摘要:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
摘要:
Disclosed is a DRAM including a test mode operation capable of testing whether a plurality of memory cells are defective or not in a short time. The DRAM includes a power-on detection signal generator, a power-on reset signal generator, and a test mode instruction signal generator. The power-on detection signal generator detects application of a power supply voltage and generates a power-on detection signal. The power-on reset signal generator is reset by a power-on reset signal, counts at least once an external RAS signal applied after reset and generates a power-on reset signal. The test mode instruction signal generator detects logic states of an internal RAS signal, an internal CAS signal and an internal W signal applied after the power-on reset and generates a test mode instructing signal.
摘要:
An input signal is inverted by a CMOS inverter and provided for an output signal line. The CMOS inverter is provided between a power supply and a ground, and its node on the side of the power supply is charged all the time to prevent the potential thereof from being lowered. An output signal provided for the output signal line is delayed by a delay circuit to be applied to a boosting capacitor. The potential of the node is further boosted by this boosting capacitor. Consequently, the potential of the output signal is also boosted. When the potential of the node is raised higher than a supply voltage, an N channel MOSFET for charging is turned off to prevent a reverse flow of a charge.
摘要:
Disclosed is a DRAM including a test mode operation capable of testing whether a plurality of memory cells are defective or not in a short time. The DRAM includes a power-on detection signal generator, a power-on reset signal generator, and a test mode instruction signal generator. The power-on detection signal generator detects application of a power supply voltage and generates a power-on detection signal. The power-on reset signal generator is reset by a power-on reset signal, counts at least once an external RAS signal applied after reset and generates a power-on reset signal. The test mode instruction signal generator detects logic states of an internal RAS signal, an internal CAS signal and an internal W signal applied after the power-on reset and generates a test mode instructing signal.
摘要:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
摘要:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
摘要:
A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption. Since data writing path and data reading path are separately provided in the DRAM array, addresses to the DRAM array can be applied in non-multiplexed manner, so that data can be transferred at high speed from the DRAM array to the SRAM array, enabling high speed operation even at a cache miss.
摘要:
In a dynamic random access memory (DRAM), there is provided a refresh decision circuit which detects the external designation of a self refresh mode, in addition to a CAS before RAS refresh mode, by RAS and CAS signals. By detecting a time period of one cycle of the RAS, the self refresh mode is determined. As a result, the timing of change of the RAS signal is less restricted.
摘要:
A dynamic random access memory device includes a pair of write-in data transferring buses for transferring data to be written, a pair of read-out data transferring buses for transferring data to be read provided additionally and separately from the write-in data transferring bus pair and a plurality of current mirror type sense amplifiers formed of CMOS transistors and each amplifier being provided between a bit line pair and the read-out data transferring bus pair and having input nodes connected to the corresponding bit line pair and the read-out data transferring bus pair forming output nodes thereof. The current mirror type sense amplifiers of CMOS transistors are activated in response to an output of a column decoder at earlier time than the time when conventional flip-flop type sense amplifiers are activated.
摘要:
There is disclosed a dynamic random access memory device of the type capable of periodic self-refresh cycles of operation. The DRAM includes the detector circuit for detecting the designation of the self-refresh mode and a voltage generator circuit for generating a voltage to precharge the bit line pair. During the self-controlled refresh cycle, the bit line pair is equalized and precharged to a voltage lower than Vcc/2. When it is attempted to set the time interval between the self-refresh cycles in order to reduce current consumption, the level of voltage stored in the memory cell capacitor tends to decrease due to charge leakage. However, it is implemented to provide and keep a potential difference between the precharge voltage on the bit line pair and the voltage stored in the capacitor thereby to secure the desired sensing margin for the sense amplifier.