公开(公告)号：US08067307B2

公开(公告)日：2011-11-29

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L21/44 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 以及将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US20120319266A1

公开(公告)日：2012-12-20

申请号：US13597086

申请日：2012-08-28

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L23/36 ,  H01L21/60 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US08559185B2

公开(公告)日：2013-10-15

申请号：US13477630

申请日：2012-05-22

申请人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

发明人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC分类号： H01L23/02 ,  H01L21/00 ,  H05K1/16

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

摘要翻译： 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。

公开(公告)号：US08273607B2

公开(公告)日：2012-09-25

申请号：US12818462

申请日：2010-06-18

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US20110312133A1

公开(公告)日：2011-12-22

申请号：US12818462

申请日：2010-06-18

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US08189344B2

公开(公告)日：2012-05-29

申请号：US12136037

申请日：2008-06-09

申请人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

发明人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC分类号： H01L23/02 ,  H01L21/00 ,  H05K1/16

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

摘要翻译： 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。

公开(公告)号：US20090303690A1

公开(公告)日：2009-12-10

申请号：US12136037

申请日：2008-06-09

申请人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

发明人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC分类号： H05K7/06

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

摘要翻译： 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。

公开(公告)号：US20090212408A1

公开(公告)日：2009-08-27

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/49

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 并且将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US20110133325A1

公开(公告)日：2011-06-09

申请号：US12633789

申请日：2009-12-08

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/485

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

公开(公告)号：US20110089554A1

公开(公告)日：2011-04-21

申请号：US12582582

申请日：2009-10-20

申请人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

发明人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上安装具有金属间化合物特性的端子的无基板集成电路封装; 连接基板和无基板集成电路封装; 以及在所述无衬底的集成电路封装上形成基底封装，所述端子暴露。