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31.发明授权Chemical mechanical polishing a substrate having a filler layer and a stop layer 有权化学机械抛光具有填料层和停止层的基材公开(公告)号：US06863593B1
公开(公告)日：2005-03-08
申请号：US09184805
申请日：1998-11-02
IPC分类号： B24B37/04 , H01L21/3105 , H01L21/321 , H01L21/768 , B24C1/08
CPC分类号： H01L21/76819 , B24B37/04 , B24B37/042 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
摘要翻译： 将基材用高选择性浆料进行化学机械抛光，直至止挡层至少部分暴露，然后用低选择性浆料抛光基材直到停止层完全暴露。
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32.发明授权公开(公告)号：US06824455B2
公开(公告)日：2004-11-30
申请号：US10665925
申请日：2003-09-19
申请人： Thomas H. Osterheld , Sen-Hou Ko
发明人： Thomas H. Osterheld , Sen-Hou Ko
IPC分类号： B24B2900
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
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33.发明授权
公开(公告)号：US5984769A
公开(公告)日：1999-11-16
申请号：US3315
申请日：1998-01-06
IPC分类号： B24B37/26 , B24D13/14 , H01L21/304 , B24D11/00
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
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34.发明申请公开(公告)号：US20200005139A1
公开(公告)日：2020-01-02
申请号：US16449104
申请日：2019-06-21
IPC分类号： G06N3/08 , G05B19/4155
摘要： A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.
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公开(公告)号：US20130111678A1
公开(公告)日：2013-05-09
申请号：US13291945
申请日：2011-11-08
CPC分类号： H01L21/67046
摘要： Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.
摘要翻译： 本发明的实施例一般涉及一种用于清洁衬底的方法和装置。 特别地，本发明的实施例涉及一种使用擦洗刷清洁衬底的装置和方法。 一个实施例提供了一种用于清洁基底的刷盒组件。 该组件包括一个室主体，其具有设置在其中的清洁室，设置在清洁室中的可旋转卡盘以及邻近卡盘定位的边缘清洁器模块。
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公开(公告)号：US08295967B2
公开(公告)日：2012-10-23
申请号：US12267434
申请日：2008-11-07
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/12
摘要： A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected thickness that each substrate will have at a target time is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates have closer to the same thickness at the target time than without the adjustment.
摘要翻译： 计算机实现的方法包括在抛光装置中同时抛光衬底。 每个基底具有通过独立可变抛光参数独立控制的抛光速率。 随着每个基板的厚度变化的测量数据在用原位监测系统进行抛光时从每个基板获得。 基于测量数据确定每个基板在目标时间具有的投影厚度。 调整至少一个基板的抛光参数以调节至少一个基板的抛光速率，使得基板在目标时间比不进行调节更接近相同的厚度。
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公开(公告)号：US20100099334A1
公开(公告)日：2010-04-22
申请号：US12577663
申请日：2009-10-12
CPC分类号： B24B37/013 , B24B49/105 , G01B7/105
摘要： In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.
摘要翻译： 在处理衬底期间的原位监测包括在半导体处理设备中的衬底上处理导电膜并且在处理期间产生来自涡流传感器的信号。 信号包括当涡电流传感器邻近衬底时产生的第一部分，当涡流传感器邻近金属体并且不与衬底相邻时产生的第二部分，以及当涡流传感器不相邻时产生的第三部分 金属体也不是基体。 将信号的第二部分与信号的第三部分进行比较，并且至少基于比较的结果确定增益，并且将信号的第一部分乘以增益以产生经调整的信号。
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公开(公告)号：US20080305729A1
公开(公告)日：2008-12-11
申请号：US12130670
申请日：2008-05-30
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
摘要翻译： 描述了具有抛光层的抛光垫，抛光层具有抛光表面，在抛光层的与抛光层相对的一侧上的粘合剂层以及延伸穿过模制到抛光层的固体透光窗。 窗口具有与抛光表面共面的顶表面和与粘合剂层的下表面共面的底表面。 制造抛光垫的方法包括通过抛光层和粘合剂层形成孔，将背衬片固定在与抛光层的抛光表面相对的一侧上的粘合剂层上，将液体聚合物分配到孔中，并固化 液体聚合物形成窗口。
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公开(公告)号：US20080254722A1
公开(公告)日：2008-10-16
申请号：US11734063
申请日：2007-04-11
申请人： Kun Xu , Jimin Zhang , James C. Wang , Thomas H. Osterheld , Yutao Ma , Steve M. Zuniga , Jin Xi
发明人： Kun Xu , Jimin Zhang , James C. Wang , Thomas H. Osterheld , Yutao Ma , Steve M. Zuniga , Jin Xi
IPC分类号： B24B21/18
CPC分类号： B24B53/017 , B24B29/005 , B24B53/12
摘要： A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.
摘要翻译： 提供了用于在化学机械平面化（CMP）中调理抛光垫的衬垫调节器。 衬垫调节剂包括具有第一硬度的塑料磨料部分和任选地具有小于第一硬度的第二硬度的刷部分。 塑料研磨部分包括基板和形成在基板的表面上的多个塑料结节，每个塑料结节具有平坦的顶表面，其中平面顶表面被定位成基本接触抛光垫。 刷部分可以定位成与塑料研磨部分相邻，刷部分具有多个刷子元件，其定位成基本上接触焊盘。
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公开(公告)号：US07063597B2
公开(公告)日：2006-06-20
申请号：US10693683
申请日：2003-10-24
申请人： Gopalakrishna B. Prabhu , Thomas H. Osterheld , Garlen C. Leung , Adam H. Zhong , Peter McReynolds , Yi-Yung Tao , Gregory E. Menk , Vasanth N. Mohan , Christopher Heung-Gyun Lee
发明人： Gopalakrishna B. Prabhu , Thomas H. Osterheld , Garlen C. Leung , Adam H. Zhong , Peter McReynolds , Yi-Yung Tao , Gregory E. Menk , Vasanth N. Mohan , Christopher Heung-Gyun Lee
IPC分类号： B24B1/00
CPC分类号： H01L21/76229 , H01L21/31053
摘要： Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.
摘要翻译： 提供的方法和组合物用于在电介质材料的抛光工艺期间使衬底表面平坦化，减少或最小的形貌缺陷形成。 在一个方面，提供一种用于使用固定磨料抛光制品作为抛光制品的至少一个加工步骤来研磨含有两个或更多个介电层的衬底的方法，例如氧化硅，氮化硅，氮氧化硅。 处理步骤可以用于去除一个或多个介电层的全部，基本上全部或一部分，其可以包括以两个或更多个步骤去除介电层的形貌，体电介质或残余电介质材料。
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