APPARATUS AND METHOD FOR PROVIDING HIGH THROUGHPUT MEMORY RESPONSES

    公开(公告)号:US20240377954A1

    公开(公告)日:2024-11-14

    申请号:US18315696

    申请日:2023-05-11

    Abstract: An apparatus and method for providing high throughput memory responses are provided. The apparatus includes a memory device including a plurality of memory arrays, a memory controller configured to control the memory device, the memory controller having a read queue, a write queue, and an address match circuit, and a data output circuit. The memory controller receives a read request, searches the write queue for a write address that matches a read address of the read request, and sends data associated with the write address from the write queue to the data output circuit without accessing the memory device when the write address matches the read address, the write address that matches the read address being a target address. The data output circuit outputs the data associated with the target address to an external device.

    BIAS VOLTAGE GENERATION CIRCUIT FOR MEMORY DEVICES

    公开(公告)号:US20230253017A1

    公开(公告)日:2023-08-10

    申请号:US17668962

    申请日:2022-02-10

    CPC classification number: G11C5/147 G11C5/148

    Abstract: The present disclosure relates to memory devices and, more particularly, to bias voltage generation circuit for memory devices and methods of operation. The voltage generation circuit includes: an internal voltage generator which providing a bias voltage to at least one internal node of a bias voltage generation circuitry; and at least one pre-charging circuitry providing a predefined bias voltage to at least one internal node including a distributed network of local drivers.

    Circuit structure and method for resistive RAM with self aligned contacts in zero-via layer

    公开(公告)号:US11075247B2

    公开(公告)日:2021-07-27

    申请号:US16691694

    申请日:2019-11-22

    Abstract: The disclosure provides a circuit structure and method to provide self-aligned contacts in a zero-via conductor layer. The structure may include a device layer including a first contact to a first source/drain region, and a second contact to a second source/drain region, the first and second source/drain regions being separated by a transistor gate. A zero-via layer of the circuit structure may include: a first via conductor positioned on the first contact and self-aligned with an overlying metal level in a first direction; and a second via conductor positioned on the second contact and self-aligned with the overlying metal level in a second direction, the second direction being orthogonal to the first direction.

    CIRCUIT STRUCTURE AND MEMORY CIRCUIT WITH RESISTIVE MEMORY ELEMENTS, AND RELATED METHODS

    公开(公告)号:US20210142850A1

    公开(公告)日:2021-05-13

    申请号:US16677790

    申请日:2019-11-08

    Abstract: The disclosure provides a circuit structure for storage and retrieval of data, and related methods. The circuit structure may include drive transistor having a source terminal, a drain terminal, and a gate terminal coupled to a word line. A first resistive memory element coupled between the source terminal of the drive transistor and a first bit line may be in a first memory state. A second resistive memory element coupled between the drain terminal of the drive transistor and a second bit line may be in a second memory state opposite the first memory state. The structure may also include a read transistor having a source terminal coupled to the drain terminal of the drive transistor, a drain terminal coupled to ground, and a gate terminal coupled to a select line.

    Twisted wordline structures
    37.
    发明授权

    公开(公告)号:US11004491B2

    公开(公告)日:2021-05-11

    申请号:US16582474

    申请日:2019-09-25

    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to twisted wordline structures and methods of manufacture. The memory array structure includes: a plurality of bitcells comprising memory elements and access transistors; a plurality of bitlines and wordlines which interconnect the bitcells; a plurality of dummy bitcells which intersect with the bitlines and wordlines; and a plurality of twisted wordline strap cells which twist wordlines in the dummy bitcells and connect a higher metal layer in the bitcells to a gate structure of the access transistor.

    Asymmetric gate cut isolation for SRAM

    公开(公告)号:US10950610B2

    公开(公告)日:2021-03-16

    申请号:US16515913

    申请日:2019-07-18

    Abstract: Methods of forming a gate cut isolation for an SRAM include forming a first and second active nanostructures adjacent to each other and separated by a space; forming a sacrificial liner over at least a side of the first active nanostructure facing the space, causing a first distance between a remaining portion of the space and the first active nanostructure to be greater than a second distance between the remaining portion of the space and the second active nanostructure. A gate cut isolation is formed in the remaining portion of the space such that it is closer to the second active nanostructure than the first active nanostructure. The sacrificial liner is removed, and gates formed over the active nanostructures with the gates separated from each other by the gate cut isolation. An SRAM including the gate cut isolation and an IC structure including the SRAM are also included.

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