公开(公告)号：US08643199B2

公开(公告)日：2014-02-04

申请号：US12361485

申请日：2009-01-28

Applicant: Stephen E. Lehman, Jr. ,  James C. Matayabas, Jr. ,  Saikumar Jayaraman

Inventor： Stephen E. Lehman, Jr. ,  James C. Matayabas, Jr. ,  Saikumar Jayaraman

IPC: H01L23/29

CPC classification number: H01L23/24 ,  C08G73/10 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/02 ,  H01L21/563 ,  H01L21/566 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract translation: 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。

公开(公告)号：US08431673B2

公开(公告)日：2013-04-30

申请号：US12743657

申请日：2008-11-07

Applicant: Zhikai Jeffrey Wang ,  Christopher Wayne Miller ,  Marcus Lee Hutchins ,  James C. Matayabas, Jr.

Inventor： Zhikai Jeffrey Wang ,  Christopher Wayne Miller ,  Marcus Lee Hutchins ,  James C. Matayabas, Jr.

IPC: C08G18/00

CPC classification number: C08L33/08 ,  C08G18/672 ,  C08G18/7671 ,  C08L2205/02 ,  C08L2312/06 ,  C09D133/08 ,  C09D175/16 ,  G02F2201/50 ,  C08L2666/04

Abstract: The present invention relates to composition comprising at least one compound obtained from the reaction of at least one compound (i) having a refractive index nD20 of at least 1.50 comprising at least one isocyanate-reactable functional group —XH, wherein each of X is, independently, O or NR, at least one polyisocyanate (ii), and, optionally, at least one compound (iii) comprising at least one isocyanate-reactable functional group —YH and at least one curable functional group Q, wherein each of Y is, independently, O, NR or S, and its use for making high refractive index coatings and films.

Abstract translation: 本发明涉及包含至少一种由至少一种折射率nD20至少为1.50的化合物（i）与至少一种异氰酸酯可反应的官能团-XH的反应得到的化合物的组合物，其中X是， 独立地是O或NR，至少一种多异氰酸酯（ii）和任选的至少一种包含至少一种异氰酸酯可反应官能团-YH和至少一个可固化官能团Q的化合物（iii），其中Y为 ，独立地是O，NR或S，以及其用于制备高折射率涂层和膜的用途。

公开(公告)号：US08431223B2

公开(公告)日：2013-04-30

申请号：US13550526

申请日：2012-07-16

Applicant: James C. Matayabas, Jr. ,  Tian-An Chen

Inventor： James C. Matayabas, Jr. ,  Tian-An Chen

IPC: B32B27/26 ,  B32B27/38 ,  H01L23/29 ,  C08L63/00

CPC classification number: C08G59/18 ,  C08G59/20 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2924/181 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00012

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。

公开(公告)号：US07446360B2

公开(公告)日：2008-11-04

申请号：US10914862

申请日：2004-08-09

Applicant: James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir

Inventor： James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir

IPC: H01L35/24 ,  H01L29/76

CPC classification number: G11C11/22 ,  B82Y10/00 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31699

Abstract: According to one aspect of the invention, a polymer device and a method of constructing a polymer device are provided. The polymer device includes a first conductor, a second conductor, and a polymeric body between the first and second conductors. The polymeric body includes a polymer material and a phyllosilicate material.

Abstract translation: 根据本发明的一个方面，提供了一种聚合物装置和一种构建聚合物装置的方法。 聚合物装置包括第一导体，第二导​​体和在第一和第二导体之间的聚合体。 聚合物主体包括聚合物材料和页硅酸盐材料。

公开(公告)号：US07421780B2

公开(公告)日：2008-09-09

申请号：US11326942

申请日：2006-01-06

Applicant: Sabina Houle ,  James C. Matayabas, Jr.

Inventor： Sabina Houle ,  James C. Matayabas, Jr.

IPC: H05K3/30

CPC classification number: H01L23/473 ,  H01L21/4878 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/4935 ,  Y10T29/53109

Abstract: Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet form, and stamping a microchannel structure having a plurality of outer walls enclosing a predefined area from the blank. The microchannel structure may then be bonded to a heat dissipating side opposite from a micro-component device facing side of a first substrate, the micro-component device facing side of the first substrate being adapted to thermally engage with the micro-component device. The microchannel structure may then be bonded to a second substrate opposite the first substrate, resulting in a closed volume microchannel being defined. Finally, the defined microchannel may then be substantially filled with a fluid thermal interface material.

Abstract translation: 本文描述了用于制造微组件装置的热管理系统的方法。 所述方法可以包括首先用具有片状形式的坯料覆盖目标衬底，以及冲压具有从坯件包围预定区域的多个外壁的微通道结构。 然后，微通道结构可以结合到与面向第一基板的微组件装置相对的散热侧，第一基板的面向微面的侧面适于与微组件装置热接合。 然后可以将微通道结构结合到与第一基板相对的第二基板，从而限定封闭体积的微通道。 最后，所定义的微通道然后可以基本上用流体热界面材料填充。

公开(公告)号：US07224050B2

公开(公告)日：2007-05-29

申请号：US11138203

申请日：2005-05-25

Applicant: James C. Matayabas, Jr. ,  Leonel R. Arana ,  Stephen E. Lehman, Jr.

Inventor： James C. Matayabas, Jr. ,  Leonel R. Arana ,  Stephen E. Lehman, Jr.

IPC: H01L23/29

CPC classification number: H01L23/293 ,  C08L101/005 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10S430/128 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.

Abstract translation: 描述了集成电路封装及其制造，其中封装包括树状聚合物或超支化聚合物。 在一些实施方案中，树枝状聚合物或超支化聚合物包括具有一个或多个环结构并具有与塑料的一种或多种组分反应的表面基团的重复单元。 在一些实施方案中，树枝状聚合物或超支化聚合物具有小于集成电路的工作温度的玻璃化转变温度并且形成至少部分分离的相。

公开(公告)号：US06841867B2

公开(公告)日：2005-01-11

申请号：US10334241

申请日：2002-12-30

Applicant: James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

Inventor： James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

IPC: H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L23/10 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

Abstract translation: 包含至少一种乙烯基封端的聚合物的组合物; 至少一个包含末端Si-H单元的交联剂的量; 一定量的至少一种导热第一填料和至少一种导热第二填料，其中第一填料的熔点大于第二填料的熔点。 一种包括被配置为与印刷电路板匹配的封装的设备; 耦合到所述封装的半导体器件; 热元件; 以及设置在所述热元件和所述半导体器件之间的可固化热敏材料。

公开(公告)号：US06469379B1

公开(公告)日：2002-10-22

申请号：US09823106

申请日：2001-03-30

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: H01L2330

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02 ,  C08L83/04 ,  H01L2224/32245 ,  H01L2924/3011 ,  C08L83/00

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil; at least one conductive filler; and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.

Abstract translation: 可用作热物质的可固化材料包括至少一种乙烯基封端的硅油; 至少一种导电填料; 和至少一种氢封端的硅油。 氢封端的硅油用于降低固化的热界面材料的剪切模量G'。

公开(公告)号：US5652328A

公开(公告)日：1997-07-29

申请号：US489091

申请日：1995-08-17

Applicant: Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

Inventor： Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

IPC: C08G65/28 ,  C08G65/02 ,  C08G65/12 ,  C08G65/14 ,  C08G65/26

CPC classification number: C08G65/269 ,  C08G65/12 ,  C08G65/14

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an onium iodide compound such as an ammonium or phosphonium iodide, an organotin compound such as a trihydrocarbyltin iodide, and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.75 and up to 0.98, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了通过在碘鎓化合物如碘化铵或碘化鏻，有机锡化合物如三烃基碘化物和亲核起始物的存在下，通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物 复合。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2-70，m /（n + m）大于0.75，最高为0.98， 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）

公开(公告)号：USH1669H

公开(公告)日：1997-07-01

申请号：US742396

申请日：1996-11-04

Applicant: James C. Matayabas, Jr. ,  James T. Tanner, III ,  Robert M. Finch

Inventor： James C. Matayabas, Jr. ,  James T. Tanner, III ,  Robert M. Finch

IPC: C08G63/672 ,  C08G63/66

CPC classification number: C08G63/672

Abstract: A segmented copolyester-ether polymer comprises 9.5 to 33 percent by weight hard segment residues of polybutylene terephthalate and 0.5 to 67 percent by weight soft segment residues of a polyether polyol comprised of n units of residue (1) and m units of residue (2), wherein the total value of n+m is in the range 2 to 70, m/(n+m) is in the range 0.05 to 0.98, and residues (1) and (2) have the structures: ##STR1## The polyether polyol is further characterized in that at least 95 percent of the hydroxyl groups are primary hydroxyl groups.

Abstract translation: 分段的共聚酯 - 醚聚合物包含9.5至33重量％的聚对苯二甲酸丁二醇酯的硬链段残基和0.5至67重量％的由n个残基（1）单元和m个残基（2）组成的聚醚多元醇的软链段残基， ，其中n + m的总值在2〜70的范围内，m /（n + m）在0.05〜0.98的范围内，残基（1）和（2）的结构如下：聚醚 多元醇的特征还在于至少95％的羟基是伯羟基。