公开(公告)号：US20240047606A1

公开(公告)日：2024-02-08

申请号：US17817186

申请日：2022-08-03

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  Steven Wuester ,  Thomas Celano ,  David Suich ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/00 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L33/0093 ,  H01L33/62 ,  H01L2933/005

Abstract: Light-emitting devices and more particularly wafer level fabrication for multiple chip light-emitting devices is disclosed. Light-emitting devices include certain LED package structures, such as LED chips, submounts, and electrical connections that are formed by wafer level fabrication before individual light-emitting devices are separated. Methods include joining LED wafers with multiple LED chips formed thereon to submount wafers that include corresponding metallization patterns, followed by separating individual light-emitting devices. Each light-emitting device includes arrays of LED chips that are already bonded to a submount with electrical connections. The arrays of LED chips may be electrically coupled in a variety of electrical configurations based on arrangements of the metallization patterns.

公开(公告)号：US20230387356A1

公开(公告)日：2023-11-30

申请号：US17804648

申请日：2022-05-31

Applicant: CreeLED, Inc.

Inventor： Guy Pickett ,  David Suich ,  Colin Blakely

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/56

Abstract: Light-emitting diode (LED) packages and more particularly LED packages with lead frame structures for flip-chip mounting of LED chips are disclosed. Lead frame structures include multiple leads with arrangements for LED chips to be flip-chip mounted across neighboring pairs of leads. Arrangements of stress relief features and anchoring features relative to mounting locations are provided in lead frame structures to enhance mechanical integrity of flip-chip bonds during thermal cycling. LED packages may further include housings that are formed about the lead frame structures. Housings may include a recess with recess floor arrangements for positioning of LED chips.

公开(公告)号：USD996377S1

公开(公告)日：2023-08-22

申请号：US29827155

申请日：2022-02-17

Applicant: CreeLED, Inc.

Designer： Thomas Celano ,  Alexis Rile ,  Derek Miller ,  David Suich ,  Colin Blakely ,  Sarah Trinkle ,  Robert Wilcox

Abstract: FIG. 1 is a top perspective view of one embodiment of a light-emitting diode package;
FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;
FIG. 3 is a top view of the light-emitting diode package of FIG. 1;
FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;
FIG. 5 is an end view of the light-emitting diode package of FIG. 1;
FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;
FIG. 7 is a side view of the light-emitting diode package of FIG. 1;
FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1;
FIG. 9 is a top perspective view of another embodiment of a light-emitting diode package;
FIG. 10 is a bottom perspective view of the light-emitting diode package of FIG. 9;
FIG. 11 is a top view of the light-emitting diode package of FIG. 9;
FIG. 12 is a bottom view of the light-emitting diode package of FIG. 9;
FIG. 13 is an end view of the light-emitting diode package of FIG. 9;
FIG. 14 is an opposing end view of the light-emitting diode package of FIG. 9;
FIG. 15 is a side view of the light-emitting diode package of FIG. 9; and,
FIG. 16 is an opposing side view of the light-emitting diode package of FIG. 9.
The dashed broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.
The dot-dashed broken lines shown in the drawings depict portions of the light-emitting diode package that represent boundaries of the claimed design and are not part of the claimed design.

公开(公告)号：US20230260972A1

公开(公告)日：2023-08-17

申请号：US17674448

申请日：2022-02-17

Applicant: CreeLED, Inc.

Inventor： Thomas Celano ,  Alexis Rile ,  Derek Miller ,  David Suich ,  Colin Blakely ,  Sarah Trinkle ,  Robert Wilcox

IPC: H01L25/075 ,  H01L33/54

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/62

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.

公开(公告)号：US20230170447A1

公开(公告)日：2023-06-01

申请号：US17539628

申请日：2021-12-01

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Christopher P. Hussell ,  Michael Check ,  Colin Blakely ,  Steven Wuester ,  Brian T. Collins

IPC: H01L33/50 ,  H01L33/00

CPC classification number: H01L33/505 ,  H01L33/0093 ,  H01L33/22

Abstract: Aspects disclosed herein relate to light-emitting diode (LED) chips and manufacturing processes thereof. In certain aspects, an LED chip includes an epitaxial layer with a first side and a second side, a first type contact proximate a second side of the epitaxial layer, and a wavelength conversion element including at least one lumiphore. In certain embodiments, in a flip-chip construction, a distance between the at least one lumiphore and the epitaxial layer is less than 5 microns and/or the first side of the epitaxial layer includes texturing. In certain embodiments, in a vertical stack construction, a transparent bonding layer between the epitaxial layer and the wavelength conversion element includes inorganic material. In certain embodiments, a ceramic layer is bonded to the second side of the epitaxial layer and positioned horizontally adjacent to the first type contact. Such configurations facilitate construction, decrease size, and/or increase performance of the LED chips.

公开(公告)号：US20230170335A1

公开(公告)日：2023-06-01

申请号：US17539671

申请日：2021-12-01

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Christopher P. Hussell ,  Michael Check ,  Colin Blakely ,  Steven Wuester ,  Brian T. Collins

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/48 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L33/504 ,  H01L33/486 ,  H01L33/0093 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: Aspects disclosed herein relate to light-emitting diode (LED) chips and manufacturing processes thereof. In certain aspects, an LED chip includes an epitaxial layer with a first side and a second side, a first type contact proximate a second side of the epitaxial layer, and a wavelength conversion element including at least one lumiphore. In certain embodiments, in a flip-chip construction, a distance between the at least one lumiphore and the epitaxial layer is less than 5 microns and/or the first side of the epitaxial layer includes texturing. In certain embodiments, in a vertical stack construction, a transparent bonding layer between the epitaxial layer and the wavelength conversion element includes inorganic material. In certain embodiments, a ceramic layer is bonded to the second side of the epitaxial layer and positioned horizontally adjacent to the first type contact. Such configurations facilitate construction, decrease size, and/or increase performance of the LED chips.

公开(公告)号：US20230115342A1

公开(公告)日：2023-04-13

申请号：US17496320

申请日：2021-10-07

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Michael Check ,  Colin Blakely

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/54 ,  H01L25/075 ,  F21V23/00

Abstract: Light-emitting diode (LED) packages, and more particularly broad electromagnetic spectrum LED packages are disclosed. Individual LED packages are disclosed that are capable of emitting various combinations of peak wavelengths across a broad electromagnetic spectrum, including one or more combinations of ultraviolet, visible, and infrared peak wavelengths. Such LED packages may also be broadly tunable across portions of the electromagnetic spectrum ranging from ultraviolet to infrared wavelengths. By providing such capabilities within a single light source provided by a single LED package, larger and more complex systems for broadband emissions that include multiple light sources, complex optical systems, mirrors, filters, and additional components may be avoided. LED chip arrangements, control schemes, and encapsulant arrangements are also disclosed for such broad electromagnetic spectrum LED packages.