公开(公告)号：US20140240930A1

公开(公告)日：2014-08-28

申请号：US13778552

申请日：2013-02-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER ,  Richard P. SNIDER

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20636 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract translation: 提供冷却装置和冷却剂冷却的电子组件，其包括热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热转印结构包括耦合到电子卡的一侧的散热器，并且该装置还包括邻近电子系统的插座设置的冷却剂冷却结构。 冷却剂冷却结构包括：一个或多个低剖面冷轨，其大小和构造成沿着散热器的底部边缘热耦合到散热器，其中电子卡在插座内的操作对接; 以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂输送通道的冷却剂。

公开(公告)号：US20140124174A1

公开(公告)日：2014-05-08

申请号：US13671857

申请日：2012-11-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: F28D15/00

CPC classification number: F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

Abstract: Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

Abstract translation: 提供冷却装置及其制造方法以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140123492A1

公开(公告)日：2014-05-08

申请号：US13780613

申请日：2013-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: F28D15/00

CPC classification number: F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

Abstract: A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

Abstract translation: 提供一种制造冷却装置的方法，以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140102669A1

公开(公告)日：2014-04-17

申请号：US13758143

申请日：2013-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH ,  Jing ZHANG

IPC: F28D1/02

CPC classification number: H05K7/20836 ,  F28F2265/14

Abstract: An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

Abstract translation: 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

公开(公告)号：US20140102668A1

公开(公告)日：2014-04-17

申请号：US14134017

申请日：2013-12-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/208 ,  F25B39/02 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/06 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49826

Abstract: Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

Abstract translation: 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便制冷剂流过蒸发器。 该装置还包括与制冷剂回路流体连通的压缩机，耦合到制冷剂蒸发器的空气冷却散热器，用于在备用空气冷却模式中向电子部件提供备用冷却，以及耦合到 散热器。 制冷剂加热器通过散热器与通过制冷剂蒸发器的制冷剂热连通，并且被控制在主要的冷冻冷却模式中，以对通过制冷剂蒸发器的制冷剂施加辅助热负荷，以确保制冷剂回路中的制冷剂 进入压缩机处于过热的热力学状态。

公开(公告)号：US20140085817A1

公开(公告)日：2014-03-27

申请号：US13788987

申请日：2013-03-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H05K7/20236 ,  H05K7/20772 ,  Y10T29/49117

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract translation: 提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。 该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。

公开(公告)号：US20140082942A1

公开(公告)日：2014-03-27

申请号：US13788871

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: B23P15/26

CPC classification number: B23P15/26 ,  H05K7/203 ,  H05K7/20336 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49396

Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract translation: 提供了一种便于冷却电子系统的电子部件的方法。 该方法包括：提供壳体，其至少部分地环绕和形成围绕部件的隔室，并且提供浸入冷却流体设置在隔室内，电子系统的至少一个部件至少部分地不浸入流体 在隔间; 提供物理耦合到所述至少一个部件的主表面并且部分地设置在所述隔室内的流体内的芯吸膜元件; 以及通过耦合元件将所述芯吸膜元件物理耦合到所述至少一个部件的主表面，而不将所述耦合元件覆盖在所述部件的主表面上。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

公开(公告)号：US20140048242A1

公开(公告)日：2014-02-20

申请号：US14064322

申请日：2013-10-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: F28F3/00

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20130068423A1

公开(公告)日：2013-03-21

申请号：US13676198

申请日：2012-11-14

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  H05K7/20209 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20781

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract translation: 提供一种用于冷却电子机架的电子子系统的冷却装置和方法。 该冷却装置包括一个局部冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。 冷却子系统与机架的电子子系统相关联，并且包括促进电子子系统的电子部件的浸入式冷却的壳体，或者向电子子系统的电子部件提供导电冷却的一个或多个液冷结构。 冷却剂回路将冷却子系统连接到本地冷却站的液 - 空热交换器。 在操作中，通过来自电子子系统的循环冷却剂传递热量，并将其在局部冷却站的液体 - 空气热交换器中排出到穿过液体 - 空气热交换器的冷却气流。 在一个实施例中，冷却气流是室外空气。

公开(公告)号：US20220347327A1

公开(公告)日：2022-11-03

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  David J. LEWISON ,  Frank L. POMPEO ,  James BUSBY ,  Jay A. BUNT ,  Joyce E. MOLINELLI ACOCELLA ,  Madhana SUNDER ,  Michael J. ELLSWORTH, JR.

IPC: A61L2/10 ,  F21V29/58

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.