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公开(公告)号:US20170120292A1
公开(公告)日:2017-05-04
申请号:US15031611
申请日:2014-02-18
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , CHUNG-HUNG HUANG
CPC classification number: B05D5/067 , B05D1/32 , B05D1/36 , B05D5/06 , B05D7/53 , B05D2202/00 , B44F9/10
Abstract: A surface finishing method comprises applying coatings of a hydrophobic material and a water-borne material to a surface of a metal substrate. First, a patterned coating of a first one of the hydrophobic or water-borne materials is applied to a surface of the metal substrate to partially cover the surface. A second fill coating of the other of the hydrophobic or water borne materials is then applied after the first patterned coating whereby the water borne material and the hydrophobic material repel and the second fill coating coats the surface of the metal substrate in areas uncoated by the first coating.
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公开(公告)号:US20170089360A1
公开(公告)日:2017-03-30
申请号:US15306520
申请日:2014-06-18
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHIENLUNG YANG , KUAN-TING WU , HUI LENG LIM
CPC classification number: F04D29/664 , F04D29/326 , G06F1/20 , H05K7/20172
Abstract: A fan includes a main member, vanes, and an acoustic absorption member. The vanes are coupled to and extending outward from the main member. The acoustic absorption member is coupled to each one of the plurality of vanes. The acoustic absorption member and the vanes rotate along with the main member.
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公开(公告)号:US20160326624A1
公开(公告)日:2016-11-10
申请号:US15105416
申请日:2014-01-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: YU-CHUAN KANG , KUAN-TING WU
IPC: C23C4/12 , C23C4/134 , C23C4/131 , C23C28/00 , C23C4/126 , C25D11/02 , C25D13/20 , C23C4/08 , C23C4/129
Abstract: A method is provided for treating a metal substrate. The method comprises applying a metal layer to the substrate using a thermal spray process and electrochemically treating the metal layer to form a coating.
Abstract translation: 提供了一种处理金属基板的方法。 该方法包括使用热喷涂法将金属层施加到基底上,并对金属层进行电化学处理以形成涂层。
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公开(公告)号:US20160231775A1
公开(公告)日:2016-08-11
申请号:US15021476
申请日:2013-10-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHUNG-HUNG HUANG , YU-CHUAN KANG , CHIEN-TING LIN , KUAN-TING WU
CPC classification number: G06F1/1626 , B32B1/02 , B32B15/08 , B32B2250/02 , B32B2255/06 , B32B2255/20 , B32B2457/00 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/10 , C25D11/26 , C25D11/30 , G06F2200/1633 , H04M1/0283
Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.
Abstract translation: 提供了一种将转印膜施加到金属表面的方法。 该方法包括电化学处理金属以形成氧化物层,在其上施加转移膜。
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公开(公告)号:US20220066512A1
公开(公告)日:2022-03-03
申请号:US16763446
申请日:2018-02-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: HUI HE , HUI LENG LIM , CHI HAO CHANG , KUAN-TING WU
Abstract: Examples include an apparatus comprising a laptop housing, an elastomer layer fixed on a surface of the laptop housing, and a fabric layer fixed on the elastomer layer.
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公开(公告)号:US20210404084A1
公开(公告)日:2021-12-30
申请号:US16341249
申请日:2017-02-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: YONG-JUN LI , KUAN-TING WU , XIAO-JUN ZHU
IPC: C25D11/02 , B32B15/08 , B32B15/14 , B32B5/02 , B32B15/09 , B32B15/088 , B32B15/082 , B32B15/18 , B32B15/20 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/36 , C25D11/04 , C25D11/26 , C25D11/30 , C25D11/34
Abstract: The present subject matter relates to techniques of electrolytic oxidation for composite materials. In an example, a method includes immersing a composite material into an electrolytic solution for electrolytic oxidation, wherein the composite material comprises a metal alloy substrate and a second substrate. The method further includes providing a predetermined voltage to the electrolytic solution after every predefined time interval, wherein the voltage triggers electrolytic oxidation of the metal alloy substrate.
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公开(公告)号:US20210396917A1
公开(公告)日:2021-12-23
申请号:US17418450
申请日:2019-02-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , HANG YAN YUEN , HUI HE
Abstract: The present disclosure is drawn to anti-glare diffusing films for electronic displays. In one example, an anti-glare diffusing film for an electronic display can include multiple fused layers that individually include transparent polymer particles fused together using a fusing agent. The fusing agent can include diffusing particles selected from hollow glass beads, hollow polymer beads, titanium aerogel particles, or a combination thereof.
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公开(公告)号:US20200301479A1
公开(公告)日:2020-09-24
申请号:US16649174
申请日:2017-12-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEI-CHUNG CHEN , KUAN-TING WU
IPC: G06F1/16
Abstract: In one example, a housing is described, which may include an outer cover and an electromagnet. The outer cover may include at least one slot and at least one slot cover to cover the at least one slot. The electromagnet may be fixedly disposed in the housing and aligned with the at least one slot cover to electromagnetically control a movement of the at least one slot cover.
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公开(公告)号:US20200283648A1
公开(公告)日:2020-09-10
申请号:US16754122
申请日:2017-11-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , YA-TING YEH , CHI HAO CHANG
Abstract: In one example, an electronic device housing is described, which may include a substrate having a surface and at least one waterborne metallic paint coating formed on the surface of the substrate. The at least one waterborne metallic paint coating may include an insulating material encapsulated metal powder in combination with at least one of a surface modified synthetic mica and a surface modified glass platelet.
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公开(公告)号:US20190221498A1
公开(公告)日:2019-07-18
申请号:US16323090
申请日:2016-10-06
Applicant: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , DAVID A. PIPHO , KEVIN VOSS
IPC: H01L23/433 , H01L21/48
CPC classification number: H01L23/433 , H01L21/4871 , H01L21/56 , H01L23/02 , H01L23/3675 , H01L23/42 , H01L2224/32245 , H01L2924/14 , H01L2924/16251
Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.
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