公开(公告)号：US10595419B1

公开(公告)日：2020-03-17

申请号：US16170005

申请日：2018-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  James Busby ,  David C. Long ,  Robert Weiss ,  Michael Fisher ,  Tristen Gaudette

IPC: H05K3/32 ,  B29C33/00 ,  B29C33/44 ,  B29C33/12 ,  B29C44/02 ,  B29C44/08 ,  B29C44/12 ,  B29C70/00 ,  B29C70/84 ,  H05K3/46 ,  G06F21/87 ,  H01L23/31 ,  H05K1/02

Abstract: A fixture assembly for deforming a flex circuit that includes: a base plate having a recess; a wrinkle reducer plate having a first cut-out portion aligned with the recess; a stiffening block having a second cut-out portion aligned with the recess and the first cut-out portion; and a punch to slideably engage with the recess, the first cut-out portion and the second cut-out portion; wherein, in operation, a flex circuit is placed between the base plate and wrinkle reducer plate and the punch extends through the first cut-out portion and the second cut-out portion to engage the flex circuit and deform the flex circuit into the recess so that the flex circuit has a formed section in the shape of the recess and a flat section clamped by the wrinkle reducer plate and the base plate.

公开(公告)号：US10531561B2

公开(公告)日：2020-01-07

申请号：US16285437

申请日：2019-02-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kathleen Ann Fadden ,  James A. Busby ,  David C. Long ,  John R. Dangler ,  Alexandra Echegaray ,  Michael J. Fisher ,  William Santiago-Fernandez

IPC: H05K5/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

公开(公告)号：US10378924B2

公开(公告)日：2019-08-13

申请号：US16136589

申请日：2018-09-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  Silvio Dragone ,  Roger S. Krabbenhoft ,  David C. Long ,  Stefano S. Oggioni ,  Michael T. Peets ,  William Santiago-Fernandez

IPC: H05K1/02 ,  G01D5/16 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

公开(公告)号：US10334722B2

公开(公告)日：2019-06-25

申请号：US15800497

申请日：2017-11-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Phillip Duane Isaacs ,  David C. Long

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09 ,  H05K7/02 ,  H05K3/30 ,  H05K3/12 ,  H05K3/46 ,  H05K5/02

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≤200 μm, as well as a line-to-line spacing width Ws≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US10327343B2

公开(公告)日：2019-06-18

申请号：US15193556

申请日：2016-06-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. Fisher ,  David C. Long ,  Donald Merte ,  Robert Weiss ,  Thomas Weiss

IPC: H05K5/02 ,  B29C65/02 ,  H05K5/00 ,  H05K5/06 ,  B29L31/00

Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

公开(公告)号：US10327329B2

公开(公告)日：2019-06-18

申请号：US15430842

申请日：2017-02-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  John R. Dangler ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long

IPC: H05K1/02 ,  H05K1/18 ,  G08B13/06 ,  G08B13/14

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected, and the in-situ-formed tamper-detect sensor is formed in place over an inner surface of the enclosure. The flexible tamper-detect sensor(s) is disposed over the in-situ-formed tamper-detect sensor, such that the in-situ-formed tamper-detect sensor is between the inner surface of the enclosure and the flexible tamper-detect sensor(s). Together the in-situ-formed tamper-detect sensor and flexible tamper-detect sensor(s) facilitate defining, at least in part, a secure volume about the one or more electronic components.

公开(公告)号：US10306753B1

公开(公告)日：2019-05-28

申请号：US15901985

申请日：2018-02-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kathleen Ann Fadden ,  James A. Busby ,  David C. Long ,  John R. Dangler ,  Alexandra Echegaray ,  Michael J. Fisher ,  William Santiago-Fernandez

IPC: H03K5/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K5/00

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

公开(公告)号：US10251288B2

公开(公告)日：2019-04-02

申请号：US15836966

申请日：2017-12-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Robert Weiss ,  Thomas Weiss ,  James E. Tersigni

IPC: G06F1/16 ,  H05K5/02 ,  G06F21/00 ,  G06F21/86

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

公开(公告)号：US09999124B2

公开(公告)日：2018-06-12

申请号：US15341108

申请日：2016-11-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Michael J. Fisher ,  Michael A. Gaynes ,  David C. Long ,  Thomas Weiss

IPC: G01N27/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0275 ,  G01N27/20 ,  G06F21/86 ,  G06F2221/2143 ,  H05K1/028 ,  H05K1/182 ,  H05K2201/09036

Abstract: Tamper-respondent assemblies with regions of increased susceptibility to a tamper event are provided, which include one or more tamper-detect sensors, one or more conductive traces, and an adhesive. The tamper-detect sensor(s) facilitates defining a secure volume about one or more electronic components to be protected, and the conductive trace(s) forms, at least in part, a tamper-detect network of the tamper-respondent assembly. The conductive trace(s) is disposed, at least in part, on the tamper-detect sensor(s). The adhesive contacts the conductive trace(s) on the tamper-detect sensor(s), and is disposed, at least in part, between and couples a surface of the tamper-detect sensor(s) to another surface of the assembly. Together, the tamper-detect sensor(s), conductive trace(s), and adhesive are a subassembly, with the subassembly being configured with multiple regions of increased susceptibility to breaking of the conductive trace(s) with a tamper event through the subassembly.

公开(公告)号：US20180098423A1

公开(公告)日：2018-04-05

申请号：US15827275

申请日：2017-11-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: H05K1/02 ,  H05K5/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.