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公开(公告)号:US11064572B2
公开(公告)日:2021-07-13
申请号:US16073163
申请日:2016-06-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Cassady Sparks Roop , Kevin P. DeKam
IPC: H05B1/02 , H05B3/14 , G01B1/00 , G01B7/16 , B29C64/165 , B29C64/218 , G01L1/22 , B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y80/00 , B29K101/12 , C09D11/037
Abstract: According to an example, a three-dimensional (3D) printed heater may include a part body formed of fused thermoplastic polymer particles and an electrically resistive element formed of a matrix of conductive particles interspersed between a matrix of thermoplastic polymer particles. The conductive particles and the thermoplastic polymer particles may be provided at respective densities to cause the electrically resistive element to have a predetermined resistance level. The 3D printed heater may also include electrical contacts connected to the electrically resistive element, in which a current is to be applied through the electrically resistive element via the electrical contacts to cause the electrically resistive element to generate a predefined level of heat.
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公开(公告)号:US10375765B2
公开(公告)日:2019-08-06
申请号:US16073142
申请日:2016-04-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Cassady Roop , Kevin P. DeKam
IPC: H05B3/14 , G01L1/22 , G01B1/00 , G01B7/16 , B29C64/165 , B29C64/218 , B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y80/00 , B29K101/12 , C09D11/037
Abstract: A 3-dimensional printed load cell part can include a part body formed of fused thermoplastic polymer particles, and a plurality of strain sensors separately formed of a matrix of conductive particles interlocked with a matrix of fused thermoplastic polymer particles. The plurality of strain sensors can have a first electrical contact at a first end and a second electrical contact at a second end. The particles of the plurality of strain sensors can be continuously fused to the particles of the part body.
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公开(公告)号:US20190022930A1
公开(公告)日:2019-01-24
申请号:US16073222
申请日:2016-04-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garry Hinch , Kevin P. DeKam , Sterling Chaffins , James William Stasiak
IPC: B29C64/165
Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.
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公开(公告)号:US20190022929A1
公开(公告)日:2019-01-24
申请号:US16073142
申请日:2016-04-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Cassady Roop , Kevin P. DeKam
IPC: B29C64/165 , B29C64/218 , G01L1/22
CPC classification number: H05B3/146 , B29C64/165 , B29C64/209 , B29C64/218 , B29K2101/12 , B33Y10/00 , B33Y30/00 , B33Y80/00 , C09D11/037 , G01B1/00 , G01B7/18 , G01L1/2293 , H05B3/145 , H05B2203/003 , H05B2203/013 , H05B2203/017
Abstract: A 3-dimensional printed load cell part can include a part body formed of fused thermoplastic polymer particles, and a plurality of strain sensors separately formed of a matrix of conductive particles interlocked with a matrix of fused thermoplastic polymer particles. The plurality of strain sensors can have a first electrical contact at a first end and a second electrical contact at a second end. The particles of the plurality of strain sensors can be continuously fused to the particles of the part body.
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公开(公告)号:US10047233B2
公开(公告)日:2018-08-14
申请号:US15308788
申请日:2014-06-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Larrie Deardurff , Jayprakash C. Bhatt , Cory J. Ruud , Sterling Chaffins , Matthew Thornberry
IPC: C09D11/322 , C09D11/102 , C09D11/38 , C09B67/22
CPC classification number: C09D11/322 , C09B67/0033 , C09B67/0041 , C09D11/102 , C09D11/38
Abstract: The present disclosure is drawn to a magenta pigment blend, a magenta ink, and a method of formulation a magenta pigment blend. The magenta pigment blend can be a first pigment including a solid solution of Pigment Violet 19 and Pigment Red 122, or Pigment Red 282; and a second pigment including Pigment Red 150. The weight ratio of the first pigment to the second pigment can be from 50:50 to 80:20 by pigment solids content.
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公开(公告)号:US20170106651A1
公开(公告)日:2017-04-20
申请号:US15120676
申请日:2014-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Bradley D. Chung , Galen P. Cook , Michael H. Hayes , Adam L. Ghozeil , Chantelle Elizabeth Domingue , Valerie J. Marty , Anthony M. Fuller , Sterling Chaffins
IPC: B41J2/14 , B41J29/377
CPC classification number: B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J29/377
Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
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公开(公告)号:US20250058519A1
公开(公告)日:2025-02-20
申请号:US18938212
申请日:2024-11-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Thomas A. Saksa , Kevin P. DeKam , Juan Sebastian Ramirez , Dale Peterson , Jami Ryan Barone
IPC: B29C64/295 , B22F1/054 , B22F1/10 , B29C64/165 , B29C64/268 , B33Y10/00 , B33Y30/00 , B33Y70/10
Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.
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公开(公告)号:US12042986B2
公开(公告)日:2024-07-23
申请号:US17891453
申请日:2022-08-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Cassady Sparks Roop , Kevin P. Dekam , Vladek Kasperchik , Ali Emamjomeh , Johnathon Holroyd , Stephen G. Rudisill , Alexey S. Kabalnov
IPC: B29C64/00 , B29C64/10 , B29C64/153 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/336 , B29C64/40 , B29C70/88 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y70/10 , B33Y80/00 , B33Y99/00 , C08K3/08 , C08K3/22 , C08L67/04 , C09D11/322 , C09D11/40 , C09D11/52 , B29K505/08 , B33Y10/00 , B33Y70/00 , C08L77/02
CPC classification number: B29C64/153 , B29C64/00 , B29C64/10 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/336 , B29C64/40 , B29C70/882 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y70/10 , B33Y80/00 , B33Y99/00 , C08K3/08 , C08K3/22 , C08L67/04 , C09D11/322 , C09D11/40 , C09D11/52 , B29K2505/08 , B33Y10/00 , B33Y70/00 , C08K2003/0806 , C08K2003/0831 , C08K2003/085 , C08K2003/2258 , C08K2201/005 , C08K2201/011 , C08L77/02 , C08K3/22 , C08L77/02 , C08K3/08 , C08L77/02
Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
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公开(公告)号:US12011874B2
公开(公告)日:2024-06-18
申请号:US17376742
申请日:2021-07-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Kevin P. Dekam , Cassady Sparks Roop
IPC: B29C64/153 , B29C64/295 , B29C64/307 , G01B1/00 , G01B7/16 , G01L1/22
CPC classification number: B29C64/153 , B29C64/295 , B29C64/307 , G01B1/00 , G01B7/18 , G01L1/2287
Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
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公开(公告)号:US11981075B2
公开(公告)日:2024-05-14
申请号:US17891922
申请日:2022-08-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garry Hinch , Kevin P. DeKam , Sterling Chaffins , James William Stasiak
CPC classification number: B29C64/165 , B29C67/00 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y70/10 , B29K2995/0018
Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.
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