公开(公告)号：US20220186359A1

公开(公告)日：2022-06-16

申请号：US17485170

申请日：2021-09-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Nianqi YAO ,  Ce NING ,  Zhengliang LI ,  Hehe HU ,  Dapeng XUE ,  Lizhong WANG ,  Shuilang DONG ,  Jie HUANG ,  Jiayu HE ,  Lubin SHI ,  Yancai LI

IPC: C23C14/50

Abstract: A fixture, a tray and a sputtering system. The fixture is internally provided with a support structure and a clamping structure connected with each other, wherein the clamping structure is configured to clamp a to-be-sputtered substrate; an orthographic projection of the clamping structure on a plane where the support structure is located and the support structure share an superimposed area and are separate in non-superimposed areas; wherein the support structure located in the non-superimposed area and/or the clamping structure located in the non-superimposed area has a first hollowed structure. The fixture is internally provided with the first hollowed structure, such that a part of an area of the to-be-sputtered substrate covered by the fixture may be exposed via the first hollowed structure when the fixture holds the to-be-sputtered substrate, so as to reduce the area of the to-be-sputtered substrate covered by the fixture.

公开(公告)号：US20240379631A1

公开(公告)日：2024-11-14

申请号：US18691021

申请日：2021-10-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Nianqi YAO ,  Jin YANG ,  Ce NING ,  Jiayu HE ,  Jie HUANG ,  Hehe HU ,  Kun ZHAO ,  Feifei LI ,  Zhengliang LI ,  Guangcai YUAN

IPC: H01L27/12 ,  H01L25/16 ,  H01L33/62

Abstract: A light-emitting substrate and a display device are disclosed, the light-emitting substrate includes: a base substrate including a light-emitting region; a plurality of first pads on a side of the base substrate and in the light-emitting region, where a material of the first pads includes Cu; and an oxidation protection layer on a side of the first pads away from the base substrate, where the plurality of first pads is used for bonding connection with a plurality of light-emitting units through the oxidation protection layer, a material of the oxidation protection layer includes CuNiX, and X includes one or any combination of Al, Sn, Pb, Au, Ag, In, Zn, Bi, Mg, Ga, V, W, Y, Zr, Mo, Nb, Pt, Co or Sb.

公开(公告)号：US20240297243A1

公开(公告)日：2024-09-05

申请号：US18026833

申请日：2022-05-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jiayu HE ,  Yan QU ,  Ce NING ,  Hehe HU ,  Zhengliang LI ,  Nianqi YAO ,  Jie HUANG ,  Kun ZHAO ,  Feifei LI ,  Liping LEI

IPC: H01L29/739 ,  H01L27/092 ,  H01L29/08 ,  H01L29/165 ,  H01L29/66 ,  H01L29/73

CPC classification number: H01L29/7391 ,  H01L27/092 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/66356 ,  H01L29/7311

Abstract: A tunneling field effect transistor includes a gate electrode, a tunneling field active layer, a first electrode, and a second electrode disposed on a base substrate; the tunneling field active layer includes a first-type active layer and a second-type active layer that are stacked, wherein the first-type active layer includes a first-type channel region and a first source-drain region, the second-type active layer includes a second-type channel region and a second source-drain region, an orthographic projection of the first-type channel region on the base substrate is completely overlapped with an orthographic projection of the second-type channel region on the base substrate, the first source-drain region is located at a side of the tunneling field active layer and is connected with the first electrode.

公开(公告)号：US20240234658A1

公开(公告)日：2024-07-11

申请号：US17927792

申请日：2021-12-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jiayu HE ,  Yan QU ,  Ce NING ,  Zhengliang LI ,  Hehe HU ,  Jie HUANG ,  Nianqi YAO ,  Kun ZHAO ,  Feifei LI ,  Qi QI

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/124

Abstract: A wiring board includes a substrate, conductive pads and at least one protective layer group. The conductive pads are disposed on the substrate. The at least one protective layer group is disposed on a side of the conductive pads away from the substrate; a protective layer group includes an oxidation protective layer and a palladium alloy layer that are stacked, and the oxidation protective layer is closer to the substrate than the palladium alloy layer. A material of the oxidation protective layer includes a nickel-based alloy.

公开(公告)号：US20240204004A1

公开(公告)日：2024-06-20

申请号：US17910133

申请日：2021-12-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hehe HU ,  Yan QU ,  Jiayu HE ,  Kun ZHAO ,  Jie HUANG ,  Zhengliang LI ,  Ce NING ,  Dongfang WANG ,  Fengjuan LIU ,  Nianqi YAO ,  Feifei LI ,  Shunhang ZHANG ,  Yunsik IM ,  Liping LEI

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1259 ,  H01L27/1222

Abstract: Provided are a thin-film transistor and a manufacturing method thereof, and a display substrate, belonging to the technical field of thin-film transistors. The thin-film transistor includes: a base substrate; a gate electrode on the base substrate; an active layer on a side of the gate electrode away from the base substrate, an orthographic projection of the active layer onto the base substrate overlapping with an orthographic projection of the gate electrode onto the base substrate; and a first electrode and a second electrode on a side of the active layer away from the base substrate, the first electrode being one of a source electrode and a drain electrode, and the second electrode being the other of the source electrode and the drain electrode. Specifically the active layer includes a channel region corresponding to a gap between the first electrode and the second electrode, and a width direction of the channel region is perpendicular or substantially perpendicular to an extending direction of the gate electrode. According to the embodiments of the present disclosure, the illumination stability of the thin-film transistor can be improved without reducing the transmittance of the substrate.

公开(公告)号：US20240204002A1

公开(公告)日：2024-06-20

申请号：US17910525

申请日：2021-10-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhen ZHANG ,  Fuqiang LI ,  Zhenyu ZHANG ,  Lizhong WANG ,  Yunping DI ,  Ce NING ,  Zheng FANG ,  Chenyang ZHANG ,  Yawei WANG ,  Wei WANG ,  Hongrun WANG ,  Binbin TONG ,  Nianqi YAO ,  Jiahui HAN ,  Chengfu XU ,  Pengxia LIANG

IPC: H01L27/12 ,  G02F1/1362 ,  G02F1/1368

CPC classification number: H01L27/1225 ,  G02F1/136222 ,  G02F1/136227 ,  G02F1/136295 ,  G02F1/1368 ,  H01L27/124 ,  H01L27/127

Abstract: Embodiments of the present disclosure provide an array substrate and method for manufacturing same, a display panel, and a display device, and relate to the field of display technologies. The array substrate includes a color filter layer, such that a distance between a light source on a side, distal from the color filter layer, of the base substrate and the color filter layer is less. Thus, light from regions of the color resist blocks is avoided being emitted from adjacent color resist blocks, and a cross color of the display panel is further avoided, such that the display effect of the display panel is great. In addition, the color resist block is at least partially overlapped with a second portion of a metal oxide pattern in an oxide thin film transistor, such that an overall footprint of the oxide thin film transistor and the color filter layer can be reduced, so as to acquire the display panel of high PPI.

公开(公告)号：US20240188373A1

公开(公告)日：2024-06-06

申请号：US17795243

申请日：2021-09-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jiayu HE ,  Ce NING ,  Zhengliang LI ,  Hehe HU ,  Jie HUANG ,  Nianqi YAO ,  Kun ZHAO ,  Feifei LI ,  Liping LEI ,  Qi QI

IPC: H10K59/65 ,  H10K59/12 ,  H10K59/121 ,  H10K59/80 ,  H10K71/00

CPC classification number: H10K59/65 ,  H10K59/1201 ,  H10K59/1213 ,  H10K59/874 ,  H10K71/00

Abstract: Provided is a display substrate including a substrate and a plurality of light emitting units and a plurality of light detection units located on the substrate, At least one light emitting unit includes a light emitting element and a pixel circuit connected to the light emitting element, and at least one light detection unit includes an optical sensing element and a light emitting detecting circuit connected to the optical sensing element. At least one inorganic hydrogen barrier layer is arranged on one side of the optical sensing element close to the substrate. The light emitting element has a first light emitting region and a second light emitting region, the first light emitting region of the light emitting element emits light from a side away from the substrate, and the second light emitting region of the light emitting element emits light from a side close to the substrate.

公开(公告)号：US20230110228A1

公开(公告)日：2023-04-13

申请号：US17905246

申请日：2020-03-19

Applicant: Fuzhou BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Dapeng XUE ,  Zheng LIU ,  Hehe HU ,  Lizhong WANG ,  Shuilang DONG ,  Nianqi YAO

IPC: H01L29/66 ,  H01L29/786 ,  H01L29/45 ,  H01L29/40

Abstract: Disclosed are a thin-film transistor and a preparation method therefor, and a display substrate and a display panel. The thin-film transistor includes: a base substrate; an active layer located on the base substrate; and a source-drain electrode which is located on the side of the active layer facing away from the base substrate, and includes an electrode layer and a protective layer, where the material of the electrode layer includes a first metal element; the protective layer covers the surface of the side of the electrode layer facing away from the base substrate, and a side face of the electrode layer; and the material of the protective layer is an oxide of the first metal element.

公开(公告)号：US20220208070A1

公开(公告)日：2022-06-30

申请号：US17535127

申请日：2021-11-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuilang DONG ,  Shanshan XU ,  Guangcai YUAN ,  Zhanfeng CAO ,  Ce NING ,  Lizhong WANG ,  Dapeng XUE ,  Nianqi YAO

IPC: G09G3/20

Abstract: A shift register unit includes an input sub-circuit, a pull-down node driving sub-circuit and an output sub-circuit. The pull-down node driving sub-circuit includes a first connection unit, a first voltage-reduction unit and a second connection unit, and configured to: under the control of the first voltage signal terminal and the pull-up node, transmit a first voltage signal from the first voltage signal terminal to the first pull-down node via the first connection unit, and reduce a voltage applied to the second connection unit via the first voltage-reduction unit; and transmit a second voltage signal from the second voltage signal terminal to the first pull-down node via the second connection unit under the control of the pull-up node.

公开(公告)号：US20220100982A1

公开(公告)日：2022-03-31

申请号：US17431636

申请日：2021-02-09

Applicant: BOE Technology Group Co., Ltd.

Inventor： Nianqi YAO ,  Lubin SHI

IPC: G06K9/00 ,  H01L27/144 ,  G06F21/32

Abstract: A fingerprint identification module, a method for manufacturing the fingerprint identification module, a display substrate and a display device are provided. The fingerprint identification module includes a TFT, a photosensitive sensor, and a connection electrode configured to connect the TFT to the photosensitive sensor; the TFT includes an active layer; the active layer and the connection electrode are formed through a same semiconductor layer pattern, the semiconductor layer pattern includes a first semiconductor pattern and a second semiconductor pattern, the first semiconductor pattern is used as the active layer, and the second semiconductor pattern is subjected to conductor-formation treatment and used as the connection electrode.