DRAM cell arrangement and method for its production
    31.
    发明授权
    DRAM cell arrangement and method for its production 有权
    DRAM单元布置及其生产方法

    公开(公告)号:US6044009A

    公开(公告)日:2000-03-28

    申请号:US274733

    申请日:1999-03-23

    摘要: A storage cell has a number of projections of a semiconductor substrate arranged in rows and columns, neighboring rows of the projections being translation-symmetrical in relation to a y-axis which extends parallel to the columns. Each of the projections has at least one first source/drain region of a selection transistor and one channel region arranged below the first source/drain region, which is surrounded by a gate electrode annularly. A storage capacitor is connected between the first source/drain region and a bit line. The bit line as well as the storage capacitor are arranged essentially above the semiconductor substrate. Second source/drain regions of selection transistors are buried in the semiconductor substrate and connected with each other. Word lines can be formed self-justified in the form of adjacent gate electrodes. The projections can be created by etching with only one mask. The storage cell can be produced with an area of 4F.sup.2, F being the minimal structural size that can be produced in the respective technology.

    摘要翻译: 存储单元具有排列成行和列的半导体衬底的多个突起,相邻的一列突起相对于平行于列延伸的y轴平移对称。 每个突起具有选择晶体管的至少一个第一源极/漏极区域和布置在第一源极/漏极区域下方的一个沟道区域,其被环形的栅极电极包围。 存储电容器连接在第一源极/漏极区域和位线之间。 位线以及存储电容器基本上布置在半导体衬底的上方。 选择晶体管的第二源极/漏极区域被埋在半导体衬底中并彼此连接。 字线可以形成为相邻栅电极的形式自对称。 可以通过仅使用一个掩模的蚀刻来产生突起。 可以生产具有4F2面积的存储单元,F是可以在各自技术中生产的最小结构尺寸。

    Integrated circuit having a Fin structure
    32.
    发明授权
    Integrated circuit having a Fin structure 失效
    具有鳍结构的集成电路

    公开(公告)号:US07700427B2

    公开(公告)日:2010-04-20

    申请号:US11762582

    申请日:2007-06-13

    IPC分类号: H01L21/8238

    摘要: Embodiments of the invention relate generally to a method for manufacturing an integrated circuit, a method for manufacturing a cell arrangement, an integrated circuit, a cell arrangement, and a memory module. In an embodiment of the invention, a method for manufacturing an integrated circuit having a cell arrangement is provided, including forming at least one semiconductor fin structure having an area for a plurality of fin field effect transistors, wherein the area of each fin field effect transistor includes a first region having a first fin structure width, a second region having a second fin structure width, wherein the second fin structure width is smaller than the first fin structure width. Furthermore, a plurality of charge storage regions are formed on or above the second regions of the semiconductor fin structure.

    摘要翻译: 本发明的实施例一般涉及用于制造集成电路的方法,用于制造单元布置的方法,集成电路,单元布置和存储器模块。 在本发明的一个实施例中,提供一种用于制造具有单元布置的集成电路的方法,包括形成至少一个半导体鳍结构,其具有用于多个鳍场效应晶体管的面积,其中每个鳍场效应晶体管的面积 包括具有第一鳍结构宽度的第一区域,具有第二鳍结构宽度的第二区域,其中第二鳍结构宽度小于第一鳍结构宽度。 此外,在半导体鳍片结构的第二区域上或上方形成多个电荷存储区域。

    Semiconductor memory with charge-trapping stack arrangement
    34.
    发明授权
    Semiconductor memory with charge-trapping stack arrangement 失效
    具有电荷俘获堆叠布置的半导体存储器

    公开(公告)号:US07528425B2

    公开(公告)日:2009-05-05

    申请号:US11193026

    申请日:2005-07-29

    IPC分类号: H01L29/792

    摘要: A semiconductor memory having a multitude of memory cells (21-1), the semiconductor memory having a substrate (1), at least one wordline (5-1), a first (15-1) and a second line (15-2; 16-1), wherein each of the multitude of memory cells (21-1) comprises a first doping region (6) disposed in the substrate (1), a second doping region (7) disposed in the substrate (1), a channel region (22) disposed in the substrate (1) between the first doping region (6) and the second doping region (7), a charge-trapping layer stack (2) disposed on the substrate (1), on the channel region (22), on a portion of the first doping region (6) and on a portion of the second doping region (7). Each memory cell (21-1) further comprises a conductive layer (3) disposed on the charge-trapping layer stack (2), wherein the conductive layer (3) is electrically floating. A dielectric layer (4) is disposed on a top surface of the conductive layer (3) and on sidewalls (23) of the conductive layer (3). The first line (15-1) extends along a first direction and is coupled to the first doping region (6), and the second line (15-2; 16-1) extends along the first direction and is coupled to the second doping region (7). The at least one wordline (5-1) extends along a second direction and is disposed on the dielectric layer (4).

    摘要翻译: 一种具有多个存储单元(21-1)的半导体存储器,所述半导体存储器具有衬底(1),至少一个字线(5-1),第一(15-1)和第二线(15-2) ; 16-1),其中多个存储单元(21-1)中的每一个包括设置在所述基板(1)中的第一掺杂区域(6),设置在所述基板(1)中的第二掺杂区域(7) 设置在第一掺杂区域(6)和第二掺杂区域(7)之间的衬底(1)中的沟道区域(22),设置在衬底(1)上的电荷捕获层堆叠(2) 在第一掺杂区域(6)的一部分上和第二掺杂区域(7)的一部分上的区域(22)。 每个存储单元(21-1)还包括设置在电荷捕获层堆叠(2)上的导电层(3),其中导电层(3)是电浮置的。 介电层(4)设置在导电层(3)的顶表面和导电层(3)的侧壁(23)上。 第一行(15-1)沿着第一方向延伸并且耦合到第一掺杂区域(6),并且第二线路(15-2; 16-1)沿第一方向延伸并耦合到第二掺杂区域 地区(7)。 所述至少一个字线(5-1)沿着第二方向延伸并设置在所述电介质层(4)上。

    Charge-trapping memory cell and method for production
    35.
    发明申请
    Charge-trapping memory cell and method for production 有权
    电荷俘获记忆体和生产方法

    公开(公告)号:US20060115978A1

    公开(公告)日:2006-06-01

    申请号:US11000350

    申请日:2004-11-30

    IPC分类号: H01L21/4763

    摘要: The memory cell array comprises a plurality of parallel fins provided as bitlines arranged at a distance of down to about 40 nm from one another and having a lateral dimension of less than about 30 nm, subdivided into pairs of adjacent first and second fins. A charge-trapping memory layer sequence is arranged on the fins. Wordlines are arranged across the fins, and source/drain regions are located in the fins between the wordlines and at the ends of the fins. There are preferably self-aligned contact areas of the source/drain regions at the ends of the fins, each contact area being common to the fins of one of said pairs. Select transistors and select lines are provided for the first and second fins individually to enable a separate addressing of the memory cells.

    摘要翻译: 存储单元阵列包括多个平行翅片,它们设置成彼此相距约40nm的位线,并且具有小于约30nm的横向尺寸,被细分成相邻的第一和第二鳍片对。 鳍片上布置有电荷俘获记忆层序列。 词汇排列在翅片之间,源极/漏极区域位于字线之间的翅片和翅片的末端。 优选地,在鳍片的端部处的源极/漏极区域的自对准接触区域,每个接触区域对于所述成对中的一个的翅片是共同的。 选择晶体管,并且单独地为第一和第二散热片提供选择线以使得能够单独寻址存储器单元。

    Substrate and method for producing a substrate
    36.
    发明申请
    Substrate and method for producing a substrate 有权
    基板及其制造方法

    公开(公告)号:US20050110088A1

    公开(公告)日:2005-05-26

    申请号:US10968846

    申请日:2004-10-18

    CPC分类号: H01L21/76254

    摘要: Substrate having a first partial substrate with a carrier layer and a second partial substrate, which is bonded to the first partial substrate. The second partial substrate has an insulator layer, which is applied on the carrier layer and has at least two regions each having a different thickness, thereby forming a stepped surface of the insulator layer, and a semiconductor layer, which is applied to the stepped surface of the insulator layer and is formed at least partially epitaxially, wherein the semiconductor layer has a planar surface which is opposite to the stepped surface of the insulator layer. Transistors are formed on the semiconductor layer.

    摘要翻译: 衬底,具有第一部分衬底和载体层,第二部分衬底与第一部分衬底结合。 第二部分基板具有绝缘体层,其被施加在载体层上并且具有至少两个各自具有不同厚度的区域,从而形成绝缘体层的台阶表面,以及施加到台阶表面的半导体层 并且至少部分地外延形成,其中半导体层具有与绝缘体层的台阶表面相对的平面。 在半导体层上形成晶体管。

    Method for the production of a DRAM cell configuration
    37.
    发明授权
    Method for the production of a DRAM cell configuration 有权
    用于生产DRAM单元配置的方法

    公开(公告)号:US06420228B1

    公开(公告)日:2002-07-16

    申请号:US09851051

    申请日:2001-05-08

    IPC分类号: H01L218242

    CPC分类号: H01L27/10864 H01L27/10841

    摘要: A DRAM cell configuration includes a vertical MOS transistor per memory cell. First source/drain regions of the transistor each belong to two adjacent transistors and adjoin a bit line. Second source/drain regions of the transistor are connected to a storage node. A gate electrode of the transistor has exactly two sides adjoined by a gate oxide. The DRAM cell configuration can be produced by using three masks with a memory cell area of 4 F2. F is a minimum structure size which can be produced by using the respective technology.

    摘要翻译: DRAM单元配置包括每个存储单元的垂直MOS晶体管。 晶体管的第一源极/漏极区域分别属于两个相邻的晶体管并与位线相邻。 晶体管的第二源/漏区连接到存储节点。 晶体管的栅电极具有由栅极氧化物邻接的正好两侧。 可以通过使用具有4F2的存储单元面积的三个掩模来产生DRAM单元配置。 F是可以通过使用各自技术制造的最小结构尺寸。

    DRAM cell structure with tunnel barrier
    38.
    发明授权
    DRAM cell structure with tunnel barrier 有权
    具有隧道势垒的DRAM单元结构

    公开(公告)号:US07180115B1

    公开(公告)日:2007-02-20

    申请号:US10130441

    申请日:2000-11-14

    IPC分类号: H01L27/108

    摘要: The invention relates to a transistor that is provided with a first source/drain area (S/D1), a channel area (KA) adjacent thereto, a second source/drain area (S/D 2) adjacent thereto, a gate dielectric and a gate electrode. A first capacitor electrode (SP) of the capacitor is connected to the first source/drain area (S/D1). An insulating structure entirely surrounds an insulating area of the circuit arrangement. At least the first capacitor electrode (SP) and the first source/drain area (S/D1) are arranged in the insulating area. The second source/drain area (S/D2) and the second capacitor electrode of the capacitor are arranged outside the insulating area. The insulating structure prevents the first capacitor electrode (SP) from loosing charge through leaking currents between charging and discharging of the capacitor. A tunnel barrier (T) which is arranged in the channel area (KA) is part of the insulating structure. A capacitor dielectric (KD) that separates the first capacitor electrode (SP) from the second capacitor electrode is part of the insulating structure.

    摘要翻译: 本发明涉及一种具有第一源极/漏极区域(S / D 1),与其相邻的沟道区域(KA),与其相邻的第二源极/漏极区域(S / D 2),栅极电介质 和栅电极。 电容器的第一电容器电极(SP)连接到第一源极/漏极区域(S / D 1)。 绝缘结构完全围绕电路装置的绝缘区域。 至少第一电容器电极(SP)和第一源极/漏极区域(S / D 1)布置在绝缘区域中。 电容器的第二源极/漏极区域(S / D 2)和第二电容器电极布置在绝缘区域的外部。 绝缘结构防止第一电容器电极(SP)通过电容器的充电和放电之间的泄漏电流而失去电荷。 布置在通道区域(KA)中的隧道势垒(T)是绝缘结构的一部分。 将第一电容器电极(SP)与第二电容器电极分离的电容器电介质(KD)是绝缘结构的一部分。

    Semiconductor memory, the fabrication thereof and a method for operating the semiconductor memory
    39.
    发明申请
    Semiconductor memory, the fabrication thereof and a method for operating the semiconductor memory 失效
    半导体存储器,其制造和半导体存储器的操作方法

    公开(公告)号:US20070023808A1

    公开(公告)日:2007-02-01

    申请号:US11193026

    申请日:2005-07-29

    IPC分类号: H01L21/336 H01L29/94

    摘要: A semiconductor memory having a multitude of memory cells (21-1), the semiconductor memory having a substrate (1), at least one wordline (5-1), a first (15-1) and a second line (15-2; 16-1), wherein each of the multitude of memory cells (21-1) comprises a first doping region (6) disposed in the substrate (1), a second doping region (7) disposed in the substrate (1), a channel region (22) disposed in the substrate (1) between the first doping region (6) and the second doping region (7), a charge-trapping layer stack (2) disposed on the substrate (1), on the channel region (22), on a portion of the first doping region (6) and on a portion of the second doping region (7). Each memory cell (21-1) further comprises a conductive layer (3) disposed on the charge-trapping layer stack (2), wherein the conductive layer (3) is electrically floating. A dielectric layer (4) is disposed on a top surface of the conductive layer (3) and on sidewalls (23) of the conductive layer (3). The first line (15-1) extends along a first direction and is coupled to the first doping region (6), and the second line (15-2; 16-1) extends along the first direction and is coupled to the second doping region (7). The at least one wordline (5-1) extends along a second direction and is disposed on the dielectric layer (4).

    摘要翻译: 一种具有多个存储单元(21-1)的半导体存储器,所述半导体存储器具有衬底(1),至少一个字线(5-1),第一(15-1)和第二线(15-2) ; 16-1),其中多个存储单元(21-1)中的每一个包括设置在所述衬底(1)中的第一掺杂区域(6),设置在所述衬底(1)中的第二掺杂区域(7) 设置在第一掺杂区域(6)和第二掺杂区域(7)之间的衬底(1)中的沟道区域(22),设置在衬底(1)上的电荷捕获层堆叠(2) 在第一掺杂区域(6)的一部分上和第二掺杂区域(7)的一部分上的区域(22)。 每个存储单元(21-1)还包括设置在电荷捕获层堆叠(2)上的导电层(3),其中导电层(3)是电浮置的。 介电层(4)设置在导电层(3)的顶表面和导电层(3)的侧壁(23)上。 第一线(15-1)沿着第一方向延伸并且耦合到第一掺杂区域(6),并且第二线路(15-2; 16-1)沿着第一方向延伸并且耦合到第二掺杂 地区(7)。 所述至少一个字线(5-1)沿着第二方向延伸并且设置在所述电介质层(4)上。