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    Sectioned manifolds facilitating pumped immersion-cooling of electronic components
    33.
    发明授权
    Sectioned manifolds facilitating pumped immersion-cooling of electronic components 有权
    有助于泵送浸入式冷却电子部件的分段式歧管

    公开(公告)号：US08964390B2

    公开(公告)日：2015-02-24

    申请号：US13671802

    申请日：2012-11-08

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  F28D15/00 ,  F28F27/00 ,  F28F9/00 ,  B23P15/26

    CPC classification number: B23P15/26 ,  F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/06 ,  H05K7/20809 ,  Y10T29/4935

    Abstract: Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

    Abstract translation: 提供冷却装置和方法以便于电子部件的抽吸浸没冷却。 冷却装置包括围绕一个或多个部件形成隔室的壳体，供应歧管，回流歧管以及使供应和返回歧管与壳体流体连通的冷却剂回路联接器。 流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来浸没组件。 泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。 回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。 冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

    Multi-rack assembly with shared cooling apparatus
    34.
    发明授权
    Multi-rack assembly with shared cooling apparatus 有权
    带共用冷却装置的多机架组件

    公开(公告)号：US08817465B2

    公开(公告)日：2014-08-26

    申请号：US13684736

    申请日：2012-11-26

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC: H05K5/00

    CPC classification number: H05K7/20709 ,  H05K7/20781

    Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

    Abstract translation: 提供了一种方法，其包括提供具有相邻的第一和第二电子机架的多齿条组件，每个电子机架至少部分地被空气冷却，以及与第一齿条相关联的空气与液体热交换器，用于冷却至少一部分 空气通过第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

    Vapor condenser with three-dimensional folded structure
    36.
    发明授权
    Vapor condenser with three-dimensional folded structure 有权
    蒸汽冷凝器具有三维折叠结构

    公开(公告)号：US08739406B2

    公开(公告)日：2014-06-03

    申请号：US13788722

    申请日：2013-03-07

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: B23P15/26 ,  F28B1/02

    CPC classification number: H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

    Abstract: A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

    Abstract translation: 提供一种制造蒸汽冷凝器的方法，其包括三维折叠结构，该三维折叠结构至少部分限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 平行于蒸气冷凝通道延伸。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

    Effectiveness-weighted control of cooling system components
    38.
    发明授权
    Effectiveness-weighted control of cooling system components 有权

    公开(公告)号：US10244665B2

    公开(公告)日：2019-03-26

    申请号：US14960862

    申请日：2015-12-07

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G05D23/00 ,  H05K7/20 ,  G05D23/19 ,  G05B15/02

    Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

    Fabricating a liquid-cooling apparatus with coolant filter
    40.
    发明授权
    Fabricating a liquid-cooling apparatus with coolant filter 有权

    公开(公告)号：US09763357B2

    公开(公告)日：2017-09-12

    申请号：US14826433

    申请日：2015-08-14

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K3/36 ,  H05K7/20

    CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

    Abstract: Methods of fabricating cooling apparatuses with coolant filters are provided which facilitate heat transfer from an electronic component(s). The method includes providing a cooling apparatus which includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. A coolant loop is also provided coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

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