公开(公告)号：USD597249S1

公开(公告)日：2009-07-28

申请号：US29325595

申请日：2008-10-03

申请人： Hsiao-Wen Lee

设计人： Hsiao-Wen Lee

公开(公告)号：US07521724B2

公开(公告)日：2009-04-21

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L29/06 ,  H01L31/00 ,  H01L29/26 ,  H01L33/00 ,  H01L31/12 ,  H01L21/00 ,  H01L21/76

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

摘要翻译： 发光二极管（LED）封装及其制造方法包括由两个硅基材料和介于其间的绝缘层组成的绝缘体上硅（SOI）衬底。 蚀刻绝缘体上硅衬底的两种硅基材料，以分别形成反射腔和绝缘沟槽，以将绝缘体上硅衬底分成阳极和负电极的接触表面。 然后形成多个金属线以电连接两个硅基材料，使得LED芯片可以安装在反射腔上并且通过金属线电连接到绝缘体上硅衬底的相应电极。 因此，可以提高耐热性和热分散性，并且可以简化工艺。

公开(公告)号：US20080169480A1

公开(公告)日：2008-07-17

申请号：US11652060

申请日：2007-01-11

申请人： Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space, a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substrate within the closed space. The invention also provides a method of packaging the optoelectronic device.

摘要翻译： 光电器件封装。 所述光电器件封装包括衬底，形成在所述衬底的第一平面上的反射器，结合到所述反射器以形成闭合空间的盖，形成在所述盖的第一平面上的多个微透镜，形成在所述衬底上的荧光膜 封闭空间内的盖的第二平面，形成在基板的第二平面上的导热膜，形成在未被导热膜覆盖的侧壁和基板的第二平面上的电极和形成的光电子器件 在封闭空间内的衬底的第一平面上。 本发明还提供一种封装光电器件的方法。

公开(公告)号：US20070263969A1

公开(公告)日：2007-11-15

申请号：US11796729

申请日：2007-04-27

申请人： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Shih-Yu Tu ,  Hsiao-Wen Lee ,  Sheng-Pan Huang ,  Sun-Bin Yin

发明人： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Shih-Yu Tu ,  Hsiao-Wen Lee ,  Sheng-Pan Huang ,  Sun-Bin Yin

IPC分类号： G02B6/02

CPC分类号： H01S3/06708 ,  G02B6/02 ,  H01S3/06716 ,  H01S3/06795

摘要： The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.

摘要翻译： 本发明涉及具有掺杂有铬的晶体纤维芯和玻璃包层的纤维。 该光纤在光通信中具有大于300nm的增益带宽，包括1.3mm至1.6mm，并且在用于光纤通信时可用作光源，光放大器和可调谐激光器。 本发明还涉及制造纤维的方法。 首先，通过激光加热基座生长（LHPG）生长掺杂铬的晶体光纤。 然后，通过编织激光加热底座生长（CDLHPG），晶体纤维用玻璃包层包覆。 由于是高温制造工艺，所以通过这种方法制造的包层比通过蒸发技术更密实，并且能承受相对较高的泵浦光损伤阈值功率。

公开(公告)号：US20060110126A1

公开(公告)日：2006-05-25

申请号：US11106029

申请日：2005-04-14

申请人： Sheng-Lung Huang ,  Hsiao-Wen Lee ,  Chia-Chang Kuo ,  Sheng-Bang Huang ,  Tsai-Shuan Chou ,  Li-Min Lee

发明人： Sheng-Lung Huang ,  Hsiao-Wen Lee ,  Chia-Chang Kuo ,  Sheng-Bang Huang ,  Tsai-Shuan Chou ,  Li-Min Lee

IPC分类号： G02B6/00

CPC分类号： C30B13/00 ,  C30B29/30 ,  C30B29/32

摘要： The present invention relates to an apparatus for making a source material into a crystal fiber having different regions of polarization inversion. The apparatus of the present invention is similar to a laser-heated pedestal growth (LHPG) apparatus, characterized in that a first electric field generating device and a second electric field generating device are included. The first electric field generating device is used for providing a first external electric field which is used for poling the crystal fiber and inducing micro-swing of the crystal fiber. The second electric field generating device is disposed on a predetermined position above the first electric field generating device for providing a second external electric field to control and maintain the amplitude of the micro-swing. Whereby, the growth condition of the crystal fiber can be controlled precisely, and a uniformly and regularly periodic polarization inversion structure is fabricated.

摘要翻译： 本发明涉及一种用于将源材料制成具有不同极化反转区域的晶体光纤的装置。 本发明的装置类似于激光加热基座生长装置（LHPG），其特征在于包括第一电场产生装置和第二电场产生装置。 第一电场产生装置用于提供用于极化晶体光纤并引起晶体光纤的微摆动的第一外部电场。 第二电场产生装置设置在第一电场产生装置上方的预定位置处，用于提供第二外部电场以控制和保持微摆幅的幅度。 由此，可以精确地控制晶体光纤的生长条件，并且制造均匀且规则的周期性极化反转结构。

公开(公告)号：US20050082474A1

公开(公告)日：2005-04-21

申请号：US10795407

申请日：2004-03-09

申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

IPC分类号： G01Q60/18 ,  G01Q60/24 ,  G01Q60/46 ,  G01Q60/50 ,  G01Q70/16 ,  G12B21/20

CPC分类号： G01Q10/045 ,  G01Q70/10 ,  Y10S977/872

摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.

摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。

公开(公告)号：US08591251B2

公开(公告)日：2013-11-26

申请号：US13557315

申请日：2012-07-25

申请人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

发明人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC分类号： H01R13/00

CPC分类号： B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

摘要翻译： 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US08529098B2

公开(公告)日：2013-09-10

申请号：US12940151

申请日：2010-11-05

申请人： Hsiao-Wen Lee ,  Hsueh-Hung Fu ,  Jin-Hua Wang ,  Chien-Liang Yeh

发明人： Hsiao-Wen Lee ,  Hsueh-Hung Fu ,  Jin-Hua Wang ,  Chien-Liang Yeh

IPC分类号： F21V29/00

CPC分类号： F21V29/006 ,  F21V19/0055 ,  F21V23/02 ,  F21V29/507 ,  F21V29/51 ,  F21V29/70 ,  F21Y2115/10

摘要： The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.

摘要翻译： 本发明涉及发光二极管（LED）器件及其制造方法。 LED装置包括适于将散热器与蒸气室组合以形成插入其间的封闭空间的壳体。 LED装置包括附接到壳体的发光二极管模块，其邻近蒸气室。 蒸汽室适于将LED模块产生的热均匀地分散在封闭空间内，以在散热器上形成均匀的温度场，从而提供有效的散热。

公开(公告)号：US20130140591A1

公开(公告)日：2013-06-06

申请号：US13308715

申请日：2011-12-01

申请人： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Tien-Ming Lin ,  Min-Sheng Wu

发明人： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Tien-Ming Lin ,  Min-Sheng Wu

IPC分类号： H01L33/52 ,  H01L33/44

CPC分类号： H01L33/505 ,  H01L27/153 ,  H01L33/504 ,  H01L33/508 ,  H01L2933/0041

摘要： The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

摘要翻译： 本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。 荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。

公开(公告)号：US20130027946A1

公开(公告)日：2013-01-31

申请号：US13194538

申请日：2011-07-29

申请人： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

发明人： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC分类号： F21V5/04 ,  B23P11/00 ,  F21V29/00

CPC分类号： F21K9/50 ,  F21K9/60 ,  F21K9/90 ,  F21V3/02 ,  F21V3/0625 ,  F21V5/008 ,  F21V5/04 ,  F21V7/0091 ,  F21V29/77 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/58 ,  H01L2933/0091 ,  Y10T29/49826

摘要： The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.

摘要翻译： 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。