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    MEMS differential actuated nano probe and method for fabrication
    31.
    发明授权
    MEMS differential actuated nano probe and method for fabrication 失效
    MEMS微分致动纳米探针和制造方法

    公开(公告)号：US06995368B2

    公开(公告)日：2006-02-07

    申请号：US10795407

    申请日：2004-03-09

    申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

    发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

    IPC分类号： G21K7/00

    CPC分类号： G01Q10/045 ,  G01Q70/10 ,  Y10S977/872

    摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.

    摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。

    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING
    36.
    发明申请
    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权
    带注射成型电气连接器的发光二极管灯模块

    公开(公告)号：US20120088397A1

    公开(公告)日：2012-04-12

    申请号：US12899999

    申请日：2010-10-07

    申请人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    发明人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC分类号： H01R43/24 ,  H01R43/18 ,  B29C45/14 ,  H01R13/00

    CPC分类号： B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

    摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

    摘要翻译： 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

    Image sensing device and manufacture method thereof
    37.
    发明授权
    Image sensing device and manufacture method thereof 有权
    图像感测装置及其制造方法

    公开(公告)号：US08143084B2

    公开(公告)日：2012-03-27

    申请号：US12356347

    申请日：2009-01-20

    申请人： Hsiao-Wen Lee

    发明人： Hsiao-Wen Lee

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14685 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

    摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

    摘要翻译： 提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。 图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。

    Lens
    38.
    外观设计
    Lens 有权

    公开(公告)号：USD597249S1

    公开(公告)日：2009-07-28

    申请号：US29325595

    申请日：2008-10-03

    申请人： Hsiao-Wen Lee

    设计人： Hsiao-Wen Lee

    Optoelectronic device package and packaging method thereof
    40.
    发明申请
    Optoelectronic device package and packaging method thereof 审中-公开
    光电器件封装及其封装方法

    公开(公告)号：US20080169480A1

    公开(公告)日：2008-07-17

    申请号：US11652060

    申请日：2007-01-11

    申请人： Jui-Ping Weng ,  Hsiao-Wen Lee

    发明人： Jui-Ping Weng ,  Hsiao-Wen Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space, a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substrate within the closed space. The invention also provides a method of packaging the optoelectronic device.

    摘要翻译： 光电器件封装。 所述光电器件封装包括衬底，形成在所述衬底的第一平面上的反射器，结合到所述反射器以形成闭合空间的盖，形成在所述盖的第一平面上的多个微透镜，形成在所述衬底上的荧光膜 封闭空间内的盖的第二平面，形成在基板的第二平面上的导热膜，形成在未被导热膜覆盖的侧壁和基板的第二平面上的电极和形成的光电子器件 在封闭空间内的衬底的第一平面上。 本发明还提供一种封装光电器件的方法。