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1.发明公开公开(公告)号：US20240355979A1
公开(公告)日：2024-10-24
申请号：US18304836
申请日：2023-04-21
Applicant: CreeLED, Inc.
Inventor： Robert Wilcox , Michael Check , Andre Pertuit , David Suich , Joseph G. Sokol , Colin Blakely
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages with materials for reducing effects of environmental ingress are disclosed. Reactive materials are provided within LED packages that preferentially absorb environmental ingress away from other package elements, thereby extending operating lifetimes. Such reactive materials may be configured with redox potentials that are lower than the other package elements to more readily attract and react with environmental ingress that may enter LED packages under various operating environments. Arrangements of reactive materials are described relative to LED chips and corresponding electrical connections. Reactive materials may be formed as coatings, layers, pre-formed structures, and/or distributions of particles within LED packages.
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公开(公告)号：US20240290766A1
公开(公告)日：2024-08-29
申请号：US18584656
申请日：2024-02-22
Applicant: CreeLED, Inc.
Inventor： Michael Check , Colin Blakely , Jesse Reiherzer
CPC classification number: H01L25/167 , H01L23/291 , H01L23/3171 , H01L24/24 , H01L24/82 , H01L2224/24146 , H01L2924/12041 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1421
Abstract: A LED chip has integrated capacitor and inductor structures, wherein a capacitor structure is coupled to an active LED structure of the LED chip, the inductor structure is coupled to the capacitor structure, and the inductor structure is configured to harvest power from an externally supplied radio frequency (RF) signal. At least portions of the inductor and capacitor are arranged in or on ceramic passivation material. A LED chip may have a footprint of no greater than 2.5 mm×2.5 mm, and/or a top area of no greater than 6.25 mm2. A resistor element or memristor element may be coupled between the capacitor structure and the active region. Methods of fabricating such LED chips are also provided.
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公开(公告)号：US20240266462A1
公开(公告)日：2024-08-08
申请号：US18104966
申请日：2023-02-02
Applicant: CreeLED, Inc.
Inventor： Michael Check , David Suich , Colin Blakely , Joseph Sokol , Robert Wilcox , Andre Pertuit
IPC: H01L33/00
CPC classification number: H01L33/007 , H01L33/0093 , H01L2933/0058
Abstract: Solid-state lighting devices, and more particularly to laser etching light-emitting diode (LED) devices and related methods are disclosed. LED devices that use sapphire substrates are difficult to etch using conventional techniques, but laser etching and ablation of sapphire substrates overcomes these challenges. Laser etching a surface of the sapphire substrate can form light-extraction features that include structures formed in or on light-emitting surfaces of substrates. Light-extraction features may include repeating patterns of features with dimensions that, along with reduced substrate thicknesses, provide targeted emission profiles for flip-chip structures, such as Lambertian emission profiles. In some embodiments, laser ablation of the sapphire substrate can also be used to form trenches between active layer portions of an LED matrix to form pixels that reduce interference between the active layer portions. The trenches can further be filled with materials with light-altering properties to further refine the desired emission characteristics.
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公开(公告)号：US20240072212A1
公开(公告)日：2024-02-29
申请号：US17821881
申请日：2022-08-24
Applicant: CreeLED, Inc.
Inventor： Tucker McFarlane , Robert Wilcox , David Suich , Thomas Celano , Michael Check , Colin Blakely
CPC classification number: H01L33/483 , H01L33/54 , H01L33/58 , H01L33/32
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly sealing structures for LED packages are disclosed. Sealing structures include multiple seals within an LED package that provide a multiple barrier structure for enhanced protection from elemental ingress from a surrounding environment. Certain seals may be provided as bonding materials between cover structures and submounts of LED packages, thereby enclosing LED chips. Additional seals may be provided as coatings on surfaces of LED chips and/or submounts that are between cover structures and LED chips. Sealing structures may include multiple levels of hermetic seals with LED packages.
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公开(公告)号：US20240072099A1
公开(公告)日：2024-02-29
申请号：US17822339
申请日：2022-08-25
Applicant: CreeLED, Inc.
Inventor： Michael Check , Steven Wuester , Seth Joseph Balkey , Nikolas Hall
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: Light-emitting diodes (LEDs) and more particularly LED chip structures are disclosed. LED chip structures include arrangements of one or more contacts, interconnects, contact structures, and/or reflective layers that effectively route electrically conductive paths while also reducing instances of closely spaced electrically charged metals of opposing polarities. Certain LED chip structures include electrically isolated metal-containing layers in various chip locations that allow for the presence of n-contact interconnects that are vertically arranged under or proximate to a p-contact. Certain contact structures include various arrangements, including segmented contact structures, that extend laterally to electrically couple groups of n-contact interconnects across various LED chip portions.
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Patent Agency Ranking
公开(公告)号：US11876155B2
公开(公告)日：2024-01-16
申请号：US17496320
申请日：2021-10-07
Applicant: CreeLED, Inc.
Inventor： David Suich , Michael Check , Colin Blakely
IPC: H01L33/50 , H01L33/58 , H01L33/54 , F21V23/00 , H01L25/075 , F21Y113/13 , F21Y105/16 , F21Y115/10
CPC classification number: H01L33/504 , F21V23/005 , H01L25/0753 , H01L33/54 , H01L33/58 , F21Y2105/16 , F21Y2113/13 , F21Y2115/10
Abstract: Light-emitting diode (LED) packages, and more particularly broad electromagnetic spectrum LED packages are disclosed. Individual LED packages are disclosed that are capable of emitting various combinations of peak wavelengths across a broad electromagnetic spectrum, including one or more combinations of ultraviolet, visible, and infrared peak wavelengths. Such LED packages may also be broadly tunable across portions of the electromagnetic spectrum ranging from ultraviolet to infrared wavelengths. By providing such capabilities within a single light source provided by a single LED package, larger and more complex systems for broadband emissions that include multiple light sources, complex optical systems, mirrors, filters, and additional components may be avoided. LED chip arrangements, control schemes, and encapsulant arrangements are also disclosed for such broad electromagnetic spectrum LED packages.
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7.发明公开公开(公告)号：US20230361249A1
公开(公告)日：2023-11-09
申请号：US18308323
申请日：2023-04-27
Applicant: CreeLED, Inc.
Inventor： Michael Check , Michael John Bergmann , David Suich , Kevin Haberern
CPC classification number: H01L33/385 , H01L33/20
Abstract: Light-emitting diode (LED) chips and, more particularly, structures of LED chips with electrically insulating substrates and related methods are disclosed. LED chips include at least one opening that extends through a substrate to provide an electrical pathway to an active LED structure. Another electrical connection may be provided on the active LED structure in a position that forms a vertical contact arrangement. The at least one opening may extend through the substrate and into a portion of the active LED structure to provide increased surface area for the electrical connection. Additional LED chip structures include another opening on the active LED structure that is registered with the opening in the substrate, and electrical connections to a same layer of the active LED structure may be provided within each opening. Related methods include laser drilling the at least one opening in the substrate.
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公开(公告)号：US12078300B1
公开(公告)日：2024-09-03
申请号：US18198339
申请日：2023-05-17
Applicant: CreeLED, Inc.
Inventor： Robert Wilcox , Michael Check , Colin Blakely , David Suich , Joseph G. Sokol , Andre Pertuit
IPC: F21V19/00 , F21K9/237 , F21K9/90 , F21V29/71 , F21Y113/17 , F21Y115/10
CPC classification number: F21K9/237 , F21K9/90 , F21V19/005 , F21V29/713 , F21Y2113/17 , F21Y2115/10
Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.
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公开(公告)号：US20240266383A1
公开(公告)日：2024-08-08
申请号：US18165720
申请日：2023-02-07
Applicant: CreeLED, Inc.
Inventor： Colin Blakely , Michael Check , David Suich , Andre Pertuit , Robert Wilcox
CPC classification number: H01L27/156 , H01L33/0016 , H01L33/24 , H01L33/382 , H01L33/58 , H01L33/0093 , H01L2933/0016
Abstract: Lighting-emitting devices and more particularly light-emitting diode (LED) chips with multiple wavelength emissions and related methods are disclosed. LED chips include separately formed active LED structures that are bonded together to form a single LED chip capable of emitting multiple wavelengths. Each active LED structure may be separately patterned into a number of individual light-emitting junctions such that after bonding, a single LED chip includes multiple light-emitting junctions from multiple active LED structures. Patterns of individual light-emitting junctions may be selected so that when bonded together, emissions from different active LED structures may pass through LED chips with reduced interactions with one another. Certain aspects include vertical and horizontal offset positions for light-emitting junctions formed from different active LED structures.
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10.发明公开公开(公告)号：US20240213401A1
公开(公告)日：2024-06-27
申请号：US18085672
申请日：2022-12-21
Applicant: CreeLED, Inc.
Inventor： David Suich , Michael Check , Colin Blakely , Robert Wilcox , Andre Pertuit
IPC: H01L33/00 , H01L21/304 , H01L21/324
CPC classification number: H01L33/0095 , H01L21/304 , H01L21/3247 , H01L2933/0058
Abstract: The present disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs) and more particularly to light-extraction features for LED chips and packages and methods of forming the light-extraction features on a cover structure over the LED chip to improve light extraction from the LED chip. A number of sublayers that are embedded with lumiphoric materials can be pressed in a mold that includes texturing that imprints the light-extraction features in the sublayers. The sublayers can then be baked to form a cover structure that can be placed over the LED chip. In other embodiments, the sublayers can be baked to form the cover structure, which can then be heated to above a transition temperature of the cover structure, then pressed in a textured mold to form the light-extraction features, and then placed over the LED chip.
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