公告)日：2023-10-24
申请号：US17984469
申请日：2022-11-10
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liang Chen , Minghua Xuan , Dongni Liu , Haoliang Zheng , Li Xiao , Zhenyu Zhang , Hao Chen , Ke Wang
IPC: G02F1/1362 , H10K59/131
CPC classification number: G02F1/136286 , H10K59/131
Abstract: The present disclosure discloses a display panel and a display device. The display panel includes: a base substrate, including a plurality of substrate via holes located in a display area of the display panel; and a plurality of driving signal lines and a plurality of bonding terminals, respectively located on different sides of the base substrate. At least one of the plurality of driving signal lines is electrically connected to at least one of the plurality of bonding terminals through the substrate via hole(s).
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Patent Agency Ranking
36.发明公开公开(公告)号：US20230260982A1
公开(公告)日：2023-08-17
申请号：US18137857
申请日：2023-04-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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公开(公告)号：US11600747B2
公开(公告)日：2023-03-07
申请号：US16959097
申请日：2019-08-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei Liang , Yingwei Liu , Han Yue , Minghua Xuan , Hsuanwei Mai , Zhanfeng Cao , Ke Wang , Huijuan Wang , Guangcai Yuan , Zhijun Lv , Xinhong Lu
Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.
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38.发明授权公开(公告)号：US11588085B2
公开(公告)日：2023-02-21
申请号：US16766197
申请日：2019-05-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shengguang Ban , Zhanfeng Cao , Ke Wang
Abstract: A light emitting drive substrate, a manufacturing method of the light emitting drive substrate, a light emitting substrate and a display device. The light emitting drive substrate includes a first light-emitting subregion, a second light-emitting subregion, a periphery area, a first power supply wire and a second power supply wire. A resistance between the first end and the second end of the first power supply wire is equal to a resistance between the first end and the second end of the second power supply wire, and a wire length between the first end and the second end of the first power supply wire is not equal to a wire length between the first end and the second end of the second power supply wire.
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公开(公告)号：US11495718B2
公开(公告)日：2022-11-08
申请号：US17265806
申请日：2020-05-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhanfeng Cao , Yingwei Liu , Ke Wang , Dongni Liu , Minghua Xuan , Guangcai Yuan , Lei Chen , Xue Dong
Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.
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公开(公告)号：US11424232B2
公开(公告)日：2022-08-23
申请号：US16920771
申请日：2020-07-06
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei Liu , Ke Wang , Zhiwei Liang , Muxin Di , Zhanfeng Cao , Shuang Liang , Guangcai Yuan , Qi Yao , Dongni Liu
IPC: H01L23/538 , H01L25/18 , H01L23/00 , H01L25/00 , H01L25/16
Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.
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